JP6963604B2 - Metal mask for OLED deposition and OLED deposition method - Google Patents

Metal mask for OLED deposition and OLED deposition method Download PDF

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JP6963604B2
JP6963604B2 JP2019516112A JP2019516112A JP6963604B2 JP 6963604 B2 JP6963604 B2 JP 6963604B2 JP 2019516112 A JP2019516112 A JP 2019516112A JP 2019516112 A JP2019516112 A JP 2019516112A JP 6963604 B2 JP6963604 B2 JP 6963604B2
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metal mask
retaining wall
oled
opening
substrate
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JP2019530804A (en
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ウェンフェイ リ
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Shenzhen Royole Technologies Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Description

本発明は、金属蒸着技術に関するものであり、特にＯＬＥＤ蒸着用メタルマスク及びＯＬＥＤ蒸着方法に関するものである。 The present invention relates to a metal vapor deposition technique, and more particularly to a metal mask for OLED vapor deposition and an OLED vapor deposition method.

有機発光ダイオード（Ｏｒｇａｎｉｃ Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ、ＯＬＥＤ）ディスプレイは、軽薄であり、自発的に発光することができ、対応速度が速いので、スマートフォンやタブレットなどの端末に広く応用されている。従来の技術において、ＯＬＥＤの発光サブピクセルの形成方法は蒸着法を採用し、主にＯＬＥＤ基板の蒸着面と蒸着源との間にメタルマスクを配置し、蒸着材料は加熱によって蒸発されるので、メタルマスクの開口によって蒸着面の対応するサブピクセル領域に対して蒸着する。しかし、メタルマスク蒸着法はシャドウ効果（ｓｈａｄｏｗ ｅｆｆｅｃｔ）が発生し易く、即ち第一サブピクセル領域に対して蒸着する場合、蒸着材料は第一サブピクセルの所定領域の外側に拡散可能であり、即ち第二サブピクセル領域又は第三サブピクセル領域に拡散されて、混色を引き起こし、ＯＬＥＤの発光表示効果に影響を及ぼす。 Organic Light Emitting Diode (OLED) displays are frivolous, can emit light spontaneously, and have a high response speed, so they are widely applied to terminals such as smartphones and tablets. In the conventional technique, a thin-film deposition method is adopted as a method for forming light emitting subpixels of an OLED, a metal mask is mainly placed between a thin-film deposition surface of an OLED substrate and a thin-film deposition source, and the vapor-deposited material is vaporized by heating. Deposition is performed on the corresponding sub-pixel region of the vapor deposition surface by the opening of the metal mask. However, in the metal mask deposition method, a shadow effect is likely to occur, that is, when vapor deposition is performed on the first subpixel region, the vapor deposition material can be diffused outside a predetermined region of the first subpixel, that is, It is diffused into the second subpixel region or the third subpixel region, causing color mixing and affecting the emission display effect of the OLED.

本発明は、ＯＬＥＤ蒸着用メタルマスク及びＯＬＥＤ蒸着方法を提供し、ＯＬＥＤ基板に対して蒸着する場合にピクセル領域の混色を引き起こす技術的問題を解決する。 The present invention provides a metal mask for OLED vapor deposition and an OLED vapor deposition method, and solves a technical problem that causes color mixing in a pixel region when vapor deposition is performed on an OLED substrate.

本発明に係わるＯＬＥＤ蒸着用メタルマスクは、基板と、前記基板を貫通する開口部と、前記基板の１つの表面から突出するように形成された擁壁と、を備え、前記擁壁は前記開口部の辺縁を囲み、且つ前記擁壁における前記開口部に向かう内表面は反射面であり、前記擁壁は前記開口部と前記基板の他の部分を隔離するために用いられる。 The metal mask for OLED deposition according to the present invention includes a substrate, an opening penetrating the substrate, and a retaining wall formed so as to project from one surface of the substrate, and the retaining wall is the opening. The inner surface of the retaining wall that surrounds the edges of the portion and faces the opening is a reflective surface, which is used to separate the opening from the rest of the substrate.

その中において、前記擁壁の内表面はＶ字状の断面を有する反射面である。 Among them, the inner surface of the retaining wall is a reflective surface having a V-shaped cross section.

その中において、前記基板に垂直する前記擁壁の断面は二等辺台形であり、前記内表面が前記開口部の外側に向かって広げるようにする。 Among them, the cross section of the retaining wall perpendicular to the substrate is isosceles trapezoidal so that the inner surface expands toward the outside of the opening.

その中において、前記擁壁の内表面は、前記開口部の辺縁に接続され且つ前記開口部から離れるように傾斜する斜面と、前記斜面に接続され且つ前記基板の表面に垂直する遮蔽面と、を備える。 Among them, the inner surface of the retaining wall includes a slope connected to the edge of the opening and inclined away from the opening, and a shielding surface connected to the slope and perpendicular to the surface of the substrate. , Equipped with.

その中において、前記基板に垂直する前記擁壁の断面はＬ字状であり、前記擁壁の内表面が階段状に設置された２つの反射面を形成するようにする。 Among them, the cross section of the retaining wall perpendicular to the substrate is L-shaped, and the inner surface of the retaining wall forms two reflective surfaces arranged in a staircase pattern.

その中において、前記擁壁の内表面は外へ突出された円弧面である。 Among them, the inner surface of the retaining wall is an arc surface protruding outward.

その中において、前記擁壁は、前記基板に接続されている第一部分と、前記第一部分に接続されており且つ前記第一部分の材料と異なる材料からなる第二部分と、を備え、前記第一部分の内表面と前記第二部分の内表面は階段状に設置されて前記反射面を構成する。 Among them, the retaining wall includes a first portion connected to the substrate and a second portion connected to the first portion and made of a material different from the material of the first portion. The inner surface of the second portion and the inner surface of the second portion are installed in a stepped manner to form the reflective surface.

その中において、前記擁壁は第一壁及び第二壁を備え、前記第一壁は前記開口部の辺縁に隣接し、前記第二壁は前記第一壁を囲み且つ前記第一壁と間隔を置いて設置され、前記開口部に向かう前記第一壁の内表面は前記開口部の外側に向かって広げて前記反射面を形成する。 Among them, the retaining wall includes a first wall and a second wall, the first wall is adjacent to the edge of the opening, and the second wall surrounds the first wall and is associated with the first wall. The inner surface of the first wall, which is installed at intervals and faces the opening, expands toward the outside of the opening to form the reflective surface.

その中において、前記擁壁は前記基板と離反する頂面を備え、前記頂面は平面であり、又は前記頂面は曲面である。 Among them, the retaining wall has a top surface that separates from the substrate, and the top surface is a flat surface or the top surface is a curved surface.

本発明に係わる蒸着用メタルマスクは、基板と、前記基板を貫通する開口部と、を備え、前記基板の表面にはさらに溝が形成されており、前記開口部と前記溝は間隔を置いて設置され、前記開口部と前記溝との間には擁壁が形成される。 The metal mask for vapor deposition according to the present invention includes a substrate and an opening penetrating the substrate, and a groove is further formed on the surface of the substrate, and the opening and the groove are spaced apart from each other. It is installed and a retaining wall is formed between the opening and the groove.

本発明に係わるＯＬＥＤ蒸着方法は、ＯＬＥＤパネル表面の複数の蒸着領域を確定するステップと、真空環境において、蒸着材料とＯＬＥＤパネルの表面との間にメタルマスクを設置するステップと、前記メタルマスクの開口部を１つの蒸着領域に対向させ、且つ前記擁壁によって前記蒸着領域と他の蒸着領域を隔離するステップと、加熱蒸着するステップと、を備える。 The OLED deposition method according to the present invention includes a step of determining a plurality of vapor deposition regions on the surface of the OLED panel, a step of installing a metal mask between the vapor deposition material and the surface of the OLED panel in a vacuum environment, and a step of the metal mask. It includes a step of making the opening face one vapor deposition region and separating the vapor deposition region from the other vapor deposition region by the retaining wall, and a step of heat-depositing.

本発明に係わるＯＬＥＤ蒸着方法は、ＯＬＥＤパネル表面の複数の蒸着領域を確定し、２つの前記蒸着領域毎の間には隔離柱が設置されているステップと、真空環境において、蒸着材料とＯＬＥＤパネルの表面との間にメタルマスクを設置するステップと、前記メタルマスクの開口部を１つの蒸着領域に対向させ、前記隔離柱は前記溝内に挿入されて、前記溝と前記開口部との間の擁壁は、前記蒸着領域と前記開口部に対向する蒸着領域以外の他の蒸着領域を隔離するステップと、加熱蒸着するステップと、を備える。 In the OLED vapor deposition method according to the present invention, a plurality of thin-film deposition regions on the surface of the OLED panel are determined, and an isolation column is installed between each of the two thin-film deposition regions. A step of installing a metal mask between the surface of the metal mask and an opening of the metal mask facing one vapor deposition region, the isolation column is inserted into the groove, and between the groove and the opening. The retaining wall includes a step of separating the vapor deposition region and a vapor deposition region other than the vapor deposition region facing the opening, and a step of heat-depositing.

本発明によって提供されるＯＬＥＤ蒸着用メタルマスクは、前記基板の開口部の辺縁に擁壁を設置し、前記ＯＬＥＤ蒸着方法によって前記ＯＬＥＤ基板に対して蒸着することにより、前記蒸着材料が所定のサブピクセル領域の外側に拡散されて招く混色の発生を回避し、従ってＯＬＥＤの発光表示効果を高める。 In the metal mask for OLED deposition provided by the present invention, the vapor deposition material is predetermined by installing a retaining wall on the edge of the opening of the substrate and depositing the vapor deposition on the OLED substrate by the OLED vapor deposition method. It avoids the occurrence of color mixing caused by being diffused outside the sub-pixel region, and thus enhances the emission display effect of the OLED.

以下、本発明の実施形態に係る技術的方案をより明確に説明するために、本発明の実施形態の説明に使用される図面について簡単に説明する。明らかに、以下説明される図面は、本発明の一部の実施形態だけのものであり、当業者であれば、これらの図面から創造的な努力なしに他の図面を得ることができる。
図１は、本発明の第一実施形態に係るＯＬＥＤ蒸着用メタルマスクを示す図ある。 図２は、本発明の第一実施形態に係るＯＬＥＤ蒸着用メタルマスクによってＯＬＥＤサブピクセルを加工する効果を示す図である。 図３は、本発明の第二実施形態に係るＯＬＥＤ蒸着用メタルマスクを示す図ある。 図４は、本発明の第三実施形態に係るＯＬＥＤ蒸着用メタルマスクを示す図ある。 図５は、本発明の第四実施形態に係るＯＬＥＤ蒸着用メタルマスクを示す図ある。 図６は、本発明の第五実施形態に係るＯＬＥＤ蒸着用メタルマスクを示す図ある。 図７は、本発明の第六実施形態に係るＯＬＥＤ蒸着用メタルマスクを示す図ある。 図８は、本発明の第七実施形態に係るＯＬＥＤ蒸着用メタルマスクを示す図ある。 図９は、本発明の第八実施形態に係るＯＬＥＤ蒸着用メタルマスクを示す図ある。 図１０は、本発明の第八実施形態に係るＯＬＥＤ蒸着用メタルマスクによってＯＬＥＤサブピクセルを加工する効果を示す図である。 図１１は、本発明の第二〜第七実施形態に係るメタルマスクを応用するＯＬＥＤ蒸着方法のフローチャートである。 図１２は、本発明の第八実施形態に係るメタルマスクを応用するＯＬＥＤ蒸着方法のフローチャートである。 Hereinafter, in order to more clearly explain the technical plan according to the embodiment of the present invention, the drawings used for the description of the embodiment of the present invention will be briefly described. Obviously, the drawings described below are for only some embodiments of the present invention, and one of ordinary skill in the art can obtain other drawings from these drawings without creative effort.
FIG. 1 is a diagram showing a metal mask for OLED deposition according to the first embodiment of the present invention. FIG. 2 is a diagram showing the effect of processing an OLED subpixel by the metal mask for OLED deposition according to the first embodiment of the present invention. FIG. 3 is a diagram showing a metal mask for OLED deposition according to the second embodiment of the present invention. FIG. 4 is a diagram showing a metal mask for OLED deposition according to a third embodiment of the present invention. FIG. 5 is a diagram showing a metal mask for OLED deposition according to a fourth embodiment of the present invention. FIG. 6 is a diagram showing a metal mask for OLED deposition according to a fifth embodiment of the present invention. FIG. 7 is a diagram showing a metal mask for OLED deposition according to a sixth embodiment of the present invention. FIG. 8 is a diagram showing a metal mask for OLED deposition according to a seventh embodiment of the present invention. FIG. 9 is a diagram showing a metal mask for OLED deposition according to the eighth embodiment of the present invention. FIG. 10 is a diagram showing the effect of processing an OLED subpixel by the metal mask for OLED deposition according to the eighth embodiment of the present invention. FIG. 11 is a flowchart of an OLED vapor deposition method to which the metal mask according to the second to seventh embodiments of the present invention is applied. FIG. 12 is a flowchart of an OLED vapor deposition method to which the metal mask according to the eighth embodiment of the present invention is applied.

以下、本発明の実施形態の図面と結合して、本発明の実施形態の技術的方案に対して明確に、完全に説明する。 Hereinafter, the technical aspects of the embodiments of the present invention will be described clearly and completely in combination with the drawings of the embodiments of the present invention.

図１を参照すると、本発明はＯＬＥＤ蒸着用メタルマスク１００を提供し、ＯＬＥＤのサブピクセル領域を形成するために用いられる。第一実施形態において、前記メタルマスク１００は、基板１０と、前記基板１０を貫通する開口部２０と、前記開口部２０の辺縁を囲む擁壁３０と、を備える。前記基板１０は、第一表面１１と、前記第一表面１１に対向する第二表面１２と、を備える。前記開口部２０はフレア形状であり、即ち前記第一表面１１の開口端は前記第二表面１２の開口端よりわずかに小さく、前記基板１０に垂直する前記開口部２０の断面は二等辺台形である。前記擁壁３０は、前記基板１０の第一表面１１から突出するように形成され、且つ前記開口部２０の辺縁を囲んで設置される。 With reference to FIG. 1, the present invention provides a metal mask 100 for OLED deposition and is used to form a subpixel region of an OLED. In the first embodiment, the metal mask 100 includes a substrate 10, an opening 20 penetrating the substrate 10, and a retaining wall 30 surrounding the edge of the opening 20. The substrate 10 includes a first surface 11 and a second surface 12 facing the first surface 11. The opening 20 has a flare shape, that is, the opening end of the first surface 11 is slightly smaller than the opening end of the second surface 12 , and the cross section of the opening 20 perpendicular to the substrate 10 is an isosceles trapezoid. be. The retaining wall 30 is formed so as to protrude from the first surface 11 of the substrate 10, and is installed so as to surround the edge of the opening 20.

前記擁壁３０は、前記開口部２０と前記基板１０の他の部分を隔離するために用いられる。前記擁壁３０は、前記開口部２０に向かう内表面３０１と、前記基板１０と離反する頂面３０２と、を備える。前記内表面３０１は、反射面である。前記内表面３０１の作用は、蒸着材料を遮断且つ反射することにより、蒸着材料がＯＬＥＤ基板の所定の蒸着領域以外の位置に拡散しないようにする。本実施形態において、前記内表面３０１は前記開口部２０の外側に向かって広げて斜面を形成し、前記頂面３０２は平面であり、前記基板１０に垂直する前記擁壁３０の断面は二等辺台形である。前記擁壁３０は、同じ材料で形成される。前記擁壁３０の材料は、鉄、ニッケル、アルミニウム、又は合金、又は有機材料、又は無機材料である。有機材料は、ポリイミド、アクリル樹脂などであり、無機材料は、ＳｉＮｘなどである。 The retaining wall 30 is used to separate the opening 20 from other parts of the substrate 10. The retaining wall 30 includes an inner surface 301 facing the opening 20 and an apex surface 302 that separates from the substrate 10. The inner surface 301 is a reflective surface. The action of the inner surface 301 is to block and reflect the vapor-deposited material so that the vapor-deposited material does not diffuse to a position other than a predetermined vapor-deposited region of the OLED substrate. In the present embodiment, the inner surface 301 is widened toward the outside of the opening 20 to form a slope, the top surface 302 is a flat surface, and the cross section of the retaining wall 30 perpendicular to the substrate 10 is isosceles. It is trapezoidal. The retaining wall 30 is made of the same material. The material of the retaining wall 30 is iron, nickel, aluminum, or an alloy, an organic material, or an inorganic material. The organic material is polyimide, acrylic resin or the like, and the inorganic material is SiNx or the like.

図２を参照すると、ＯＬＥＤパネル２００は、ＯＬＥＤ基板２１０と、前記ＯＬＥＤ基板２１０にアレイ状に配列された複数の蒸着領域２２０と、２つの前記蒸着領域２２０毎の間に設置された隔離柱２３０と、を備える。前記蒸着領域２２０に対して蒸着操作を行うことにより、アレイ状に配列されたサブピクセルを形成する。サブピクセルは異なる色を有するので、ＯＬＥＤパネルは異なる色を呈し、前記蒸着領域２２０も異なる色の材料を蒸着した異なる蒸着領域を備える。本願の前記蒸着領域２２０は、赤色を蒸着した第一蒸着領域２２０１と、青色を蒸着した第二蒸着領域２２０２と、緑色を蒸着した第三蒸着領域２２０３と、を備える。蒸着操作を行う場合、前記ＯＬＥＤパネル２００は前記メタルマスク１００の上に積層され、前記隔離柱２３０は前記第一表面１１上に配置されて、前記開口部２０に対応する蒸着領域と他の蒸着領域とをさらに隔離することができる。蒸着材料は前記開口部２０を通って前記蒸着領域２２０に入り、一部分の蒸着材料は前記擁壁３０に拡散されると、前記擁壁３０の内表面３０１に遮断且つ反射されて、所定の前記蒸着領域２２０内に拡散されるので、蒸着材料が所定のサブピクセル領域の外側に拡散されて混色を引き起こすことを免れ、ＯＬＥＤの発光表示効果を高める。 Referring to FIG. 2, the OLED panel 200 includes an OLED substrate 210, a plurality of thin-film deposition regions 220 arranged in an array on the OLED substrate 210, and isolation columns 230 installed between each of the two thin-film deposition regions 220. And. By performing a thin-film deposition operation on the thin-film deposition region 220, sub-pixels arranged in an array are formed. Since the sub-pixels have different colors, the OLED panel exhibits different colors, and the vapor deposition region 220 also includes different vapor deposition regions in which different colored materials are deposited. The vapor deposition region 220 of the present application includes a first vapor deposition region 2201 in which red is vapor-deposited, a second vapor deposition region 2202 in which blue is vapor-deposited, and a third vapor deposition region 2203 in which green is vapor-deposited. When performing a thin-film deposition operation, the OLED panel 200 is laminated on the metal mask 100, the isolation column 230 is arranged on the first surface 11, and a thin-film deposition region corresponding to the opening 20 and other thin-film deposition are performed. It can be further isolated from the area. The vapor-deposited material enters the vapor-deposited region 220 through the opening 20, and when a part of the vapor-deposited material is diffused to the retaining wall 30, it is blocked and reflected by the inner surface 301 of the retaining wall 30, and the predetermined said. Since it is diffused in the vapor deposition region 220, the vapor deposition material is prevented from being diffused outside the predetermined subpixel region to cause color mixing, and the light emission display effect of the OLED is enhanced.

前記擁壁３０は、様々な形状を有し且つ形成材料も異なることができると、理解されるべきである。具体的には、使用状況に応じて、対応的に選択することができる。 It should be understood that the retaining wall 30 has various shapes and can be made of different materials. Specifically, it can be selected correspondingly according to the usage situation.

図３を参照すると、本発明の第二実施形態はメタルマスク３００を提供し、前記第一実施形態と異なる点は、本実施形態に係わる前記メタルマスク３００の擁壁３３０の内表面３３０１は、Ｖ字状の断面を有する反射面であり、蒸着材料の拡散経路は図面に示す通りであり、蒸着材料は反射面で何度も反射されて前記蒸着領域内に反射され、蒸着材料が開口部以外の領域に拡散されて他の蒸着領域を影響することを減少する。 Referring to FIG. 3, the second embodiment of the present invention provides the metal mask 300, and the difference from the first embodiment is that the inner surface 3301 of the retaining wall 330 of the metal mask 300 according to the present embodiment is It is a reflective surface having a V-shaped cross section, and the diffusion path of the vapor-deposited material is as shown in the drawing. It reduces the effect of being diffused to other regions and affecting other vapor deposition regions.

図４を参照すると、本発明の第三実施形態はメタルマスク４００を提供し、前記第一、第二実施形態と異なる点は、本実施形態に係わる前記メタルマスク４００の擁壁４３０の内表面４３０１は、開口部２０の辺縁に接続され且つ前記開口部２０から離れるように傾斜する斜面４３０１ａと、前記斜面４３０１ａに接続され且つ前記基板１０の表面に垂直する遮蔽面４３０１ｂと、を備える。 Referring to FIG. 4, the third embodiment of the present invention provides the metal mask 400, and the difference from the first and second embodiments is the inner surface of the retaining wall 430 of the metal mask 400 according to the present embodiment. The 4301 includes a slope 4301a connected to the edge of the opening 20 and inclined away from the opening 20, and a shielding surface 4301b connected to the slope 4301a and perpendicular to the surface of the substrate 10.

図５を参照すると、本発明の第四実施形態はメタルマスク５００を提供し、前記第一〜第三実施形態と異なる点は、本実施形態に係わる前記メタルマスク５００の擁壁５３０の内表面５３０１は外へ突出された円弧面であり、その頂面５３０２は曲面である。前記基板１０に垂直する前記擁壁５３０の断面は放物線状である。 Referring to FIG. 5, the fourth embodiment of the present invention provides the metal mask 500, and the difference from the first to third embodiments is that the inner surface of the retaining wall 530 of the metal mask 500 according to the present embodiment. Reference numeral 5301 is an arcuate surface protruding outward, and its top surface 5302 is a curved surface. The cross section of the retaining wall 530 perpendicular to the substrate 10 is parabolic.

図６を参照すると、本発明の第五実施形態はメタルマスク６００を提供し、前記第一〜第四実施形態と異なる点は、本実施形態に係わる前記メタルマスク６００の擁壁６３０の内表面６３０１は、階段状に設置された２つの反射面を形成し、階段状に設置された２つの反射面は全て前記開口部２０から離れる方向に向かって外へ拡張する斜面である。前記基板１０に垂直する前記擁壁６３０の断面はＬ字状であり、前記基板１０の第一表面１１に設置された第一段階６３１はＬ字状の短辺を形成し、第一段階６３１の上に設置された第二段階６３２はＬ字状の長辺を形成する。蒸着材料は、階段状に設置された反射面で何度も反射されて、蒸着材料が開口部２０以外の他の領域に拡散されることを減少する。 Referring to FIG. 6, the fifth embodiment of the present invention provides the metal mask 600, and the difference from the first to fourth embodiments is the inner surface of the retaining wall 630 of the metal mask 600 according to the present embodiment. Reference numeral 6301 is a slope that forms two reflecting surfaces installed in a staircase pattern, and all of the two reflecting surfaces installed in a staircase pattern extend outward in a direction away from the opening 20. The cross section of the retaining wall 630 perpendicular to the substrate 10 is L-shaped, and the first step 631 installed on the first surface 11 of the substrate 10 forms an L-shaped short side, and the first step 631 The second stage 632 installed on top of it forms an L-shaped long side. The vapor-deposited material is repeatedly reflected by the reflective surfaces installed in a staircase pattern to reduce the diffusion of the vapor-deposited material to areas other than the opening 20.

図７を参照すると、本発明の第六実施形態はメタルマスク７００を提供し、前記第一〜第五実施形態と異なる点は、本実施形態に係わる前記メタルマスク７００の擁壁７３０は、前記基板１０に接続されている第一部分７３３と、前記第一部分７３３に接続されている第二部分７３４と、を備える。前記第一部分７３３と前記第二部分７３４の構成材料は異なる。前記第一部分７３３は、前記開口部２０の辺縁を囲んで設置される。前記第二部分７３４は、前記第一部分７３３の上に設置され且つその辺縁は前記開口部２０からわずかに離れている。前記第一部分７３３の内表面と前記第二部分７３４の内表面は階段状に設置されて内表面７３０１を構成し、階段状に設置された前記第一部分７３３の内表面と前記第二部分７３４の内表面は全て前記開口部２０から離れている外へ拡張する斜面である。 Referring to FIG. 7, the sixth embodiment of the present invention provides the metal mask 700, and the difference from the first to fifth embodiments is that the retaining wall 730 of the metal mask 700 according to the present embodiment is described above. It includes a first portion 733 connected to the substrate 10 and a second portion 734 connected to the first portion 733. The constituent materials of the first portion 733 and the second portion 734 are different. The first portion 733 is installed so as to surround the edge of the opening 20. The second portion 734 is installed on the first portion 733 and its edge is slightly away from the opening 20. The inner surface of the first portion 733 and the inner surface of the second portion 734 are installed in a stepped manner to form an inner surface 7301, and the inner surface of the first portion 733 and the second portion 734 installed in a stepped manner. All inner surfaces are slopes that extend outward away from the opening 20.

図８を参照すると、本発明の第七実施形態はメタルマスク８００を提供し、前記第一〜第六実施形態と異なる点は、本実施形態に係わる前記メタルマスク８００の擁壁８３０は、第一壁８３５及び第二壁８３６を備える。前記第一壁８３５は前記開口部２０に隣接し且つ前記開口部２０の辺縁を囲み、前記第二壁８３６は前記第一壁８３５を囲み且つ前記第一壁８３５と間隔を置いて設置される。前記開口部２０に向かう前記第一壁８３５の内表面８３０１は前記開口部２０の外側に向かって広げて反射面を形成する。前記基板１０に垂直する前記第一壁８３５及び前記第二壁８３６の断面は全て二等辺台形である。本実施形態において、前記第一壁８３５及び前記第二壁８３６の形状及び材料は同じでもよく、又は異なってもよく、且つその形状は前記第一〜第六実施形態の任意の形状であることができると、理解されるべきである。 Referring to FIG. 8, the seventh embodiment of the present invention provides the metal mask 800, and the difference from the first to sixth embodiments is that the retaining wall 830 of the metal mask 800 according to the present embodiment is the first. It includes one wall 835 and a second wall 836. The first wall 835 is adjacent to the opening 20 and surrounds the edge of the opening 20, and the second wall 836 surrounds the first wall 835 and is installed at a distance from the first wall 835. NS. The inner surface 8301 of the first wall 835 facing the opening 20 expands toward the outside of the opening 20 to form a reflective surface. The cross sections of the first wall 835 and the second wall 836 perpendicular to the substrate 10 are all isosceles trapezoidal. In the present embodiment, the shapes and materials of the first wall 835 and the second wall 836 may be the same or different, and the shape may be any shape of the first to sixth embodiments. It should be understood that it can be done.

図９と図１０を参照すると、本発明の第八実施形態はメタルマスク９００を提供する。前記メタルマスク９００は、基板１０と、前記基板１０を貫通する開口部２０と、前記基板の第一表面１１に形成された溝９４０と、を備える。前記開口部２０と前記溝９４０は間隔を置いて設置され、前記開口部２０と前記溝９４０との間には擁壁が形成される。前記溝９４０は、前記ＯＬＥＤパネル２００の隔離柱２３０とそれぞれ対応して設置される。蒸着操作を行う場合、前記隔離柱２３０は前記溝９４０内に挿入されて、前記基板１０を前記ＯＬＥＤ基板２１０に接近させ、このとき、前記溝９４０と前記開口部２０との間の擁壁は、蒸着材料が前記開口部２０以外の領域に拡散されることを防止する。 With reference to FIGS. 9 and 10, an eighth embodiment of the present invention provides a metal mask 900. The metal mask 900 includes a substrate 10, an opening 20 penetrating the substrate 10, and a groove 940 formed on the first surface 11 of the substrate. The opening 20 and the groove 940 are installed at intervals, and a retaining wall is formed between the opening 20 and the groove 940. The groove 940 is installed corresponding to the isolation pillar 230 of the OLED panel 200, respectively. When performing the vapor deposition operation, the isolation column 230 is inserted into the groove 940 to bring the substrate 10 closer to the OLED substrate 210, and at this time, the retaining wall between the groove 940 and the opening 20 is formed. , Prevents the vapor-deposited material from diffusing into regions other than the opening 20.

本発明の第一〜第七実施形態に係わるメタルマスクは、いずれもフォトレジスト塗布、露光、現像、エッチング等のパターニング工程により形成される。主に以下のようなステップを備える：
第一ステップでは、メタルマスク基材の表面に第一フォトレジスト層をコーティングし、パターニング工程によって第一フォトレジスト層上に光透過領域を形成する；
第二ステップでは、メタルマスク基材に対してエッチングして、メタルマスク基材における光透過領域に位置する箇所に開口部を形成してから、第一フォトレジスト層を取り出す；
第三ステップでは、メタルマスク基材の他の表面に第二フォトレジスト層をコーティングし、第二フォトレジスト層をパターニングして前記擁壁のパターンを画定する；
第四ステップでは、擁壁のパターンに基づいて擁壁を形成し、擁壁の材料は鉄、ニッケル、アルミニウム、又は合金、又は有機材料、又は無機材料である。 The metal masks according to the first to seventh embodiments of the present invention are all formed by patterning steps such as photoresist coating, exposure, development, and etching. The main steps are as follows:
In the first step, the surface of the metal mask substrate is coated with a first photoresist layer, and a light-transmitting region is formed on the first photoresist layer by a patterning step;
In the second step, the metal mask substrate is etched to form an opening at a location located in the light transmitting region of the metal mask substrate, and then the first photoresist layer is taken out;
In the third step, the other surface of the metal mask substrate is coated with a second photoresist layer and the second photoresist layer is patterned to define the pattern of the retaining wall;
In the fourth step, a retaining wall is formed based on the pattern of the retaining wall, and the material of the retaining wall is iron, nickel, aluminum, or alloy, or an organic material or an inorganic material .

図２及び図１１を再び参照すると、本発明はＯＬＥＤ蒸着方法をさらに提供し、本出願では、第一実施形態に係わるメタルマスクをＯＬＥＤ蒸着過程で使用されるメタルマスクとすることを例として説明する。異なる有機発光材料によって、アレイ状に配置された異なる色（一般的に赤、緑、青の三種の三原色である）のサブピクセルを蒸着形成するので、ＯＬＥＤディスプレイは異なる色を呈する。故に、特定の領域に対応する色を呈する有機発光材料を蒸着することを必要とする。本出願において、前記ＯＬＥＤ蒸着方法は以下のステップを備える。 With reference to FIGS. 2 and 11 again, the present invention further provides an OLED vapor deposition method, and in the present application, the metal mask according to the first embodiment will be described as an example of a metal mask used in the OLED vapor deposition process. do. The OLED display exhibits different colors because the different organic luminescent materials deposit and form subpixels of different colors (generally the three primary colors of red, green, and blue) arranged in an array. Therefore, it is necessary to deposit an organic luminescent material that exhibits a color corresponding to a specific region. In the present application, the OLED deposition method includes the following steps.

ステップＳ１では、ＯＬＥＤパネル２００を提供し、前記ＯＬＥＤパネル表面の複数の蒸着領域２２０を確定する。 In step S1, the OLED panel 200 is provided, and a plurality of thin-film deposition regions 220 on the surface of the OLED panel are determined.

このステップにおいて、複数の前記蒸着領域２２０は、サブピクセルの所在位置である。 In this step, the plurality of thin-film deposition regions 220 are the locations of sub-pixels.

ステップＳ２では、真空環境において、蒸着材料と前記ＯＬＥＤパネル２００の表面との間に前記メタルマスク１００を設置する。 In step S2, the metal mask 100 is installed between the vapor-deposited material and the surface of the OLED panel 200 in a vacuum environment.

このステップにおいて、前記ＯＬＥＤパネル２００は前記メタルマスク１００の上に積層される。第一〜第七実施形態において、前記ＯＬＥＤパネル２００の隔離柱２３０は前記メタルマスク１００の第一表面１１に配置される。 In this step, the OLED panel 200 is laminated on the metal mask 100. In the first to seventh embodiments, the isolation pillar 230 of the OLED panel 200 is arranged on the first surface 11 of the metal mask 100.

ステップＳ３では、前記メタルマスク１００の開口部２０を１つの蒸着領域２２０１に対向させ、且つ前記メタルマスク１００の擁壁３０によって前記蒸着領域２２０１と他の蒸着領域を隔離する。このステップにおいて、前記蒸着領域２２０１は、同じ色のサブピクセルの所在位置である。 In step S3, the opening 20 of the metal mask 100 is opposed to one vapor deposition region 2201, and the retaining wall 30 of the metal mask 100 separates the vapor deposition region 2201 from another vapor deposition region. In this step, the vapor deposition region 2201 is the location of subpixels of the same color.

ステップＳ４では、加熱蒸着する。 In step S4, heat vapor deposition is performed.

このステップにおいて、前記加熱蒸着は、前記蒸着材料を加熱することにより、前記蒸着材料を蒸発拡散させて前記蒸着領域２２０１に附着するようにすることを意味する。１つの前記蒸着領域２２０１の蒸着が終了した後、他の色の蒸着材料を改めて選択してから前記メタルマスクを水平移動して、前記メタルマスクの開口部を次の蒸着領域に対向させ、且つ上述した操作を繰り返して、他の色のサブピクセルを形成し、即ちＯＬＥＤ蒸着過程が完了すると、理解されるべきである。蒸着過程において、前記擁壁３０は前記蒸着領域２２０１と他の蒸着領域を隔離することができるので、混色の発生を回避する。 In this step, the heat-deposited means that the vapor-deposited material is heated to evaporate and diffuse the vapor-deposited material so that it adheres to the vapor-deposited region 2201. After the vapor deposition of one of the vapor deposition regions 2201 is completed, the vapor deposition materials of other colors are selected again, and then the metal mask is horizontally moved so that the opening of the metal mask faces the next vapor deposition region. It should be understood that the above operations are repeated to form subpixels of other colors, i.e. the OLED deposition process is complete. In the vapor deposition process, the retaining wall 30 can separate the vapor deposition region 2201 from other vapor deposition regions, thus avoiding the occurrence of color mixing.

図１２を参照すると、本出願では第八実施形態に係わるメタルマスクをＯＬＥＤ蒸着過程で使用されるメタルマスクとする場合、前記蒸着方法は以下のようなステップを備える：
ステップＳ１：前記ＯＬＥＤパネル表面の複数の蒸着領域を確定し、２つの前記蒸着領域毎の間には隔離柱が設置されている；
ステップＳ２：真空環境において、蒸着材料とＯＬＥＤパネルの表面との間にメタルマスクを設置する；
ステップＳ３：前記メタルマスクの開口部を１つの蒸着領域に対向させ、前記隔離柱２３０は前記溝９４０内に挿入されて、前記溝と前記開口部との間の擁壁９３０は、前記蒸着領域と前記開口部に対向する蒸着領域以外の他の蒸着領域を隔離する；
ステップＳ４：加熱蒸着する。 Referring to FIG. 12, when the metal mask according to the eighth embodiment is a metal mask used in the OLED vapor deposition process in the present application, the vapor deposition method includes the following steps:
Step S1: A plurality of thin-film deposition regions on the surface of the OLED panel are determined, and isolation columns are installed between each of the two thin-film deposition regions;
Step S2: In a vacuum environment, a metal mask is placed between the deposited material and the surface of the OLED panel;
Step S3: The opening of the metal mask is opposed to one vapor deposition region, the isolation column 230 is inserted into the groove 940, and the retaining wall 930 between the groove and the opening is the vapor deposition region. And separate the other deposition areas other than the deposition area facing the opening;
Step S4: Heat vapor deposition.

本願に係わるＯＬＥＤ蒸着用メタルマスク及びＯＬＥＤ蒸着方法において、前記メタルマスクに擁壁を設置することにより、前記蒸着材料を反射し且つ前記蒸着材料の拡散を遮断することができ、前記蒸着材料を所定の前記蒸着領域内に最大限に保留して、蒸着材料が他の蒸着領域に拡散されて招く混色の発生を回避し、従ってＯＬＥＤの発光表示効果が大幅に向上する。 In the OLED vapor deposition metal mask and OLED vapor deposition method according to the present application, by installing a retaining wall on the metal mask, the vapor deposition material can be reflected and the diffusion of the vapor deposition material can be blocked, and the vapor deposition material can be predetermined. By maximally retaining the vapor deposition material in the thin-film deposition region, the generation of color mixing caused by the vapor-filmed material being diffused into other thin-film deposition regions is avoided, and therefore the luminescence display effect of the OLED is greatly improved.

Claims (3)

基板と、前記基板を貫通する開口部と、前記基板の１つの表面から突出するように形成された擁壁と、を備え、前記擁壁は前記開口部の辺縁を囲み、且つ前記擁壁における前記開口部に向かう内表面は反射面であり、前記擁壁の内表面は、階段状に設置された反射面を形成し、前記階段状に設置された反射面は全て基板の前記開口部から離れる方向に向かって外へ拡張する斜面であり、前記擁壁は前記開口部と前記基板の他の部分を隔離するために用いられることを特徴とするＯＬＥＤ蒸着用メタルマスク。 It comprises a substrate, an opening penetrating the substrate, and a retaining wall formed so as to project from one surface of the substrate, the retaining wall surrounding the edge of the opening and the retaining wall. The inner surface of the retaining wall facing the opening is a reflective surface, the inner surface of the retaining wall forms a reflective surface installed in a stepped manner, and all the reflective surfaces installed in a stepped manner are the openings of the substrate. A metal mask for OLED deposition, which is a slope that extends outward in a direction away from the OLED deposition, wherein the retaining wall is used to separate the opening from the rest of the substrate. 前記擁壁は前記基板と離反する頂面を備え、前記頂面は平面であり、又は前記頂面は曲面であることを特徴とする請求項１に記載のＯＬＥＤ蒸着用メタルマスク。 The metal mask for OLED deposition according to claim 1, wherein the retaining wall has a top surface that is separated from the substrate, and the top surface is a flat surface or the top surface is a curved surface. 前記擁壁の材料は、鉄、ニッケル、アルミニウム、又は合金、又は有機材料、又は無機材料であることを特徴とする請求項１に記載のＯＬＥＤ蒸着用メタルマスク。
The metal mask for OLED deposition according to claim 1, wherein the material of the retaining wall is iron, nickel, aluminum, an alloy, an organic material, or an inorganic material.
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