JP6967386B2 - ドレッシング方法 - Google Patents
ドレッシング方法 Download PDFInfo
- Publication number
- JP6967386B2 JP6967386B2 JP2017135879A JP2017135879A JP6967386B2 JP 6967386 B2 JP6967386 B2 JP 6967386B2 JP 2017135879 A JP2017135879 A JP 2017135879A JP 2017135879 A JP2017135879 A JP 2017135879A JP 6967386 B2 JP6967386 B2 JP 6967386B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting blade
- cutting
- convex portion
- dresser board
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/368—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades installed as an accessory on another machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/18—Wheels of special form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
60、71 保持テーブル
65、78 凸部
67、79 凸部の上面
D1、D2 ドレッサボード
Claims (1)
- 平板のドレッサボードから凸部を形成すると共に切削ブレードの先端をフラットにドレッシングするドレッシング方法であって、
該平板のドレッサボードを保持テーブルに保持する保持工程と、
該保持テーブルが保持した該平板のドレッサボードを該切削ブレードで切削して、該切削ブレードの厚みより僅かに狭い幅で切削方向に延在する凸部を形成する凸部形成工程と、
該凸部形成工程の後、該凸部の延在方向に直交する幅の中心と該切削ブレードの厚みの中心とを一致させると共に、該凸部の上面から所定量切り込ませる高さに該切削ブレードを位置づける位置づけ工程と、
該位置づけ工程で位置づけられた該切削ブレードと該凸部形成後のドレッサボードとを相対的に切削送り方向に移動させ該凸部を切削して該切削ブレードをドレッシングするドレッシング方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017135879A JP6967386B2 (ja) | 2017-07-12 | 2017-07-12 | ドレッシング方法 |
TW107119453A TWI759496B (zh) | 2017-07-12 | 2018-06-06 | 修整方法 |
CN201810722048.1A CN109249285B (zh) | 2017-07-12 | 2018-07-04 | 修整板和修整方法 |
KR1020180079442A KR102503533B1 (ko) | 2017-07-12 | 2018-07-09 | 드레서 보드, 드레싱 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017135879A JP6967386B2 (ja) | 2017-07-12 | 2017-07-12 | ドレッシング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019018254A JP2019018254A (ja) | 2019-02-07 |
JP6967386B2 true JP6967386B2 (ja) | 2021-11-17 |
Family
ID=65051985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017135879A Active JP6967386B2 (ja) | 2017-07-12 | 2017-07-12 | ドレッシング方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6967386B2 (ja) |
KR (1) | KR102503533B1 (ja) |
CN (1) | CN109249285B (ja) |
TW (1) | TWI759496B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7378890B2 (ja) * | 2019-08-06 | 2023-11-14 | 株式会社ディスコ | 目立てボード及び切削ブレードの目立て方法 |
JP2022174532A (ja) | 2021-05-11 | 2022-11-24 | 株式会社ディスコ | ドレッサーボード及び切削ブレードのドレッシング方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3093128A (en) * | 1960-10-20 | 1963-06-11 | Cincinnati Milling Machine Co | Grinding machine truing mechanism |
DE3315196A1 (de) * | 1983-04-27 | 1984-10-31 | Schaudt Maschinenbau Gmbh, 7000 Stuttgart | Verfahren zum abrichten und schaerfen einer schleifscheibe |
JPH029576A (ja) * | 1988-06-28 | 1990-01-12 | Nippei Toyama Corp | 研削砥石の砥石修正装置 |
JP4329712B2 (ja) * | 2005-03-15 | 2009-09-09 | 三菱マテリアル株式会社 | ツルーイング砥石及びこれを用いたツルーイング方法 |
JP4852892B2 (ja) * | 2005-05-31 | 2012-01-11 | 三菱マテリアル株式会社 | ツルーイング工具および研削砥石のツルーイング方法 |
JP5254679B2 (ja) * | 2008-06-23 | 2013-08-07 | 株式会社ディスコ | 切削ブレードのドレス方法 |
CN201235502Y (zh) * | 2008-08-05 | 2009-05-13 | 郑飞熊 | 无心磨插补式金刚滚轮修整器结构 |
JP2010142890A (ja) * | 2008-12-17 | 2010-07-01 | Fuji Xerox Co Ltd | 切削部材の外周形状の修正方法、ドレッサーボード及び切削装置 |
TWM370461U (en) * | 2009-05-08 | 2009-12-11 | Ufa Machinery Co Ltd | Diamond grinding wheel trimmer and trimming structure for triming cylinder grinding bed |
JP5541657B2 (ja) * | 2009-07-01 | 2014-07-09 | 株式会社ディスコ | 目立てボード |
JP2011249571A (ja) | 2010-05-27 | 2011-12-08 | Disco Abrasive Syst Ltd | 切削ブレード外形形状検査方法 |
CN102347275B (zh) * | 2010-08-02 | 2014-02-19 | 北京中电科电子装备有限公司 | 划片机刀片的修整方法 |
JP2012187693A (ja) * | 2011-03-14 | 2012-10-04 | Disco Corp | ドレス材及びドレッシング方法 |
JP5764031B2 (ja) | 2011-10-06 | 2015-08-12 | 株式会社ディスコ | 切削装置 |
CN102862121B (zh) * | 2012-09-17 | 2015-05-20 | 上海华力微电子有限公司 | 一种cmp研磨垫修整结构 |
KR20150065722A (ko) * | 2012-10-10 | 2015-06-15 | 아사히 가라스 가부시키가이샤 | 탄성 지석의 드레싱 방법 |
CN203918783U (zh) * | 2014-06-24 | 2014-11-05 | 浙江司贝宁精工科技有限公司 | 一种数控抛光机床用的自动修整抛光轮机构 |
JP6576135B2 (ja) * | 2015-07-14 | 2019-09-18 | 株式会社ディスコ | 切削ブレードの先端形状成形方法 |
CN105345665A (zh) * | 2015-11-30 | 2016-02-24 | 郑州磨料磨具磨削研究所有限公司 | 一种平面磨削用超硬砂轮修整工具及修整方法 |
-
2017
- 2017-07-12 JP JP2017135879A patent/JP6967386B2/ja active Active
-
2018
- 2018-06-06 TW TW107119453A patent/TWI759496B/zh active
- 2018-07-04 CN CN201810722048.1A patent/CN109249285B/zh active Active
- 2018-07-09 KR KR1020180079442A patent/KR102503533B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2019018254A (ja) | 2019-02-07 |
TWI759496B (zh) | 2022-04-01 |
KR20190007390A (ko) | 2019-01-22 |
TW201908062A (zh) | 2019-03-01 |
CN109249285B (zh) | 2022-04-05 |
KR102503533B1 (ko) | 2023-02-23 |
CN109249285A (zh) | 2019-01-22 |
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