JP6937171B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
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- JP6937171B2 JP6937171B2 JP2017114711A JP2017114711A JP6937171B2 JP 6937171 B2 JP6937171 B2 JP 6937171B2 JP 2017114711 A JP2017114711 A JP 2017114711A JP 2017114711 A JP2017114711 A JP 2017114711A JP 6937171 B2 JP6937171 B2 JP 6937171B2
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- 238000000034 method Methods 0.000 claims description 31
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- 239000010408 film Substances 0.000 description 181
- 239000010410 layer Substances 0.000 description 72
- 239000000758 substrate Substances 0.000 description 60
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- 238000005520 cutting process Methods 0.000 description 23
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 18
- 239000005020 polyethylene terephthalate Substances 0.000 description 18
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- 229920002223 polystyrene Polymers 0.000 description 10
- 239000004695 Polyether sulfone Substances 0.000 description 9
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- 239000004954 Polyphthalamide Substances 0.000 description 6
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- 229910052749 magnesium Inorganic materials 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
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- 229910052782 aluminium Inorganic materials 0.000 description 3
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
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- 239000002210 silicon-based material Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
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- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/868—Arrangements for polarized light emission
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133528—Polarisers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Polarising Elements (AREA)
- Vehicle Body Suspensions (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
Description
200 第1フィルム
300 第2フィルム
400 第1粘着剤
500 第2粘着剤
600 保護フィルム
700 下部支持フィルム
800 第3粘着剤
110 ベース基板
120 駆動層
130 有機発光素子層
140 封止層
1000〜1006 表示装置
2000 母基板
2010 表示母基板
2100 第1母フィルム
2200 第2母フィルム
Claims (10)
- 表示情報を含む光を放出する表示素子を含み、第1面と前記第1面とは逆側の第2面とを具備し、前記第2面を介して前記光を出力する表示パネルと、
前記表示パネルの前記第1面に配置された第1フィルムと、
前記表示パネルの前記第2面に配置された偏光フィルムとを含み、
前記表示パネルは、前記第1面と前記第2面とを接続する側面を具備し、前記表示パネルの前記側面の近傍にて、前記偏光フィルムの側面は、前記第1フィルムの側面より外側に突き出して位置し、
前記偏光フィルムの前記側面は、前記第2面に対して90゜より大きな角度で傾斜した構造を有し、
前記偏光フィルムの上面には、前記偏光フィルムの前記側面に隣接してヘイズ領域が形成されていることを特徴とする表示装置。 - 前記表示パネルの前記側面は、前記第1フィルムの側面より外側へと突き出して位置することを特徴とする請求項1に記載の表示装置。
- 前記表示パネルの前記側面及び前記第1フィルムの前記側面は、前記第2面に対して90゜より小さな角度で傾斜した構造を有することを特徴とする請求項2に記載の表示装置。
- 前記表示パネルの前記側面と前記第2面との傾斜角度は、前記第1フィルムの前記側面と前記第2面との傾斜角度とは異なることを特徴とする請求項3に記載の表示装置。
- 前記第1フィルムを前記表示パネルの前記第1面に粘着させるための第1粘着剤と、
前記偏光フィルムを前記表示パネルの前記第2面に粘着させるための第2粘着剤とをさらに含むことを特徴とする請求項1に記載の表示装置。 - 前記第1フィルムは、前記表示パネルを支持する支持フィルムであり、
前記第2フィルムは、偏光フィルムであることを特徴とする請求項1に記載の表示装置。 - 前記偏光フィルムを保護する保護フィルムと、
前記第1フィルムの下部に配置された下部支持フィルムと、
前記下部支持フィルムを前記第1フィルムに粘着させる第3粘着剤とをさらに含むことを特徴とする請求項1に記載の表示装置。 - 前記ヘイズ領域の幅は、1μmないし100μmであることを特徴とする請求項1に記載の表示装置。
- 前記表示素子は、有機発光素子を含むことを特徴とする請求項1に記載の表示装置。
- 表示情報を含む光を放出する表示素子を含み、第1面と前記第1面とは逆側の第2面とを具備し、前記第2面を介して前記光を出力する表示パネルと、
前記表示パネルの前記第1面に配置された支持フィルムと、
前記表示パネルの前記第2面に配置された偏光フィルムとを含み、
前記偏光フィルムの側面、前記表示パネルの側面及び前記支持フィルムの側面を含む端面は、前記支持フィルム、前記表示パネル及び前記偏光フィルムをこの順で順次に貫通するように、前記第2面の法線方向に進むにつれて、表示装置の重心から遠ざかる方向へと傾斜して延びるように形成されたことを特徴とする表示装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160072736A KR102548461B1 (ko) | 2016-06-10 | 2016-06-10 | 표시장치 및 이의 제조방법 |
KR10-2016-0072736 | 2016-06-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017220459A JP2017220459A (ja) | 2017-12-14 |
JP6937171B2 true JP6937171B2 (ja) | 2021-09-22 |
Family
ID=59067510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2017114711A Active JP6937171B2 (ja) | 2016-06-10 | 2017-06-09 | 表示装置 |
Country Status (6)
Country | Link |
---|---|
US (3) | US10686161B2 (ja) |
EP (1) | EP3255483B1 (ja) |
JP (1) | JP6937171B2 (ja) |
KR (1) | KR102548461B1 (ja) |
CN (2) | CN107492598B (ja) |
TW (2) | TWI820474B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102548461B1 (ko) | 2016-06-10 | 2023-06-28 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
KR102671371B1 (ko) | 2016-10-07 | 2024-06-04 | 삼성디스플레이 주식회사 | 플렉시블 디스플레이 장치 및 그 제조방법 |
CN106585069A (zh) * | 2016-12-23 | 2017-04-26 | 武汉华星光电技术有限公司 | 柔性基板、面板及丝网印刷机制作柔性基板、面板的方法 |
JP6887799B2 (ja) * | 2016-12-26 | 2021-06-16 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102504133B1 (ko) * | 2018-02-20 | 2023-02-28 | 삼성디스플레이 주식회사 | 디스플레이 장치와, 이의 제조 방법 |
KR102546667B1 (ko) * | 2018-05-15 | 2023-06-23 | 삼성디스플레이 주식회사 | 폴더블 표시 장치 |
KR102535554B1 (ko) * | 2018-06-28 | 2023-05-23 | 삼성디스플레이 주식회사 | 표시 장치 |
KR20200102572A (ko) | 2019-02-21 | 2020-09-01 | 삼성디스플레이 주식회사 | 표시장치 |
KR102084519B1 (ko) * | 2019-07-16 | 2020-03-04 | 주식회사 오플렉스 | 자외선(uv) 경화형 점착제층을 포함하는 백플레이트 필름 및 이를 이용한 유기 발광 표시 장치 제조 방법 |
KR20210011540A (ko) * | 2019-07-22 | 2021-02-02 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
KR20210112434A (ko) * | 2020-03-04 | 2021-09-15 | 삼성디스플레이 주식회사 | 전자 장치 제조 방법 |
KR20220007792A (ko) * | 2020-07-10 | 2022-01-19 | 삼성디스플레이 주식회사 | 표시 장치 |
WO2022030194A1 (ja) * | 2020-08-03 | 2022-02-10 | 日東電工株式会社 | 光学積層体および該光学積層体の光学フィルムを含む画像表示装置 |
CN112164308B (zh) * | 2020-08-27 | 2022-09-06 | 昆山国显光电有限公司 | 显示面板和显示装置 |
JP7494300B2 (ja) | 2021-12-22 | 2024-06-03 | 武漢華星光電半導体顕示技術有限公司 | 表示パネル、表示モジュール、及び移動端末 |
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US20170358781A1 (en) | 2017-12-14 |
TW202204992A (zh) | 2022-02-01 |
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US11476449B2 (en) | 2022-10-18 |
US10686161B2 (en) | 2020-06-16 |
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EP3255483B1 (en) | 2019-01-30 |
US11943968B2 (en) | 2024-03-26 |
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