JP7439815B2 - 配線基板及びその製造方法 - Google Patents
配線基板及びその製造方法 Download PDFInfo
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- JP7439815B2 JP7439815B2 JP2021205886A JP2021205886A JP7439815B2 JP 7439815 B2 JP7439815 B2 JP 7439815B2 JP 2021205886 A JP2021205886 A JP 2021205886A JP 2021205886 A JP2021205886 A JP 2021205886A JP 7439815 B2 JP7439815 B2 JP 7439815B2
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- acrylate
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- 239000007822 coupling agent Substances 0.000 claims description 37
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- 238000000034 method Methods 0.000 claims description 17
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- 229910052751 metal Inorganic materials 0.000 claims description 14
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- 239000002184 metal Substances 0.000 claims description 11
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- 125000003277 amino group Chemical group 0.000 claims description 9
- 238000004132 cross linking Methods 0.000 claims description 9
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- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 5
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- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 4
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- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
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- 239000004698 Polyethylene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
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- VYGUBTIWNBFFMQ-UHFFFAOYSA-N [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O Chemical class [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O VYGUBTIWNBFFMQ-UHFFFAOYSA-N 0.000 description 3
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- LHMRXAIRPKSGDE-UHFFFAOYSA-N benzo[a]anthracene-7,12-dione Chemical compound C1=CC2=CC=CC=C2C2=C1C(=O)C1=CC=CC=C1C2=O LHMRXAIRPKSGDE-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 150000004651 carbonic acid esters Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
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- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
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- 150000002148 esters Chemical class 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
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- 125000002541 furyl group Chemical group 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
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- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
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- 229910001026 inconel Inorganic materials 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- MMCOUVMKNAHQOY-UHFFFAOYSA-L oxido carbonate Chemical compound [O-]OC([O-])=O MMCOUVMKNAHQOY-UHFFFAOYSA-L 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000004978 peroxycarbonates Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
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- 238000009774 resonance method Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- JPPLPDOXWBVPCW-UHFFFAOYSA-N s-(3-triethoxysilylpropyl) octanethioate Chemical compound CCCCCCCC(=O)SCCC[Si](OCC)(OCC)OCC JPPLPDOXWBVPCW-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
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Images
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
伸縮性樹脂層形成用のワニスとして、以下の樹脂ワニスA~Fを調製した。
(A)成分としての水添型スチレンブタジエンゴム(旭化成(株)製、タフテックP1500、商品名)30gと、カップリング剤としての3-ウレイドプロピルトリエトキシシラン(モメンティブ・パフォーマンス・マテリアルズ・ジャパン製、A-1160、商品名)0.3gと、溶剤としてのトルエン70gとを攪拌しながら混合し樹脂ワニスAを得た。
(A)成分としての水添型スチレンブタジエンゴム(JSR(株)製、ダイナロン2324P、商品名)20gと、(B)成分としてのブタンジオールジアクリレート(日立化成(株)製、ファンクリルFA-124AS、商品名)5gと、(C)成分としてのビス(2,4,6-トリメチルベンゾイル)フェニルホスフィンオキシド(BASF(株)製、イルガキュア819、商品名)0.4gと、カップリング剤としての3-アミノプロピルトリエトキシシラン(信越シリコーン(株)製、KBE-903、商品名)0.25gと、溶剤としてのトルエン15gとを撹拌しながら混合し、樹脂ワニスBを得た。
(A)成分としての水添型スチレンブタジエンゴム(JSR(株)製、ダイナロン2324P、商品名)20gと、(B)成分としてのノナンジオールジアクリレート(日立化成(株)製、ファンクリルFA-129AS、商品名)5gと、(C)成分としてのビス(2,4,6-トリメチルベンゾイル)フェニルホスフィンオキシド(BASF(株)製、イルガキュア819、商品名)0.4gと、カップリング剤としての3-イソシアネートプロピルトリメトキシシラン(モメンティブ・パフォーマンス・マテリアルズ・ジャパン製、Y-5187、商品名)0.25gと、溶剤としてのトルエン15gとを撹拌しながら混合し、樹脂ワニスCを得た。
(A)成分としての水添型スチレンブタジエンゴム(JSR(株)製、ダイナロン2324P、商品名)20gと、(B)成分としてのノナンジオールジアクリレート(日立化成(株)製、ファンクリルFA-129AS、商品名)5gと、(C)成分としてのビス(2,4,6-トリメチルベンゾイル)フェニルホスフィンオキシド(BASF(株)製、イルガキュア819、商品名)0.4gと、カップリング剤としての3-トリメトキシシリルプロピルコハク酸無水物(信越シリコーン(株)製、X-12-967C、商品名)0.25gと、溶剤としてのトルエン15gとを撹拌しながら混合し、樹脂ワニスDを得た。
(A)成分としてのアクリルポリマ((株)クラレ製、クラリティLA2140、商品名)20gと、(B)成分としての脂肪鎖変性エポキシ樹脂(DIC(株)製、EXA4816、商品名)5gと、(C)成分としての2-フェニルイミダゾール(四国化成(株)製、2PZ、商品名)0.5gと、カップリング剤としての3-メタクリロキシプロピルトリメトキシシラン(KBM-503、商品名)0.3gと、溶剤としてのメチルエチルケトン15gとを撹拌しながら混合し、樹脂ワニスEを得た。
(A)成分としての水添型スチレンブタジエンゴム(JSR(株)製、ダイナロン2324P、商品名)20gと、(B)成分としてのノナンジオールジアクリレート(日立化成(株)製、ファンクリルFA-129AS、商品名)5gと、(C)成分としてのビス(2,4,6-トリメチルベンゾイル)フェニルホスフィンオキシド(BASF(株)製、イルガキュア819、商品名)0.4gと、溶剤としてのトルエン15gとを撹拌しながら混合し、樹脂ワニスFを得た。
実施例1
[伸縮性樹脂層を有する積層フィルム]
キャリアフィルムとして離型処理ポリエチレンテレフタレート(PET)フィルム(帝人デュポンフィルム(株)製「ピューレックスA31」、厚み25μm)を準備した。このPETフィルムの離型処理面上にナイフコータ((株)康井精機製「SNC-350」を用いて樹脂ワニスAを塗布した。塗膜を乾燥機((株)二葉科学製「MSO-80TPS」)中100℃で20分乾燥して、塗工後の厚みが100μmである伸縮性樹脂層を形成させた。形成された伸縮性樹脂層に、キャリアフィルムと同じ離型処理PETフィルムを、離型処理面が伸縮性樹脂層側になる向きで保護フィルムとして貼付けて、積層フィルムAを得た。
[導体層付積層板]
積層フィルムAの保護フィルムを剥離し、銅箔(日本電解(株)製、YGP-12、商品名)の粗化面側に積層フィルムAの伸縮性樹脂層を重ねた。真空加圧式ラミネータ(ニチゴー・モートン(株)「V130」)を用いて、圧力0.5MPa、温度90℃及び加圧時間60秒の条件で圧着して、導体層付積層板を作製した。
樹脂ワニスAを樹脂ワニスBに変更したこと以外は実施例1と同様にして、銅箔及び未硬化の樹脂層を有する積層体を得た。その後、紫外線露光機(ミカサ(株)「ML-320FSAT」)によって紫外線(波長365nm)を2000mJ/cm2照射することで樹脂層を硬化させて、導体層付積層板を得た。
樹脂ワニスBを樹脂ワニスCに変更したこと以外は、実施例2と同様にして、導体層付積層板を得た。
樹脂ワニスBを樹脂ワニスDに変更したこと以外は、実施例2と同様にして、導体層付積層板を得た。
樹脂ワニスAを樹脂ワニスEに変更したこと以外は実施例1と同様にして、銅箔及び未硬化の樹脂層を有する積層体を得た。その後、乾燥機を用いて180℃1時間の条件で樹脂層を硬化させて、導体層付積層板を得た。
樹脂ワニスBを樹脂ワニスFに変更したこと以外は、実施例2と同様にして、導体層付積層板を得た。
各導体層付積層板の導体層上に、幅10mm、長さ100mmの部分を形成した。この一端を、導体層(回路層)及び伸縮性樹脂層の界面で剥がした後、つかみ具でつかみ、垂直方向に引き剥がした時の荷重を測定した。測定は、島津製作所(株)製オートグラフEZ-Testを使用して、室温中で、引張り速度約50mm/分の条件で実施した。評価結果を表1に示す。
実施例1~5及び比較例1で作製した導体層付積層板の導体層を過硫酸アンモニウム水溶液により全面エッチングした。その後,伸縮性樹脂層を20%まで引張変形した後の回復率(%)を測定した。測定は、Illinois Tool Works Inc製マイクロフォース試験機Instron 5948を使用して、室温で実施した。評価結果を表1に示す。
Claims (11)
- カップリング剤を含有する伸縮性樹脂層と、
前記伸縮性樹脂層上に設けられ、配線パターンを形成している導体箔と、
を有し、
前記カップリング剤がシランカップリング剤であり、
前記カップリング剤が、(メタ)アクリル基、ビニル基、エポキシ基、アミノ基、ウレイド基、メルカプト基、スルフィド基、イソシアヌレート基、イソシアネート基及び酸無水物基からなる群より選ばれる少なくとも1種の官能基を有し、
前記カップリング剤の含有量が、前記伸縮性樹脂層の全質量を基準として、0.2~10質量%であり、
前記伸縮性樹脂層が、(A)ゴム成分を含有し、
前記ゴム成分が、アクリルゴム、イソプレンゴム、ブチルゴム、スチレンブタジエンゴム、ブタジエンゴム、アクリロニトリルブタジエンゴム、クロロプレンゴム、エチレンプロピレンゴム、フッ素ゴム、硫化ゴム、エピクロルヒドリンゴム、及び塩素化ブチルゴムからなる群より選ばれる少なくとも1種を含み、
前記導体箔が金属箔である、配線基板。 - 前記カップリング剤が、(メタ)アクリル基、アミノ基、ウレイド基、及び酸無水物基からなる群より選ばれる少なくとも1種の官能基を有する、請求項1に記載の配線基板。
- 前記伸縮性樹脂層を歪み20%まで引張変形した後の回復率が80%以上である、請求項1又は2に記載の配線基板。
- 前記ゴム成分の含有量が、前記伸縮性樹脂層の全質量に対して30質量%以上である、請求項1~3のいずれか一項に記載の配線基板。
- 前記伸縮性樹脂層が、(B)架橋成分の架橋重合体を更に含有する、請求項1~4のいずれか一項に記載の配線基板。
- 前記架橋重合体の含有量が、前記伸縮性樹脂層の全質量を基準として、10~50質量%である、請求項5に記載の配線基板。
- 前記架橋成分が、(メタ)アクリル基、ビニル基、エポキシ基、スチリル基、アミノ基、イソシアヌレート基、ウレイド基、シアネート基、イソシアネート基、及びメルカプト基からなる群より選ばれる少なくとも1種の反応性基を有する化合物である、請求項5に記載の配線基板。
- 前記架橋成分が、エポキシ基及び/又は2つ以上の(メタ)アクリル基を有する化合物である、請求項5~7のいずれか一項に記載の配線基板。
- 請求項1~8のいずれか一項に記載の配線基板と、前記配線基板に搭載された電子素子と、を備えるストレッチャブルデバイス。
- カップリング剤を含有する伸縮性樹脂層と、前記伸縮性樹脂層上に設けられた導体箔と、を有し、前記カップリング剤がシランカップリング剤であり、前記カップリング剤が、(メタ)アクリル基、ビニル基、エポキシ基、アミノ基、ウレイド基、メルカプト基、スルフィド基、イソシアヌレート基、イソシアネート基及び酸無水物基からなる群より選ばれる少なくとも1種の官能基を有し、前記カップリング剤の含有量が、前記伸縮性樹脂層の全質量を基準として、0.2~10質量%であり、前記伸縮性樹脂層が、(A)ゴム成分を含有し、前記ゴム成分が、アクリルゴム、イソプレンゴム、ブチルゴム、スチレンブタジエンゴム、ブタジエンゴム、アクリロニトリルブタジエンゴム、クロロプレンゴム、エチレンプロピレンゴム、フッ素ゴム、硫化ゴム、エピクロルヒドリンゴム、及び塩素化ブチルゴムからなる群より選ばれる少なくとも1種を含み、前記導体箔が金属箔であり、請求項1~8のいずれか一項に記載の配線基板を形成するために用いられる、配線基板形成用積層板。
- カップリング剤を含有する伸縮性樹脂層と前記伸縮性樹脂層上に積層された導体箔とを有する積層板を準備する工程と、
前記導体箔上にエッチングレジストを形成する工程と、
前記エッチングレジストを露光し、露光後の前記エッチングレジストを現像して、前記導体箔の一部を覆うレジストパターンを形成する工程と、
前記レジストパターンによって覆われていない部分の前記導体箔を除去する工程と、
前記レジストパターンを除去する工程と、
を含み、
前記カップリング剤がシランカップリング剤であり、
前記カップリング剤が、(メタ)アクリル基、ビニル基、エポキシ基、アミノ基、ウレイド基、メルカプト基、スルフィド基、イソシアヌレート基、イソシアネート基及び酸無水物基からなる群より選ばれる少なくとも1種の官能基を有し、
前記カップリング剤の含有量が、前記伸縮性樹脂層の全質量を基準として、0.2~10質量%であり、
前記伸縮性樹脂層が、(A)ゴム成分を含有し、
前記ゴム成分が、アクリルゴム、イソプレンゴム、ブチルゴム、スチレンブタジエンゴム、ブタジエンゴム、アクリロニトリルブタジエンゴム、クロロプレンゴム、エチレンプロピレンゴム、フッ素ゴム、硫化ゴム、エピクロルヒドリンゴム、及び塩素化ブチルゴムからなる群より選ばれる少なくとも1種を含み、前記導体箔が金属箔である、請求項1~8のいずれか一項に記載の配線基板を製造する方法。
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