JP6931775B2 - 軟磁性合金粉末、その製造方法、および、それを用いた圧粉磁心 - Google Patents
軟磁性合金粉末、その製造方法、および、それを用いた圧粉磁心 Download PDFInfo
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Description
図1(a)に本発明の実施の形態における軟磁性合金粉末100の断面図を示す。
軟磁性合金粉末100は、第1粉砕粉101と第2粉砕粉102とを含む。
本明細書で、粒子径、長径/短径は、それぞれ、粒子の平均値である。本明細書において、粒子径とは、レーザー回折・散乱式粒子径分布測定装置「マイクロトラックMT3000(2)シリーズ」(マイクロトラック・ベル株式会社)を用いて、試料を水で希釈、撹拌し、室温下で測定した値である。
図1(b)に特許文献1の従来例である粉砕粉とアトマイズ粉を混合した断面図を示す。図1(b)のように、粒径20μm以上の粉砕粉103と粒径3μm以上のアトマイズ粉104との混合粉末の場合、アトマイズ粉104が球形状であることから、粉砕粉103の周りに、アトマイズ粉104が入りこむ際に、粉砕粉103とアトマイズ粉104との接触面積が小さく、図1(a)に比べて、充填率が低下する。
軟磁性合金粉末100の製造方法について図2を用いて、説明する。
アーク溶解などを用いて、合金化したFe系合金組成物を、高周波加熱などによって融解し、液体急冷法を用いて、Fe系の軟磁性合金薄帯201を作製する。この時、Fe系の軟磁性合金薄帯201の厚みは、20μm以上40μm以下であるとよい。
次に、軟磁性合金薄帯201を、粉砕機を使用せず、1mm四方にまで細かく裁断し、粗粉末202を作製する。粉砕機を使用せず、一定大きさに加工する。
次に、細断した粗粉末202を粉砕することで、軟磁性合金粉末100を得る。軟磁性合金薄帯または、薄片の粉砕は、一般的な粉砕装置を使用できる。
図3を用いて、粗粉末202より軟磁性合金粉末100を作製する製造メカニズムを説明する。図3(a)に示す粗粉末202を回転ミルなどの粉砕機で粉砕する。このことで、図3(b)に示すように、粗粉末202の表面がへき開され、第2粉砕粉102が削り取られ、表面に粉砕痕105を有する第1粉砕粉101となる。粗粉末202は、表面がへき開することで、粒径が20μm以上の角がなく丸みを帯びた第1粉砕粉101となる。
次に、第1粉砕粉101、第2粉砕粉102を熱処理して、粉砕による内部ひずみを取り除いたり、αFe結晶層を析出させたりする。熱処理装置は、例えば、熱風炉、ホットプレス、ランプ、シースー金属ヒーター、セラミックヒーター、ロータリーキルンなどを使用できる。この時、ホットプレスなどを用いて、急速加熱することで、結晶化がより進み、第1粉砕粉101の表面のへき開がさらに進む。したがって、粒径が小さい粉砕粉の割合を増やせる。
実施の形態における圧粉磁心の作製は、第1粉砕粉101、第2粉砕粉102と、フェノール樹脂やシリコーン樹脂などの絶縁性が良好で耐熱性が高いバインダーで混合攪拌機を用いて、造粒粉を作製する。
(実施例)
急冷単ロール法により作製したFe73.5−Cu1−Nb3−Si13.5−B9(原子%)のFe系軟磁性合金薄帯として、厚み20μm以上40μm以下の軟磁性合金薄帯201を用いた。
(比較例)
急冷単ロール法により作製したFe73.5−Cu1−Nb3−Si13.5−B9(原子%)のFe系の軟磁性合金薄帯201として、厚み20μm以上40μm以下の薄帯を用いた。この薄帯を10mm四方に細断し、粗粉末を得た。粗粉末を回転ミルを用いて粉砕し、軟磁性合金薄帯の粉砕粉を得た。
実施例および、比較例はともに、上記に述べた通り、回転ミルを用いて、粉砕していることから、表面がへき開して、粒径が20μm以上の角がなく、丸みを帯びた形状をしている。
粉砕して得られたそれぞれの軟磁性合金薄帯の粉砕粉の粒度分布を、マイクロトラックMT3000(2)シリーズを用いて測定した。図4(a)、図4(b)に、実施例および、比較例における粉砕粉の粒度分布を示す。図4(a)、図4(b)は横軸が粒径(μm)、縦軸が各粒径の粉砕粉が存在する頻度を表している。
ここで、D10%とは、全体の個数を100%とした時の小さい方から10%の位置にある粒子の粒子径である。
本発明の効果について、図4(a)、図4(b)を参照しながら、説明する。
2 粉砕粉
3 アトマイズ球状粉
100 軟磁性合金粉末
101 第1粉砕粉
102 第2粉砕粉
103 粉砕粉
104 アトマイズ粉
105 粉砕痕
201 軟磁性合金薄帯
202 粗粉末
203 微粉末
Claims (9)
- 平均粒径20μm以上で、長径/短径の平均値が1.2以上1.8以下である平板状の第1粉砕粉と、
平均粒径3μm未満で、長径/短径の平均値が1.1以上1.6以下である平板状の第2粉砕粉と、を含む軟磁性合金粉末であり、
前記軟磁性合金粉末の累積分布は、D10%が3μm未満、かつ、D50%が10〜15μmである軟磁性合金粉末。 - 前記第1粉砕粉と前記第2粉砕粉の厚みは1μm以上50μm以下である請求項1記載の軟磁性合金粉末。
- 前記軟磁性合金粉末の累積分布比D10%/D50%は、0.30未満である請求項1又は2に記載の軟磁性合金粉末。
- 前記軟磁性合金粉末の累積分布はD10%が1μm以下、累積分布の割合であるD10%/D50%が、0.20以下である請求項1又は2記載の軟磁性合金粉末。
- 請求項1〜4のいずれか1項に記載の軟磁性合金粉末と、
バインダーと、を含む圧粉磁心。 - 軟磁性合金薄帯を租粉末に加工する第1加工と、
前記租粉末を粉砕機で粉砕する第2加工と、
前記第2加工で得られた粉末を分級する分級工程と、を含み、
前記粉末の累積分布が、D10%が3μm未満、かつ、D50%が10〜15μmである軟磁性合金粉末の製造方法。 - 前記軟磁性合金薄帯の厚みが、20〜40μmである請求項6に記載の軟磁性合金粉末の製造方法。
- 前記租粉末の大きさは、1mm四方以下である請求項6または7記載の軟磁性合金粉末の製造方法。
- 前記第1加工では、前記軟磁性合金薄帯を面方向で裁断する請求項6から8のいずれか1項に記載の軟磁性合金粉末の製造方法。
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CN201910042282.4A CN110153383A (zh) | 2018-02-15 | 2019-01-16 | 软磁性合金粉末、其制造方法、以及使用其的压粉磁芯 |
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