JP6805821B2 - 伸縮性樹脂層形成用樹脂組成物 - Google Patents
伸縮性樹脂層形成用樹脂組成物 Download PDFInfo
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- JP6805821B2 JP6805821B2 JP2016255819A JP2016255819A JP6805821B2 JP 6805821 B2 JP6805821 B2 JP 6805821B2 JP 2016255819 A JP2016255819 A JP 2016255819A JP 2016255819 A JP2016255819 A JP 2016255819A JP 6805821 B2 JP6805821 B2 JP 6805821B2
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Description
まず、図3に示すように、伸縮性基板1の上に回路部品2を実装する。1種類の回路部品2が実装されていてもよく、2種類以上の回路部品2が混在して実装されていてもよい。また、回路部品2は、1個が実装されていてもよく、複数個が実装されていてもよい。
次に、伸縮性基板1及び回路部品2を封止部材としての樹脂組成物又は樹脂フィルムで封止する。伸縮性基板1及び回路部品2は、例えば、樹脂フィルムを伸縮性基板1に積層すること、樹脂組成物を伸縮性基板1に印刷すること、又は、樹脂組成物に伸縮性基板1を浸漬し、乾燥することにより封止することができる。封止は、加熱プレス、ロールラミネート、真空ラミネート、印刷法又はディッピング法等によって行うことができる。この中でも、Roll to Rollのプロセスで使用できるものが製造工程を短縮できる点から好ましい。
封止工程において伸縮性基板1及び回路部品2を樹脂組成物又は樹脂フィルムで封止した後、これらを硬化させることにより伸縮性樹脂層3を形成し、伸縮性樹脂層3を有する回路基板を得る。これにより、図1に示される半導体装置100が得られる。硬化としては、加熱による熱硬化、又は、露光による光硬化を行うことができる。回路部品2の耐熱性の観点から、熱硬化であれば低温で硬化する樹脂組成物が好ましい。また、室温で硬化できる観点から、光硬化する樹脂組成物が好ましい。
半導体装置の製造方法は、必要に応じて、例えば、図4に示すように、回路基板を切断し分離することにより、回路部品を有する複数の半導体装置を得る工程を備えることができる。これにより、複数の半導体装置を一度に大面積で製造することが可能となり、製造工程を減らすことが容易となる。
[樹脂ワニスAS1の調合]
(A)成分として水素添加型スチレンブタジエンゴム(スチレン系エラストマ、JSR(株)「ダイナロン2324P」)80質量部、(B)成分としてジオキサングリコールジアクリレート(日本化薬(株)製「カヤラドR−604」)20質量部、重合開始剤としてビス(2,4,6−トリメチルベンゾイル)フェニルホスフィンオキシド(BASF社製「イルガキュア819」)1.5質量部、及び溶剤としてトルエン125質量部を攪拌しながら混合し樹脂ワニスAS1を得た。
基材フィルムとして表面離型処理PETフィルム(帝人デュポンフィルム(株)製「ピューレックスA31」、厚み38μm)を準備した。このPETフィルムの離型処理面上にナイフコータ((株)康井精機製「SNC−350」)を用いて樹脂ワニスAS1を塗布した。次いで乾燥機((株)二葉科学製「MSO−80TPS」)中100℃で20分乾燥して、樹脂フィルムを形成させた。形成された樹脂フィルムに、基材フィルムと同じ表面離型処理PETフィルムを、離型処理面が樹脂フィルム側になる向きで保護フィルムとして貼付けて、積層フィルムSS1を得た。樹脂フィルムの厚みは、塗工機のギャップを調節することで任意に調整可能である。本実施例では乾燥後の樹脂フィルムの膜厚が100μmとなるように調節した。
実施例1と同様の方法で、表1に示す配合比に従って樹脂ワニスAS2〜AS8を調合し、積層フィルムSS2〜SS8を作製した。
各樹脂フィルムに、紫外線露光機(ミカサ(株)「ML−320FSAT」)によって紫外線(波長365nm)を2000mJ/cm2照射した。次いで、長さ70mm、幅20mmの積層フィルムを切り出し、保護フィルムを除去して、伸縮性樹脂層の測定用サンプルを得た。測定用サンプルのタックを、タッキング試験機((株)レスカ製「TACII」)を用いて測定した。なお、測定条件は定荷重モードで、浸没速度が120mm/min、テスト速度が600mm/min、荷重が100gf、荷重保持時間が1s、温度が30℃の条件とした。そして、比較例1におけるタックを基準として、各実施例及び比較例のタック(倍率)を算出した。
各樹脂フィルムに、紫外線露光機(ミカサ(株)「ML−320FSAT」)によって紫外線(波長365nm)を2000mJ/cm2照射した。その後、基材フィルムを除去して、伸縮性樹脂層を形成させた。次いで、長さ40mm、幅10mmの積層フィルムを切り出し、保護フィルムを除去して、伸縮性樹脂層の測定用サンプルを得た。測定用サンプルの応力−ひずみ曲線を、オートグラフ((株)島津製作所「EZ−S」)を用いて測定し、その応力−ひずみ曲線から弾性率及び伸び率を求めた。測定時のチャック間距離は20mm、引っ張り速度は50mm/minとした。なおここでは、弾性率として荷重0.5から1.0Nにおける値を、伸び率としてサンプルが破断した際の値(破断伸び率)を測定した。
各樹脂フィルムに、紫外線露光機(ミカサ(株)「ML−320FSAT」)によって紫外線(波長365nm)を2000mJ/cm2照射した。その後、基材フィルムを除去して、伸縮性樹脂層を形成させた。次いで、長さ70mm、幅5mmの積層フィルムを切り出し、保護フィルムを除去して、測定用サンプルを得た。測定用サンプルの回復率を、マイクロフォース試験機(IllinoisTool Works Inc「Instron 5948」)を用いて測定した。
1)水素添加型スチレンブタジエンラバー、JSR(株)「ダイナロン2324P、重量平均分子量:1.0×105
2)ジオキサングリコールジアクリレート(日本化薬(株)「カヤラドR−604」)
3)カプロラクトン変性ヒドロキシピバリン酸ネオペンチルグリコールエステルジアクリレート(日本化薬(株)「カヤラドHX−220」)
4)トリシクロデカンジメタノールジアクリレート(新中村化学(株)「A−DCP」)
5)式(VII)で表される化合物(東邦化学工業(株)「PD−070A」)
6)グリセリルプロポキシトリアクリレート(日本化薬(株)「カヤラドGPO−303」)
7)ジトリメチロールプロパンテトラアクリレート(東亜合成(株)「アロニックスM−408」)
8)ノナンジオールジアクリレート(日立化成(株)「ファンクリルFA−129AS」)
9)ビス(2,4,6−トリメチルベンゾイル)フェニルホスフィンオキシド(BASFジャパン(株)「イルガキュア819」)
10)比較例1を基準として算出する。
Claims (2)
- (A)スチレン系エラストマ及び(B)重合性化合物を含有し、
(B)重合性化合物が、下記式(I)で表される化合物を含む、伸縮性樹脂層形成用樹脂組成物であって、
式(I)で表される化合物が、下記式(III)で表される化合物、式(IV)で表される化合物、下記式(V)で表される化合物、式(VI)で表される化合物及び式(VII)で表される化合物からなる群より選ばれる少なくとも1種である、伸縮性樹脂層形成用樹脂組成物。
[式(I)中、Rは、10以上の炭素原子及び2以上の酸素原子を含有する基を表し、Raは、それぞれ独立に水素原子又はメチル基を表す。]
[式(VI)中、l、m及びnは正の数を示し、l+m+n=3.6である。]
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