JP6975463B2 - 金属表面上のエッチレジストパターンの製造方法 - Google Patents
金属表面上のエッチレジストパターンの製造方法 Download PDFInfo
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- JP6975463B2 JP6975463B2 JP2018507595A JP2018507595A JP6975463B2 JP 6975463 B2 JP6975463 B2 JP 6975463B2 JP 2018507595 A JP2018507595 A JP 2018507595A JP 2018507595 A JP2018507595 A JP 2018507595A JP 6975463 B2 JP6975463 B2 JP 6975463B2
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- 238000000034 method Methods 0.000 title claims description 73
- 229910052751 metal Inorganic materials 0.000 title claims description 61
- 239000002184 metal Substances 0.000 title claims description 61
- 238000004519 manufacturing process Methods 0.000 title description 10
- 239000000203 mixture Substances 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 230000003213 activating effect Effects 0.000 claims description 10
- 239000007864 aqueous solution Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000007641 inkjet printing Methods 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 8
- 239000012190 activator Substances 0.000 claims description 7
- 150000001879 copper Chemical class 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- 125000000129 anionic group Chemical group 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 229910019142 PO4 Inorganic materials 0.000 claims description 4
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 claims description 4
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 4
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 4
- 229960002218 sodium chlorite Drugs 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- 239000003999 initiator Substances 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 239000000976 ink Substances 0.000 description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 34
- 229910052802 copper Inorganic materials 0.000 description 31
- 239000010949 copper Substances 0.000 description 31
- 239000000243 solution Substances 0.000 description 30
- 239000007788 liquid Substances 0.000 description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 230000001476 alcoholic effect Effects 0.000 description 2
- -1 anionic anion Chemical class 0.000 description 2
- 229920006318 anionic polymer Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000003100 immobilizing effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229920005792 styrene-acrylic resin Polymers 0.000 description 2
- 150000003871 sulfonates Chemical class 0.000 description 2
- NJVOHKFLBKQLIZ-UHFFFAOYSA-N (2-ethenylphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1C=C NJVOHKFLBKQLIZ-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021577 Iron(II) chloride Inorganic materials 0.000 description 1
- 229920005692 JONCRYL® Polymers 0.000 description 1
- 239000004909 Moisturizer Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000001333 moisturizer Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920013730 reactive polymer Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/92—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof prepared from printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0058—Digital printing on surfaces other than ordinary paper on metals and oxidised metal surfaces
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
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- Chemical Kinetics & Catalysis (AREA)
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Description
処理した銅板の上に液体組成物を印刷し、80℃で乾燥させて不溶性エッチレジストマスクを製造した。エッチレジストパターンは、図2Bに示されているように、鋭いエッジを有し、ライン切れがなく、50μmまでの細い線幅を有し、明確に画定された薄いラインを有する高い印刷品質を示していた。露出した銅のエッチングおよびエッチレジストマスクの除去を、実施例1に詳述したように行った。板上の配線パターンは、鋭いエッジを有し、ライン切れがなく、50μmまでの細い線幅を有し、明確に画定された細いラインを示していた。
処理した銅板の上に液体組成物を印刷し、80℃で乾燥させて不溶性エッチレジストマスクを製造した。エッチレジストパターンは、鋭いエッジを有し、ライン切れがなく、50μmまでの細い線幅を有し、明確に画定された薄いラインを有する高い印刷品質を示していた。露出した銅のエッチングおよびエッチレジストマスクの除去を、実施例1に詳述したように行った。板上の配線パターンは、鋭いエッジを有し、ライン切れがなく、30μmまでの細い線幅を有し、明確に画定された細いラインを示していた。
本発明は、例えば、以下を提供する:
(項目1)
基板上に金属パターンを形成する方法であって、
金属表面を化学的に活性化させる活性化剤を有する化学的表面活性化溶液を前記基板に結合された前記金属表面上に適用するステップと、
活性化された前記金属表面上にエッチレジストインクをノンインパクト印刷して、所定のパターンに従ってエッチレジストマスクを生成するステップであって、前記エッチレジストインク中の少なくとも1つのインク成分が、活性化された前記金属表面と化学反応を起こして前記エッチレジストインクの液滴を固定化する、該ステップと、
前記エッチレジストマスクで覆われていない非マスクの金属部分を除去するエッチングプロセスを行うステップと、
前記エッチレジストマスクを除去するステップとを含むことを特徴とする方法。
(項目2)
項目1に記載の方法であって、
前記金属パターンは、50μm未満の幅を有する金属線を含むことを特徴とする方法。
(項目3)
項目1に記載の方法であって、
前記エッチレジストマスクは、50μm未満の幅を有する線を含むことを特徴とする方法。
(項目4)
項目1に記載の方法であって、
前記金属パターンは、30μm未満の幅を有する金属線を含むことを特徴とする方法。
(項目5)
項目1に記載の方法であって、
前記エッチレジストマスクは、30μm未満の幅を有する線を含むことを特徴とする方法。
(項目6)
項目1に記載の方法であって、
印刷する前に、溶媒を用いて前記金属表面から前記化学的表面活性化溶液を除去するステップをさらに含むことを特徴とする方法。
(項目7)
項目1に記載の方法であって、
前記化学反応を起こす前記インク成分はアニオン成分であることを特徴とする方法。
(項目8)
項目1に記載の方法であって、
活性化された前記金属表面との化学反応を起こす前記インク成分は、アクリレート、ホスフェート、スルホネートまたはそれらの混合物から選択されるポリマー成分であることを特徴とする方法。
(項目9)
項目1に記載の方法であって、
前記活性化剤は、銅塩、第二鉄塩、クロム硫酸、過硫酸塩、亜塩素酸ナトリウムおよび過酸化水素の少なくとも1つまたはそれらの混合物を含むことを特徴とする方法。
(項目10)
項目1に記載の方法であって、
前記適用するステップは、約10〜60秒間、前記化学的表面活性化溶液を含む槽に前記金属表面を浸漬するステップを含むことを特徴とする方法。
(項目11)
項目1に記載の方法であって、
前記適用するステップは、前記化学的表面活性化溶液を前記金属表面の上にスプレーするステップを含むことを特徴とする方法。
(項目12)
項目1に記載の方法であって、
前記ノンインパクト印刷が、インクジェット印刷を含むことを特徴とする方法。
Claims (12)
- 基板上に金属パターンを形成する方法であって、
無機活性化剤を含む化学的表面活性化水溶液を、前記基板に結合された金属層の表面上に適用するステップであって、前記無機活性化剤は、前記金属層を化学的に活性化させて、前記金属層の表面に金属のイオンを形成するステップと、
前記金属層を化学的に活性化させた後に、前記金属層の表面上に反応性成分を含みかつ開始剤を含まないインクをノンインパクト印刷して、所定のパターンに従ってエッチレジストマスクを生成するステップであって、前記インクの液滴が前記金属層の表面に当たるときに、前記反応性成分が、前記金属層と化学反応を起こして前記インクの液滴を固定化するステップと、
前記金属層の、前記エッチレジストマスクで覆われていない部分を除去するエッチングプロセスを行うステップと、
前記エッチレジストマスクを除去して、前記金属パターンを形成するステップと、
を含むことを特徴とする方法。 - 請求項1に記載の方法であって、
前記エッチングプロセスを行うステップによって形成される前記金属パターンは、50μm未満の幅を有する複数の金属線を含むことを特徴とする方法。 - 請求項1に記載の方法であって、
前記ノンインパクト印刷から生成される前記エッチレジストマスクは、50μm未満の幅を有する複数の線を含むことを特徴とする方法。 - 請求項1に記載の方法であって、
前記エッチングプロセスを行うステップによって形成される前記金属パターンは、30μm未満の幅を有する複数の金属線を含むことを特徴とする方法。 - 請求項1に記載の方法であって、
前記ノンインパクト印刷から生成される前記エッチレジストマスクは、30μm未満の幅を有する複数の線を含むことを特徴とする方法。 - 請求項1に記載の方法であって、
印刷する前に、溶媒を用いて、前記金属層の活性化された前記表面から前記化学的表面活性化水溶液を除去するステップをさらに含むことを特徴とする方法。 - 請求項1に記載の方法であって、
前記金属層の活性化された前記表面との化学反応を起こす前記反応性成分は、アニオン成分であることを特徴とする方法。 - 請求項1に記載の方法であって、
前記金属層の活性化された前記表面との化学反応を起こす前記反応性成分は、アクリレート、ホスフェート、スルホネートまたはそれらの任意の組み合わせを含むポリマー成分であることを特徴とする方法。 - 請求項1に記載の方法であって、
前記無機活性化剤は、銅塩、第二鉄塩、クロム硫酸、過硫酸塩、亜塩素酸ナトリウムおよび過酸化水素の少なくとも1つまたはそれらの混合物を含むことを特徴とする方法。 - 請求項1に記載の方法であって、
前記化学的表面活性化水溶液を適用するステップは、約10〜約60秒間、前記化学的表面活性化水溶液を含む槽に前記金属層の表面を浸漬するステップを含むことを特徴とする方法。 - 請求項1に記載の方法であって、
前記化学的表面活性化水溶液を適用するステップは、前記化学的表面活性化水溶液を前記金属層の表面にスプレーするステップを含むことを特徴とする方法。 - 請求項1に記載の方法であって、
前記金属層の活性化された前記表面上に前記インクをノンインパクト印刷するステップが、インクジェット印刷を含むことを特徴とする方法。
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240014607A (ko) * | 2015-06-04 | 2024-02-01 | 카티바, 인크. | 금속 표면 상에서 에치 레지스트 패턴의 제조 방법 |
KR20240014578A (ko) | 2015-08-13 | 2024-02-01 | 카티바, 인크. | 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법 |
US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
JP6710402B2 (ja) * | 2017-10-23 | 2020-06-17 | メック株式会社 | 膜形成基材の製造方法及び表面処理剤 |
GB2583778B (en) * | 2019-03-29 | 2023-05-24 | Pierce Protocols Ltd | Glass etching preparation method and system |
WO2020250784A1 (ja) * | 2019-06-11 | 2020-12-17 | 三菱瓦斯化学株式会社 | 水性組成物、これを用いたステンレス鋼表面の粗化処理方法、ならびに粗化処理されたステンレス鋼およびその製造方法 |
CN110468413A (zh) * | 2019-09-10 | 2019-11-19 | 四会富仕电子科技股份有限公司 | 一种金属基表面粗化的方法 |
US11826775B2 (en) * | 2022-03-07 | 2023-11-28 | CatMarks Manufacturing, LLC | Automotive part identification marking system |
Family Cites Families (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4015706A (en) | 1971-11-15 | 1977-04-05 | Chemcut Corporation | Connecting modules for an etching system |
US4127438A (en) * | 1977-11-07 | 1978-11-28 | International Business Machines Corporation | Adhesion promoter for additively plated printed circuit boards |
DE3402883A1 (de) | 1984-01-27 | 1985-08-01 | Siemens AG, 1000 Berlin und 8000 München | Leiterplatten aus schichtpressstoffen |
CA1282272C (en) | 1985-06-07 | 1991-04-02 | Shigeru Danjo | Photocurable composition |
US4946711A (en) | 1987-10-14 | 1990-08-07 | Desoto, Inc. | Masking compositions and method for applying the same |
JP2585070B2 (ja) | 1988-08-02 | 1997-02-26 | 日本ペイント株式会社 | 画像形成方法 |
JPH06504628A (ja) | 1990-12-20 | 1994-05-26 | エクソン・ケミカル・パテンツ・インク | リソグラフィー及び腐食防止コーティング用途向けのuv/eb硬化性ブチルコポリマー |
GB9425031D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
DE69635203T2 (de) | 1995-07-11 | 2006-06-29 | Delphi Technologies, Inc., Troy | Beschichtungen und Verfahren, insbesondere für Leiterplatten |
DE69800652T2 (de) | 1997-02-25 | 2001-08-23 | Du Pont | Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten |
US6222136B1 (en) | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
IL129307A0 (en) * | 1999-04-04 | 2000-02-17 | Scitex Corp Ltd | Process for direct digital printing of circuit boards |
GB9916060D0 (en) * | 1999-07-08 | 1999-09-08 | Isis Innovation | Printed circuit fabrication |
WO2001008895A1 (fr) | 1999-07-30 | 2001-02-08 | Seiko Epson Corporation | Procede d'enregistrement comprenant des supports d'enregistrement et d'impression avec deux composes liquides |
US6399273B1 (en) | 1999-08-13 | 2002-06-04 | Board Of Regents, University Of Texas System | Water-processable photoresist compositions |
ATE268015T1 (de) | 2000-03-29 | 2004-06-15 | Univ Kanagawa | Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit |
DE10066028C2 (de) * | 2000-07-07 | 2003-04-24 | Atotech Deutschland Gmbh | Kupfersubstrat mit aufgerauhten Oberflächen |
JP3754303B2 (ja) | 2001-02-16 | 2006-03-08 | 株式会社日立インフォメーションテクノロジー | Sdramリフレッシュ回路 |
JP2003012971A (ja) | 2001-06-28 | 2003-01-15 | Konica Corp | インクジェット記録方法 |
EP1563119A4 (en) | 2001-08-31 | 2006-03-22 | Semitool Inc | APPARATUS AND METHOD FOR DISPERSING AN ELECTROPHORETIC EMULSION |
US20030177639A1 (en) * | 2002-03-19 | 2003-09-25 | Berg N. Edward | Process and apparatus for manufacturing printed circuit boards |
US6709962B2 (en) * | 2002-03-19 | 2004-03-23 | N. Edward Berg | Process for manufacturing printed circuit boards |
SG107593A1 (en) * | 2002-06-04 | 2004-12-29 | Agency Science Tech & Res | Method for electroless metalisation of polymer substrate |
GB0221891D0 (en) | 2002-09-20 | 2002-10-30 | Avecia Ltd | Process |
TWI291726B (en) | 2002-10-25 | 2007-12-21 | Nanya Technology Corp | Process for etching metal layer |
US7005241B2 (en) | 2003-06-09 | 2006-02-28 | Shinko Electric Industries Co., Ltd. | Process for making circuit board or lead frame |
JP2005033049A (ja) | 2003-07-08 | 2005-02-03 | Nec Toppan Circuit Solutions Inc | プリント配線板の配線パターン形成方法及びプリント配線板の製造方法 |
JP2005079479A (ja) | 2003-09-02 | 2005-03-24 | Asahi Kasei Electronics Co Ltd | レジスト直描用レジストインク |
US7477627B2 (en) | 2003-09-10 | 2009-01-13 | Intel Corporation | Method and device of adaptive control of data rate, fragmentation and request to send protection in wireless networks |
US20050067378A1 (en) * | 2003-09-30 | 2005-03-31 | Harry Fuerhaupter | Method for micro-roughening treatment of copper and mixed-metal circuitry |
JP4642771B2 (ja) | 2003-10-22 | 2011-03-02 | ネックス システムズ インコーポレイテッド | ワークピースを流体処理する方法及び装置 |
GB0324947D0 (en) | 2003-10-25 | 2003-11-26 | Avecia Ltd | Process |
KR100707236B1 (ko) | 2004-01-15 | 2007-04-13 | 마쯔시다덴기산교 가부시키가이샤 | 금속 패턴 및 그 제조 방법 |
CN1899003B (zh) | 2004-03-03 | 2010-12-29 | 揖斐电株式会社 | 蚀刻液、蚀刻方法以及印刷电路板 |
KR100585138B1 (ko) | 2004-04-08 | 2006-05-30 | 삼성전자주식회사 | 반도체 소자 제조용 마스크 패턴 및 그 형성 방법과 미세패턴을 가지는 반도체 소자의 제조 방법 |
US20050250052A1 (en) | 2004-05-10 | 2005-11-10 | Nguyen Khe C | Maskless lithography using UV absorbing nano particle |
GB0414840D0 (en) | 2004-07-02 | 2004-08-04 | Ncr Int Inc | Self-service terminal |
KR100733920B1 (ko) * | 2004-09-17 | 2007-07-02 | 주식회사 엘지화학 | 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법 |
US20090163615A1 (en) | 2005-08-31 | 2009-06-25 | Izhar Halahmi | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
KR100643934B1 (ko) * | 2005-09-02 | 2006-11-10 | 삼성전기주식회사 | 인쇄회로기판의 회로패턴 형성방법 |
US7686986B2 (en) | 2006-01-05 | 2010-03-30 | Headwaters Technology Innovation, Llc | Magnesium hydroxide nanoparticles, methods of making same and compositions incorporating same |
JP2007250884A (ja) * | 2006-03-16 | 2007-09-27 | Shirai Denshi Kogyo Kk | フレキシブルプリント基板およびその製造方法 |
US20070237899A1 (en) * | 2006-04-05 | 2007-10-11 | David Sawoska | Process for creating a pattern on a copper surface |
US20080308003A1 (en) | 2007-06-13 | 2008-12-18 | Krol Andrew M | UV inkjet resist |
JP5454834B2 (ja) | 2007-08-30 | 2014-03-26 | 日立化成株式会社 | 粗化処理装置 |
JP2009158593A (ja) | 2007-12-25 | 2009-07-16 | Tessera Interconnect Materials Inc | バンプ構造およびその製造方法 |
WO2009116401A1 (ja) | 2008-03-17 | 2009-09-24 | 日立化成工業株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板 |
KR100986287B1 (ko) | 2008-05-09 | 2010-10-07 | 삼성전기주식회사 | 잉크젯 토출장치 |
WO2010086850A2 (en) | 2009-01-29 | 2010-08-05 | Digiflex Ltd. | Process for producing a photomask on a photopolymeric surface |
JP2011171323A (ja) * | 2010-02-16 | 2011-09-01 | Mitsubishi Paper Mills Ltd | 銅又は銅合金のエッチング方法 |
JP2011243256A (ja) | 2010-05-19 | 2011-12-01 | Dainippon Printing Co Ltd | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
KR20130088166A (ko) | 2010-11-17 | 2013-08-07 | 히타치가세이가부시끼가이샤 | 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 |
US20120288683A1 (en) | 2011-05-10 | 2012-11-15 | Chin-Te Kuo | Protuberant structure and method for making the same |
WO2013004624A1 (en) * | 2011-07-07 | 2013-01-10 | Atotech Deutschland Gmbh | Method for providing organic resist adhesion to a copper or copper alloy surface |
US9352544B2 (en) * | 2011-08-24 | 2016-05-31 | Digiflex Ltd. | Process for dry-coating flexographic surfaces |
WO2013030931A1 (ja) | 2011-08-29 | 2013-03-07 | 日本碍子株式会社 | 積層焼結セラミック配線基板、及び当該配線基板を含む半導体パッケージ |
US9683305B2 (en) * | 2011-12-20 | 2017-06-20 | Apple Inc. | Metal surface and process for treating a metal surface |
KR20140092917A (ko) | 2012-01-31 | 2014-07-24 | 아그파-게바에르트 엔.브이. | 방사선 경화성 내에칭성 잉크젯 잉크 프린팅 |
JP2013162007A (ja) * | 2012-02-07 | 2013-08-19 | Toppan Printing Co Ltd | 微細配線パターンの製造方法 |
US20140252571A1 (en) | 2013-03-06 | 2014-09-11 | Maxim Integrated Products, Inc. | Wafer-level package mitigated undercut |
JP6164614B2 (ja) | 2013-12-06 | 2017-07-19 | メック株式会社 | エッチング液、補給液及び銅配線の形成方法 |
KR101964901B1 (ko) | 2013-12-06 | 2019-04-02 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 표면 잔류물 제거용 세정 제형 |
TWI500806B (zh) | 2014-03-10 | 2015-09-21 | Nat Univ Tsing Hua | 碳化矽薄膜的製造方法 |
KR20150109932A (ko) | 2014-03-21 | 2015-10-02 | 삼성전기주식회사 | 에칭액 조성물 및 이를 이용한 회로 패턴의 제조방법 |
WO2016039259A1 (ja) | 2014-09-08 | 2016-03-17 | 国立大学法人九州大学 | 有機マイクロディスク構造体の製造方法 |
GB2538522B (en) | 2015-05-19 | 2019-03-06 | Dst Innovations Ltd | Electronic circuit and component construction |
KR20240014607A (ko) | 2015-06-04 | 2024-02-01 | 카티바, 인크. | 금속 표면 상에서 에치 레지스트 패턴의 제조 방법 |
KR20240014578A (ko) | 2015-08-13 | 2024-02-01 | 카티바, 인크. | 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법 |
US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
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Publication number | Publication date |
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US11807947B2 (en) | 2023-11-07 |
KR20240014578A (ko) | 2024-02-01 |
EP3866572A2 (en) | 2021-08-18 |
US20180242457A1 (en) | 2018-08-23 |
EP3335079A4 (en) | 2019-03-27 |
US11255018B2 (en) | 2022-02-22 |
JP2018527463A (ja) | 2018-09-20 |
JP2023116478A (ja) | 2023-08-22 |
KR102626521B1 (ko) | 2024-01-17 |
US20210007225A1 (en) | 2021-01-07 |
JP2021192427A (ja) | 2021-12-16 |
US20220136113A1 (en) | 2022-05-05 |
KR20180074666A (ko) | 2018-07-03 |
EP3335079A1 (en) | 2018-06-20 |
US10806035B2 (en) | 2020-10-13 |
EP3866572B1 (en) | 2024-01-03 |
EP3866572A3 (en) | 2021-09-29 |
CN108027553A (zh) | 2018-05-11 |
KR102508824B1 (ko) | 2023-03-09 |
CN108027553B (zh) | 2021-12-31 |
EP3335079B1 (en) | 2021-05-12 |
CN114397795A (zh) | 2022-04-26 |
US20240035167A1 (en) | 2024-02-01 |
KR20230036169A (ko) | 2023-03-14 |
JP7288644B2 (ja) | 2023-06-08 |
WO2017025949A1 (en) | 2017-02-16 |
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