JP6996087B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP6996087B2 JP6996087B2 JP2017031175A JP2017031175A JP6996087B2 JP 6996087 B2 JP6996087 B2 JP 6996087B2 JP 2017031175 A JP2017031175 A JP 2017031175A JP 2017031175 A JP2017031175 A JP 2017031175A JP 6996087 B2 JP6996087 B2 JP 6996087B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- mounting
- coil
- recess
- outer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 claims description 223
- 238000000926 separation method Methods 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 description 28
- 239000000470 constituent Substances 0.000 description 12
- 230000002950 deficient Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 239000000696 magnetic material Substances 0.000 description 6
- 230000000295 complement effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052702 rhenium Inorganic materials 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 229910009369 Zn Mg Inorganic materials 0.000 description 1
- 229910007573 Zn-Mg Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000006112 glass ceramic composition Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Description
Claims (5)
- 第一凹部が設けられた素体と、
前記第一凹部内に配置された第一導体部分を有する実装用導体と、を備え、
前記第一導体部分は、前記第一凹部の底面と対向する第一面と、前記第一面と対向する第二面と、前記第一面と前記第二面とを接続する第三面と、を有し、
前記第一凹部の底面及び前記第一面の対向方向から見て、前記第三面は前記第二面と重なる領域を有し、
前記領域は、前記素体の内側に向かって凸状となるように全体的に湾曲し、
前記第一面は、前記領域を規定する第一外縁を有し、
前記第二面は、前記領域を規定する第二外縁を有し、
前記対向方向における前記第一外縁と前記第二外縁との離間距離をa、前記対向方向及び前記第一外縁に直交する方向における前記第一外縁と前記第二外縁との離間距離をbとしたとき、0.75a≦b≦2aなる関係を満たす、電子部品。 - 前記素体は、実装面を有し、
前記第一凹部は、実装面に設けられている、請求項1に記載の電子部品。 - 前記素体は、前記実装面から連続すると共に、第二凹部が設けられた端面を更に有し、
前記第二凹部は、前記第一凹部と一体的に設けられ、
前記実装用導体は、前記第二凹部内に配置された第二導体部分を更に有すると共に、断面L字状を呈している、請求項2に記載の電子部品。 - 前記第二導体部分は、前記第二凹部の底面と対向する第四面と、前記第四面と対向する第五面と、前記第四面と前記第五面とを接続する第六面と、を有し、
前記第二凹部の底面及び前記第四面の対向方向から見て、前記第六面は前記第五面と重なる領域を有している、請求項3に記載の電子部品。 - 前記素体内でコイルを構成するコイル導体を更に備え、
前記実装用導体は、実装用導体層が積層されてなり、
前記コイルのコイル軸は、前記実装用導体層の積層方向に沿って設けられている、請求項3又は4に記載の電子部品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017031175A JP6996087B2 (ja) | 2017-02-22 | 2017-02-22 | 電子部品 |
US15/892,784 US11139112B2 (en) | 2017-02-22 | 2018-02-09 | Electronic component |
CN201810145501.7A CN108461251B (zh) | 2017-02-22 | 2018-02-12 | 电子部件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017031175A JP6996087B2 (ja) | 2017-02-22 | 2017-02-22 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018137351A JP2018137351A (ja) | 2018-08-30 |
JP6996087B2 true JP6996087B2 (ja) | 2022-01-17 |
Family
ID=63167362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017031175A Active JP6996087B2 (ja) | 2017-02-22 | 2017-02-22 | 電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11139112B2 (ja) |
JP (1) | JP6996087B2 (ja) |
CN (1) | CN108461251B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7205109B2 (ja) * | 2018-08-21 | 2023-01-17 | Tdk株式会社 | 電子部品 |
JP2021170084A (ja) * | 2020-04-16 | 2021-10-28 | Tdk株式会社 | 感光性導体ペースト、積層電子部品およびその製造方法 |
JP7294300B2 (ja) * | 2020-10-28 | 2023-06-20 | 株式会社村田製作所 | インダクタ部品及びインダクタ部品実装基板 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004200602A (ja) | 2002-12-20 | 2004-07-15 | Murata Mfg Co Ltd | セラミック電子部品およびその製造方法 |
JP2008147540A (ja) | 2006-12-13 | 2008-06-26 | Matsushita Electric Ind Co Ltd | 電子部品 |
JP2013038392A (ja) | 2011-07-11 | 2013-02-21 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
WO2014136843A1 (ja) | 2013-03-07 | 2014-09-12 | 株式会社村田製作所 | 電子部品 |
JP2014175383A (ja) | 2013-03-07 | 2014-09-22 | Murata Mfg Co Ltd | 電子部品 |
KR101670184B1 (ko) | 2015-08-24 | 2016-10-27 | 삼성전기주식회사 | 적층 전자부품 및 그 제조방법 |
JP2017073536A (ja) | 2015-10-07 | 2017-04-13 | 株式会社村田製作所 | 積層インダクタ |
US20170110236A1 (en) | 2015-10-19 | 2017-04-20 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component and method of manufacturing the same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750838U (ja) * | 1980-09-08 | 1982-03-24 | ||
JP4816971B2 (ja) | 2006-01-16 | 2011-11-16 | 株式会社村田製作所 | インダクタの製造方法 |
KR101983146B1 (ko) * | 2013-08-14 | 2019-05-28 | 삼성전기주식회사 | 칩 전자부품 |
JP6398857B2 (ja) * | 2015-04-27 | 2018-10-03 | 株式会社村田製作所 | 電子部品及びその製造方法 |
JP6544080B2 (ja) * | 2015-06-30 | 2019-07-17 | 株式会社村田製作所 | コイル部品 |
US10269482B2 (en) | 2015-10-07 | 2019-04-23 | Murata Manufacturing Co., Ltd. | Lamination inductor |
JP6436126B2 (ja) * | 2016-04-05 | 2018-12-12 | 株式会社村田製作所 | 電子部品及び電子部品の製造方法 |
US10580559B2 (en) * | 2016-07-07 | 2020-03-03 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
US10923259B2 (en) * | 2016-07-07 | 2021-02-16 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
-
2017
- 2017-02-22 JP JP2017031175A patent/JP6996087B2/ja active Active
-
2018
- 2018-02-09 US US15/892,784 patent/US11139112B2/en active Active
- 2018-02-12 CN CN201810145501.7A patent/CN108461251B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004200602A (ja) | 2002-12-20 | 2004-07-15 | Murata Mfg Co Ltd | セラミック電子部品およびその製造方法 |
JP2008147540A (ja) | 2006-12-13 | 2008-06-26 | Matsushita Electric Ind Co Ltd | 電子部品 |
JP2013038392A (ja) | 2011-07-11 | 2013-02-21 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
WO2014136843A1 (ja) | 2013-03-07 | 2014-09-12 | 株式会社村田製作所 | 電子部品 |
JP2014175383A (ja) | 2013-03-07 | 2014-09-22 | Murata Mfg Co Ltd | 電子部品 |
KR101670184B1 (ko) | 2015-08-24 | 2016-10-27 | 삼성전기주식회사 | 적층 전자부품 및 그 제조방법 |
JP2017073536A (ja) | 2015-10-07 | 2017-04-13 | 株式会社村田製作所 | 積層インダクタ |
US20170110236A1 (en) | 2015-10-19 | 2017-04-20 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JP2018137351A (ja) | 2018-08-30 |
CN108461251A (zh) | 2018-08-28 |
US11139112B2 (en) | 2021-10-05 |
CN108461251B (zh) | 2020-10-09 |
US20180240591A1 (en) | 2018-08-23 |
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