JP6921068B2 - 取り付け構造用メタライズポリマー、セラミックス、及び複合物 - Google Patents
取り付け構造用メタライズポリマー、セラミックス、及び複合物 Download PDFInfo
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- JP6921068B2 JP6921068B2 JP2018521992A JP2018521992A JP6921068B2 JP 6921068 B2 JP6921068 B2 JP 6921068B2 JP 2018521992 A JP2018521992 A JP 2018521992A JP 2018521992 A JP2018521992 A JP 2018521992A JP 6921068 B2 JP6921068 B2 JP 6921068B2
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K20/023—Thermo-compression bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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Description
本出願は、米国仮出願第62/246909号(2015年10月27日出願)及び米国仮出願第62/312012号(2016年3月23日出願)の優先権を主張する米国出願第15/334986号(発明の名称「取り付け構造用メタライズポリマー、セラミックス、及び複合物」、2016年10月26日出願)の優先権を主張するものである。
非金属性コンポーネントの表面に金属化連携層を形成すること、
第2コンポーネントの金属性表面と対になるように、前記非金属性コンポーネントの表面を位置決めすること、及び
金属間接合技術を用いて、前記金属化連携層と、前記第2コンポーネントの対になった金属性表面とを接合すること
からなる製造方法に関する。
・非導電性スペーサとしての高性能ボードの使用(限定はされないが、Rogers Corporation of Rogers(米国コネチカット州)製のRogers LoPro RO4000シリーズ 高周波ラミネート等)。これは、ラミネート(IE−導電性層で予備包囲)として利用され得るか、及び/又は、前述の技術によって引き続き金属化される、包囲されていないコアとなり得る。
・非導電性スペーサとしてのパウダーコーティングの使用。
プラスチック性コンポーネント、セラミック性コンポーネント、又はプラスチックセラミックス複合物三次元コンポーネント等の非金属性コンポーネントを、酸素含有プラズマで修飾する。次いで、非金属性コンポーネントの表面をCrでスパッタリングし、後続のはんだ付け可能な金属に連携層を形成する。連携層は、50Å〜500Åの厚さである。連携層は、好ましくは75Å〜150Åの厚さである。スパッタリングされた後続のはんだ付け可能な金属は、Cu、Ni、Au、Pt、Pdや、Ni、Pt、Pd等から選択される。はんだ付け可能な金属の厚さは、500Åよりも大きく、50000Åよりも小さければよく、例えば、1000Åよりも大きく、5000Åよりも小さい。
本実施例では、結合材料として金を用い、連携層としてクロムを用いる圧着を追加して、実施例Aの技術を繰り返す。
本実施例では、一方の表面にニッケル、もう一方にPd、又は、一方にAu、他方にニッケル等の不適合な金属の組み合わせで、実施例Aの技術を繰り返す。
本実施例では、ポリアミド、ポリテトラフルオライド、ポリジフルオライド等の接着材による結合が困難な非金属性コンポーネントで、実施例Aの技術を繰り返す。
本実施例では、結合している2つの非金属性コンポーネントが共に結合される。両コンポーネントの対になる表面は、金属化連携層で選択的にスパッタリングされ、金属間接着等の金属間接合技術が適用されて、両表面が接合される。このような金属間接着により、金属化連携層への良好な結合が得られ、プラスチックとプラスチックとの結合、セラミックスとセラミックスとの結合、又はセラミックスとプラスチックとの結合についての従来の技術と比較して、接着性が向上する。
Claims (15)
- 第1コンポーネントと第2コンポーネントとを接合し、支持するように構成された非金属性スペーサコンポーネントの第1表面に、第1金属化連携層を形成すること、
前記非金属性スペーサコンポーネントの第2表面に、前記第1金属化連携層とは分離した第2金属化連携層を形成すること、
前記第1コンポーネントの金属性表面と前記非金属性スペーサコンポーネントの前記第2表面とが対になるように、該第2表面を位置決めし、該第2表面に形成された前記第2金属化連携層と、該第2表面と対になった該第1コンポーネントの金属性表面とを接合すること、及び
前記第2コンポーネントの金属性表面と前記非金属性スペーサコンポーネントの前記第1表面とが対になるように、該第1表面を位置決めし、該第1表面に形成された前記第1金属化連携層と、該第1表面と対になった該第2コンポーネントの金属性表面とを接合すること
を含み、
前記第1コンポーネントの金属性表面が、該第1コンポーネントと異なる材料からなり、
前記第2コンポーネントの金属性表面が、該第2コンポーネントと異なる材料からなる、製造方法。 - 前記非金属性スペーサコンポーネントが、
ポリマー性コンポーネント、
セラミック性コンポーネント、
セラミックポリマー複合コンポーネント、及び
樹脂プラスチック射出成型コンポーネント
からなる群の1つである、請求項1に記載の方法。 - 前記非金属性スペーサコンポーネントの第2表面に形成された前記第2金属化連携層と、該第2表面と対になった前記第1コンポーネントの金属性表面との接合、及び、該非金属性スペーサコンポーネントの第1表面に形成された前記第1金属化連携層と、該第1表面と対になった前記第2コンポーネントの金属性表面との接合を、圧縮溶解溶接で行う、請求項1又は2に記載の方法。
- 前記第1金属化連携層及び前記第2金属化連携層の形成を、
電気メッキ、
無電解メッキ、
真空蒸着、
Ti、Cr、Ta、Ru、ニクロム、及びNiVの1つ又はそれ以上を含む金属のスパッタリング、並びに
気相蒸着
の少なくとも1つを含む技術で行う、請求項1〜3のいずれかに記載の方法。 - さらに、前記非金属性スペーサコンポーネントの第1表面に前記第1金属化連携層を形成する前及び該非金属性スペーサコンポーネントの第2表面に前記第2金属化連携層を形成する前に、該第1表面及び第2表面を、
酸素、アルゴン、又はその双方を含有するイオン源、及び
酸素、アルゴン、又はその双方を含有するプラズマ源
の少なくとも1つによって修飾することを含む、請求項1〜4のいずれかに記載の方法。 - 前記非金属性スペーサコンポーネントの第1表面及び第2表面が、三次元表面である、請求項1〜5のいずれかに記載の方法。
- さらに、前記非金属性スペーサコンポーネントの第1表面に形成された前記第1金属化連携層と、該第1表面と対になった前記第2コンポーネントの金属性表面とを接合する前に、該第1金属化連携層上に、金層を結合させること又は接着させることを含む、請求項6に記載の方法。
- 前記非金属性スペーサコンポーネントが、樹脂プラスチック射出成型コンポーネントである、請求項6又は7に記載の方法。
- 前記非金属性スペーサコンポーネントの第2表面に形成された前記第2金属化連携層と、該第2表面と対になった前記第1コンポーネントの金属性表面との接合、及び、該非金属性スペーサコンポーネントの第1表面に形成された前記第1金属化連携層と、該第1表面と対になった前記第2コンポーネントの金属性表面との接合を、
前記第1コンポーネントの金属性表面及び前記第2コンポーネントの金属性表面に取り付けられるはんだのリフロー、並びに、
前記第2金属化連携層及び前記第1金属化連携層に取り付けられるはんだのリフロー
の少なくとも1つを含む技術にて行う、請求項1〜8のいずれかに記載の方法。 - 前記はんだが、Cu、Au、Ag、Ni、Ru、Cd、Sn、Rd、真ちゅう、及びPbの1つ又はそれ以上を含むはんだ付け可能な金属で、前記非金属性スペーサコンポーネントに結合している、請求項9に記載の方法。
- 前記はんだ付け可能な金属が、前記第2金属化連携層及び前記第1金属化連携層によって、前記非金属性スペーサコンポーネントに密着して結合している、請求項10に記載の方法。
- 前記はんだ付け可能な金属が、前記はんだへと充分に溶解することなく、金属間化合物を形成している、請求項10又は11に記載の方法。
- 前記第2コンポーネントが、金属コンポーネントである、請求項1〜12のいずれかに記載の方法。
- 前記第2コンポーネントが、第2非金属性コンポーネントであり、前記非金属性スペーサコンポーネントの第1表面と対になった該第2コンポーネントの金属性表面が、第3金属化連携層を含む、請求項1〜12のいずれかに記載の方法。
- 前記第2非金属性コンポーネントが、
ポリマー性コンポーネント、
セラミック性コンポーネント、
セラミックポリマー複合コンポーネント、及び
樹脂プラスチック射出成型コンポーネント
からなる群の1つである、請求項14に記載の方法。
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US62/312,012 | 2016-03-23 | ||
US15/334,986 US20170113297A1 (en) | 2015-10-27 | 2016-10-26 | Metallizing polymers, ceramics and composites for attachment structures |
US15/334,986 | 2016-10-26 | ||
PCT/US2016/058902 WO2017075076A1 (en) | 2015-10-27 | 2016-10-26 | Metallizing polymers, ceramics and composites for attachment structures |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10925663B2 (en) | 2016-06-27 | 2021-02-23 | Mound Laser & Photonics Center, Inc. | Metallized components and surgical instruments |
US10625083B2 (en) | 2016-06-27 | 2020-04-21 | Hutchinson Technology Incorporated | Metallized components and surgical instruments |
US20180269378A1 (en) * | 2017-03-17 | 2018-09-20 | Rochester Institute Of Technology | Pulse Energy Manipulation of Material Properties |
US11109493B2 (en) * | 2018-03-01 | 2021-08-31 | Hutchinson Technology Incorporated | Electroless plating activation |
US20210187646A1 (en) * | 2019-12-19 | 2021-06-24 | Honeywell Federal Manufacturing & Technologies, Llc | Solderable coating for additive manufactured oxidizing metals |
CN112157257B (zh) * | 2020-09-17 | 2022-04-29 | 中国科学院电工研究所 | 一种强韧一体性Cu/Sn/Ag焊接材料原位增韧方法 |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1007693A (en) * | 1963-05-16 | 1965-10-22 | Tetra Pak Ab | A method of bonding strip metal to a ceramic or other insulating surface |
US4099969A (en) * | 1974-10-10 | 1978-07-11 | Xerox Corporation | Coating method to improve adhesion of photoconductors |
DE2728465C2 (de) * | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
DE2902242C2 (de) * | 1979-01-20 | 1981-03-26 | W.C. Heraeus Gmbh, 63450 Hanau | Dehnungsmeßstreifen |
US4268339A (en) * | 1979-07-17 | 1981-05-19 | General Electric Company | Process for radiation cured continuous laminates |
US4594292A (en) * | 1983-01-18 | 1986-06-10 | Sumitomo Metal Industries, Ltd. | Metal-resin-metal sandwich laminates suitable for use in press forming |
NL8300422A (nl) * | 1983-02-04 | 1984-09-03 | Philips Nv | Methode voor de vervaardiging van een optisch uitleesbare informatieschijf. |
US4499157A (en) * | 1983-05-31 | 1985-02-12 | Hughes Aircraft Company | Solderable plated plastic components and processes for manufacture and soldering |
US4495253A (en) * | 1983-05-31 | 1985-01-22 | Hughes Aircraft Company | Solderable plated plastic components and process for plating _ |
DE3479135D1 (en) * | 1983-05-31 | 1989-08-31 | Hughes Aircraft Co | Solderable plated plastic components |
US6252001B1 (en) * | 1986-09-12 | 2001-06-26 | The Dow Chemical Company | Ethynyl substituted aromatic compounds, synthesis, polymers and uses thereof |
US4837068A (en) * | 1987-01-27 | 1989-06-06 | The Foxboro Company | Compliant diaphragm material |
US4774126A (en) * | 1987-07-20 | 1988-09-27 | General Electric Company | Solderable thermoplastic structure |
US5230927A (en) * | 1989-02-16 | 1993-07-27 | Mitsubishi Gas Chemical Company, Inc. | Method for metal-plating resin molded articles and metal-plated resin molded articles |
DE69000924T2 (de) * | 1989-04-28 | 1993-06-03 | Nikken Ind Corp | Leiterplatte und ueberzug. |
US5049978A (en) * | 1990-09-10 | 1991-09-17 | General Electric Company | Conductively enclosed hybrid integrated circuit assembly using a silicon substrate |
US5250843A (en) * | 1991-03-27 | 1993-10-05 | Integrated System Assemblies Corp. | Multichip integrated circuit modules |
JPH06334279A (ja) * | 1993-05-20 | 1994-12-02 | Minolta Camera Co Ltd | 多層フレキシブル電装基板 |
JP3356568B2 (ja) * | 1994-11-30 | 2002-12-16 | 鐘淵化学工業株式会社 | 新規なフレキシブル銅張積層板 |
US6140703A (en) * | 1996-08-05 | 2000-10-31 | Motorola, Inc. | Semiconductor metallization structure |
US5841111A (en) * | 1996-12-19 | 1998-11-24 | Eaton Corporation | Low resistance electrical interface for current limiting polymers by plasma processing |
DE19803392C2 (de) * | 1998-01-29 | 2000-08-03 | Daimlerchrysler Aerospace Ag | Verfahren zur Herstellung einer Lotverbindung, Lotverbindung und deren Verwendung |
TW420853B (en) * | 1998-07-10 | 2001-02-01 | Siemens Ag | Method of manufacturing the wiring with electric conducting interconnect between the over-side and the underside of the substrate and the wiring with such interconnect |
US6251252B1 (en) * | 1998-08-25 | 2001-06-26 | Lucent Technologies Inc. | Metalization of non-hermetic optical fibers |
JP3199691B2 (ja) * | 1998-11-18 | 2001-08-20 | 日東電工株式会社 | フレキシブル配線板 |
AU2003235329A1 (en) * | 2002-04-19 | 2003-11-03 | Mitsubishi Materials Corporation | Circuit board, process for producing the same and power module |
US6870708B1 (en) * | 2002-08-28 | 2005-03-22 | Hutchinson Technology Incorporated | Weld pads for head suspensions |
US6667475B1 (en) * | 2003-01-08 | 2003-12-23 | Applied Materials, Inc. | Method and apparatus for cleaning an analytical instrument while operating the analytical instrument |
US8008775B2 (en) * | 2004-09-09 | 2011-08-30 | Megica Corporation | Post passivation interconnection structures |
US20080063889A1 (en) * | 2006-09-08 | 2008-03-13 | Alan Duckham | Reactive Multilayer Joining WIth Improved Metallization Techniques |
US20070264496A1 (en) * | 2006-05-12 | 2007-11-15 | Wavezero, Inc. | Solderable Plastic EMI Shielding |
US20090008431A1 (en) * | 2007-07-03 | 2009-01-08 | Kossi Zonvide | Solderable EMI Gasket and Grounding Pad |
CN101314192B (zh) * | 2008-06-04 | 2011-02-02 | 哈尔滨工业大学 | 一种金属材料与非金属复合材料的连接方法 |
US9296158B2 (en) * | 2008-09-22 | 2016-03-29 | Johnson & Johnson Vision Care, Inc. | Binder of energized components in an ophthalmic lens |
US8338287B2 (en) * | 2010-03-24 | 2012-12-25 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
JP5705506B2 (ja) * | 2010-11-08 | 2015-04-22 | 昭和電工株式会社 | 絶縁基板用クラッド材 |
US20120196039A1 (en) * | 2011-01-31 | 2012-08-02 | Camtek Ltd. | Method for enhancing metallization in selective deposition processes |
DE102011054362A1 (de) * | 2011-10-10 | 2013-04-11 | Thyssenkrupp Steel Europe Ag | Verbundblechteil mit metallischem Randbereich |
DE102012107876A1 (de) * | 2012-08-27 | 2014-02-27 | Epcos Ag | Trägerplatte, Vorrichtung mit Trägerplatte sowie Verfahren zur Herstellung einer Trägerplatte |
WO2014080536A1 (ja) * | 2012-11-20 | 2014-05-30 | Dowaメタルテック株式会社 | 金属-セラミックス接合基板およびその製造方法 |
CN103341674B (zh) * | 2013-06-26 | 2015-05-27 | 哈尔滨工业大学 | 一种陶瓷基复合材料与金属材料的石墨烯辅助钎焊方法 |
CN203697600U (zh) * | 2013-12-10 | 2014-07-09 | 中国航空工业第六一八研究所 | 一种非金属微孔材料表面金属化膜层 |
US9732434B2 (en) * | 2014-04-18 | 2017-08-15 | Lam Research Corporation | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes |
US20160343646A1 (en) * | 2015-05-21 | 2016-11-24 | Qualcomm Incorporated | High aspect ratio interconnect for wafer level package (wlp) and integrated circuit (ic) package |
-
2016
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- 2016-10-26 CN CN201680069359.1A patent/CN108290241A/zh active Pending
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