JP6961343B2 - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
- Publication number
- JP6961343B2 JP6961343B2 JP2016254137A JP2016254137A JP6961343B2 JP 6961343 B2 JP6961343 B2 JP 6961343B2 JP 2016254137 A JP2016254137 A JP 2016254137A JP 2016254137 A JP2016254137 A JP 2016254137A JP 6961343 B2 JP6961343 B2 JP 6961343B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- head
- load
- polished
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title claims description 126
- 230000007246 mechanism Effects 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 14
- 238000001514 detection method Methods 0.000 description 7
- 238000007517 polishing process Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
しかしながら、本実施の形態においては、リニアスケール34を利用して間接的に荷重を測定しているため、測定可能な荷重範囲は、例えばロードセルによって直接的に測定する場合よりも広い。
11 スピンドル
12 研磨パッド
20 装置本体
21 コラム
21a コラムの一側面
22 アーム
23 ベース
23a ベースの上面
30 ヘッド
31 研磨体支持部材
31a フランジ部
32 弾性機構
32a 加圧スプリング
32b、32c バランス用スプリング
33 支持体
34 リニアスケール
34a 固定子
34b 可動子
35 カバー
50 制御装置
51 検出部
52 記憶部
53 判定部
54 圧力評価部
60 テーブル
60a 載置面
61 支持ブロック
62 突条
70 ベッド
71 平行溝
100 研磨装置
Wa ウェハ
Claims (4)
- 被研磨材を保持する保持部と、
前記保持部に保持された被研磨材を研磨する研磨体と、
弾性機構を介して前記研磨体を支持するヘッドと、
前記ヘッドを、前記被研磨材に対して当該被研磨材との離間距離が変化する方向に相対移動させる駆動機構と、
前記駆動機構に接続され、前記駆動機構を制御する制御部と、
を備え、
前記ヘッドは、前記研磨体を支持する研磨体支持部材を有し、
前記弾性機構は、前記研磨体支持部材を前記被研磨材に向けて加圧する加圧スプリングと、当該加圧スプリングと並列に配置され前記研磨体支持部材の自重を支持するバランス用スプリングと、を備え、
前記制御部は、前記ヘッドの位置と前記加圧スプリングの弾性係数に基づき荷重を測定し、荷重が所定の値になるように制御することを特徴とする研磨装置。 - 前記研磨装置は、前記制御部に接続され、前記ヘッドに対する前記研磨体の位置を測定する位置センサを備えている
ことを特徴とする請求項1に記載の研磨装置。 - 前記位置センサは、リニアスケールである
ことを特徴とする請求項2に記載の研磨装置。 - 前記制御部は、前記位置センサの測定値と前記弾性機構のバネ定数とに基づいて、前記研磨体に加えられている荷重を計算し、この荷重を制御する
ことを特徴とする請求項2または3に記載の研磨装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/422,652 US10350722B2 (en) | 2016-02-05 | 2017-02-02 | Polishing apparatus |
KR1020170015607A KR20170093734A (ko) | 2016-02-05 | 2017-02-03 | 연마 장치 |
TW106103725A TWI623378B (zh) | 2016-02-05 | 2017-02-03 | Grinding device |
KR1020180137444A KR102338708B1 (ko) | 2016-02-05 | 2018-11-09 | 연마 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016021315 | 2016-02-05 | ||
JP2016021315 | 2016-02-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017140694A JP2017140694A (ja) | 2017-08-17 |
JP6961343B2 true JP6961343B2 (ja) | 2021-11-05 |
Family
ID=59628040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016254137A Active JP6961343B2 (ja) | 2016-02-05 | 2016-12-27 | 研磨装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6961343B2 (ja) |
KR (2) | KR20170093734A (ja) |
TW (1) | TWI623378B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109333373B (zh) * | 2018-11-19 | 2023-11-10 | 浙江嘉蓝海洋电子有限公司 | 恒力自适应作业头装置 |
KR102092871B1 (ko) * | 2020-01-22 | 2020-03-24 | 박수철 | 인젝터용 컨트롤 밸브 재생장치와 이를 이용한 인젝터용 컨트롤밸브 재생방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
US7824245B2 (en) * | 2007-08-02 | 2010-11-02 | Epir Technologies, Inc. | Automated chemical polishing system adapted for soft semiconductor materials |
JP2013233651A (ja) * | 2013-08-19 | 2013-11-21 | Nikon Corp | 研磨装置の押圧力検出装置 |
-
2016
- 2016-12-27 JP JP2016254137A patent/JP6961343B2/ja active Active
-
2017
- 2017-02-03 KR KR1020170015607A patent/KR20170093734A/ko active Search and Examination
- 2017-02-03 TW TW106103725A patent/TWI623378B/zh active
-
2018
- 2018-11-09 KR KR1020180137444A patent/KR102338708B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201741070A (zh) | 2017-12-01 |
KR20170093734A (ko) | 2017-08-16 |
TWI623378B (zh) | 2018-05-11 |
JP2017140694A (ja) | 2017-08-17 |
KR20180123467A (ko) | 2018-11-16 |
KR102338708B1 (ko) | 2021-12-14 |
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