JP6567259B2 - 軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置 - Google Patents
軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置 Download PDFInfo
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- JP6567259B2 JP6567259B2 JP2014175877A JP2014175877A JP6567259B2 JP 6567259 B2 JP6567259 B2 JP 6567259B2 JP 2014175877 A JP2014175877 A JP 2014175877A JP 2014175877 A JP2014175877 A JP 2014175877A JP 6567259 B2 JP6567259 B2 JP 6567259B2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/08—Cores, Yokes, or armatures made from powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
- B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
- C22C2202/02—Magnetic
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C33/00—Making ferrous alloys
- C22C33/02—Making ferrous alloys by powder metallurgy
- C22C33/0257—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
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- Soft Magnetic Materials (AREA)
- Powder Metallurgy (AREA)
Description
本発明の軟磁性粒子粉末は、扁平状の軟磁性粒子からなる。
D10/D50 > 0.45 (2)
D10/D50 > 0.48 (3)
D10/D50 > 0.50 (4)
D10/D50 が上記式を満たすことにより、軟磁性フィルムの薄膜化を図りながら、軟磁性フィルムの比透磁率に良好にすることができる。
0.70 > D10/D50 (6)
また、軟磁性粒子粉末の粒子径D90は、例えば、80μm以上、好ましくは、100μm以上、より好ましくは、130μm以上であり、また、例えば、350μm以下、好ましくは、200μm以下、より好ましくは、150μm以下である。これにより、軟磁性フィルムの成膜性を向上しつつ、軟磁性フィルムの比透磁率を良好にすることができる。
本発明の軟磁性樹脂組成物は、軟磁性粒子粉末および樹脂成分を含有する。
本発明の軟磁性フィルムは、軟磁性樹脂組成物からシート状に形成される。
本発明の軟磁性フィルム積層回路基板は、軟磁性フィルムを回路基板に積層することにより製造される。
本発明の位置検出装置は、例えば、上記の軟磁性フィルム積層回路基板およびその軟磁性フィルム積層回路基板に実装されるセンサ部を備えるセンサ基板と、センサ基板の上に対向配置される位置検出平面板と、を備えている。
(軟磁性粒子粉末の分級)
扁平状の軟磁性粒子粉末としてセンダスト(Fe−Si−Al合金、商品名「SP−7」、扁平状、メイト社製、保磁力67A/m)を用いた。乾式分級器(日清エンジニアリング社製、ターボクラシファイアTC−15NS)を用いて、回転羽根の回転速度2140rpm、風量1.3m3/minの条件で、この軟磁性粒子粉末に送風し、重量の軽い粒子を吹き飛ばし、重量の重い粒子を採取することにより、実施例1の軟磁性粒子粉末を得た。
次いで、軟磁性樹脂組成物における軟磁性粒子の含有割合(固形分)が60体積%となるように、実施例1の軟磁性粒子粉末900質量部(90質量%)、アクリル酸エステル系ポリマー50質量部、ビスフェノールA型エポキシ樹脂(1)20質量部、ビスフェノールA型エポキシ樹脂(2)12質量部、フェノールアラルキル樹脂18質量部、および、熱硬化触媒0.5質量部を混合することにより、軟磁性樹脂組成物を得た。
乾式分級器において、回転羽根の回転速度1700rpm、風量1.5m3/minの条件に変更した以外は実施例1と同様に分級して、実施例2の軟磁性粒子粉末を得た。この実施例2の軟磁性粒子粉末を用いた以外は実施例1と同様にして、軟磁性フィルムを製造した。この結果を表1に示す。
乾式分級器において、回転羽根の回転速度1190rpm、風量1.2m3/minの条件に変更した以外は実施例1と同様に分級して、実施例3の軟磁性粒子粉末を得た。この実施例3の軟磁性粒子粉末を用いた以外は実施例1と同様にして、軟磁性フィルムを製造した。この結果を表1に示す。
乾式分級器において、回転羽根の回転速度850rpm、風量1.4m3/minの条件に変更した以外は実施例1と同様に分級して、参考例4の軟磁性粒子粉末を得た。この参考例4の軟磁性粒子粉末を用いた以外は実施例1と同様にして、軟磁性フィルムを製造した。この結果を表1に示す。
乾式分級器において、回転羽根の回転速度2500rpm、風量1.4m3/minの条件に変更した以外は実施例1と同様に分級して、参考例5の軟磁性粒子粉末を得た。この参考例5の軟磁性粒子粉末を用いた以外は実施例1と同様にして、軟磁性フィルムを製造した。この結果を表1に示す。
扁平状の軟磁性粒子としてセンダスト(Fe−Si−Al合金、商品名「FME3DH」、扁平状、真比重6.8g/cm3、山陽特殊製鋼社製)を用い、乾式分級器において、回転羽根の回転速度2900rpm、風量1.4m3/minの条件に変更した以外は実施例1と同様に分級して、参考例6の軟磁性粒子粉末を得た。この参考例6の軟磁性粒子粉末を用いた以外は実施例1と同様にして、軟磁性フィルムを製造した。この結果を表1に示す。
乾式分級器において、回転羽根の回転速度2750rpm、風量1.3m3/minの条件に変更した以外は参考例6と同様に分級して、参考例7の軟磁性粒子粉末を得た。この参考例7の軟磁性粒子粉末を用いた以外は実施例1と同様にして、軟磁性フィルムを製造した。この結果を表1に示す。
乾式分級器において、回転羽根の回転速度1850rpm、風量1.5m3/minの条件に変更し、重量の軽い粒子を採取した以外は実施例1と同様に分級して、比較例1の軟磁性粒子粉末を得た。この比較例1の軟磁性粒子粉末を用いた以外は実施例1と同様にして、軟磁性フィルムを製造した。この結果を表1に示す。
乾式分級器において、回転羽根の回転速度2800rpm、風量1.1m3/minの条件に変更した以外は実施例1と同様に分級して、比較例2の軟磁性粒子粉末を得た。この比較例2の軟磁性粒子粉末を用いた以外は実施例1と同様にして、軟磁性フィルムを製造した。この結果を表1に示す。
各実施例、各参考例および各比較例において、軟磁性樹脂組成物を塗布して軟磁性フィルムを製造した際に、フィルム状に成形でき、かつ、フィルム表面が均一であった場合を○と評価し、フィルム状に成膜できたが、フィルム表面が不均一であった場合を△と評価し、フィルム状に成形できなかった場合を×と評価した。この結果を表1に示す。
各実施例、各参考例および各比較例で製造した軟磁性フィルムの比透磁率は、インピーダンスアナライザ(Agilent社製、商品番号「4294A」)を用いて、1MHzにおけるインピーダンスを測定することにより求めた。この結果を表1に示す。
・アクリル酸エステル系ポリマー:商品名「パラクロンW−197CM」、アクリル酸エチル−メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー、根上工業社製
・ビスフェノールA型エポキシ樹脂(1):商品名「エピコート1004」、エポキシ当量875〜975g/eq、JER社製、
・ビスフェノールA型エポキシ樹脂(2):商品名、「エピコートYL980」、エポキシ当量180〜190g/eq、JER社製
・フェノールアラルキル樹脂:商品名「ミレックスXLC−4L」、水酸基当量170g/eq、三井化学社製
・熱硬化触媒:商品名「キュアゾール2PHZ−PW」、2−フェニル−1H−イミダゾール4,5−ジメタノール、四国化成社製
2 回路基板
6 樹脂成分
7 軟磁性粒子
8 軟磁性フィルム積層回路基板
Claims (5)
- 軟磁性粒子粉末および樹脂成分を含有し、
前記軟磁性粒子粉末は、扁平状の軟磁性粒子からなる軟磁性粒子粉末であって、
レーザー回折式粒度分布測定器により測定される粒子径D10および粒子径D50が下
記式: D10/D50 > 0.45
を満たし、
粒子径D90が、100μm以上、150μm以下であり、
前記樹脂成分が、エポキシ樹脂、フェノール樹脂およびアクリル樹脂を含有することを特徴とする、軟磁性樹脂組成物。 - 粒子径D50が、40μm以上であることを特徴とする、請求項1に記載の軟磁性樹脂組成物。
- 請求項1または2に記載の軟磁性樹脂組成物から形成されることを特徴とする、軟磁性フィルム。
- 請求項3に記載の軟磁性フィルムを回路基板に積層することにより得られることを特徴とする、軟磁性フィルム積層回路基板。
- 請求項4に記載の軟磁性フィルム積層回路基板を備えることを特徴とする、位置検出装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014175877A JP6567259B2 (ja) | 2013-10-01 | 2014-08-29 | 軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置 |
KR1020167007530A KR102253203B1 (ko) | 2013-10-01 | 2014-09-18 | 연자성 입자 분말, 연자성 수지 조성물, 연자성 필름, 연자성 필름 적층 회로 기판 및 위치 검출 장치 |
US15/025,473 US10418161B2 (en) | 2013-10-01 | 2014-09-18 | Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device |
PCT/JP2014/074638 WO2015049993A1 (ja) | 2013-10-01 | 2014-09-18 | 軟磁性粒子粉末、軟磁性樹脂組成物、軟磁性フィルム、軟磁性フィルム積層回路基板および位置検出装置 |
EP14850185.1A EP3054462B1 (en) | 2013-10-01 | 2014-09-18 | Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device |
CN201480054812.2A CN105593953B (zh) | 2013-10-01 | 2014-09-18 | 软磁性颗粒粉末、软磁性树脂组合物、软磁性薄膜、软磁性薄膜层叠电路基板及位置检测装置 |
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US10287413B2 (en) | 2016-12-19 | 2019-05-14 | 3M Innovative Properties Company | Thermoplastic polymer composite containing soft, ferromagnetic particulate material and methods of making thereof |
JP7122308B2 (ja) * | 2016-12-19 | 2022-08-19 | スリーエム イノベイティブ プロパティズ カンパニー | 軟強磁性粒子材料を含有する熱可塑性ポリマー複合体及びその製造方法 |
CN106784399B (zh) * | 2016-12-20 | 2018-10-30 | 武汉华星光电技术有限公司 | 制作oled时用于承载oled的承载基板及其制作方法 |
CN106601429B (zh) * | 2017-01-19 | 2018-06-19 | 东莞易力禾电子有限公司 | 高磁导率磁性薄膜及其制备方法 |
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JP7323268B2 (ja) | 2018-03-16 | 2023-08-08 | 日東電工株式会社 | 磁性配線回路基板およびその製造方法 |
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