JP6907944B2 - 固体撮像素子及び電子機器 - Google Patents
固体撮像素子及び電子機器 Download PDFInfo
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- JP6907944B2 JP6907944B2 JP2017562495A JP2017562495A JP6907944B2 JP 6907944 B2 JP6907944 B2 JP 6907944B2 JP 2017562495 A JP2017562495 A JP 2017562495A JP 2017562495 A JP2017562495 A JP 2017562495A JP 6907944 B2 JP6907944 B2 JP 6907944B2
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Description
前記光電変換素子が形成されている半導体層と、配線及び外部接続用のパッドが形成されている配線層とが積層され、前記集光層及び前記半導体層を貫通する貫通孔により前記パッドの第1の面の少なくとも一部が露出している画素基板を備え、前記パッドは、1つの部材からなり、前記配線層の少なくとも2層以上の高さを有する。
1.本技術が適用される固体撮像素子
2.第1の実施の形態(パッドに配線を直接接続した例)
3.第2の実施の形態(ビアを介してパッドを配線に接続した例)
4.第3の実施の形態(ビアを介してパッドと制御基板を接続した第1の例)
5.第4の実施の形態(ビアを介してパッドと制御基板を接続した第2の例)
6.変形例
7.固体撮像素子の使用例
{基本的なシステム構成}
図1は、本技術が適用される固体撮像素子、例えばX−Yアドレス方式固体撮像素子の一種であるCMOSイメージセンサの構成の概略を示すシステム構成図である。ここで、CMOSイメージセンサとは、CMOSプロセスを応用して、または、部分的に使用して製造されるイメージセンサである。
次に、上述した画素アレイ部11の各画素の構成について説明する。図2は、画素アレイ部11に設けられた1つの画素の構成例を示す回路図である。
次に、図3乃至図12を参照して、図1のCMOSイメージセンサ10の第1の実施の形態であるCMOSイメージセンサ10aについて説明する。
図3は、CMOSイメージセンサ10aの構成例の一部を模式的に示す断面図である。
次に、図4乃至図6を参照して、CMOSイメージセンサ10aの製造方法について説明する。
次に、図7乃至図11を参照して、図5の工程2のパッド125の製造工程の詳細な例について説明する。
まず、図7及び図8を参照して、パッド125の製造工程の第1の例について説明する。
次に、図9を参照して、パッド125の製造工程の第2の例について説明する。
次に、図10を参照して、パッド125の製造工程の第3の例について説明する。
次に、図11を参照して、パッド125の製造工程の第4の例について説明する。この第4の例は、第3の例と比較して、溝201の外側にもパッド125を形成するようにしたものである。
次に、図12を参照して、パッド125の結線例について説明する。図12のA及び図12のBは、画素基板101のパッド125付近を上から見た図である。
次に、図13及び図14を参照して、図1のCMOSイメージセンサ10の第2の実施の形態であるCMOSイメージセンサ10bについて説明する。
図13は、CMOSイメージセンサ10bの構成例の一部を模式的に示す断面図である。なお、図中、図3と対応する部分には、同じ符号を付してある。
次に、図14を参照して、CMOSイメージセンサ10bにおけるパッド125の結線例について説明する。図14のA及び図14のBは、画素基板101のパッド125付近を下から見た図である。
次に、図15及び図16を参照して、図1のCMOSイメージセンサ10の第3の実施の形態であるCMOSイメージセンサ10cについて説明する。
図15は、CMOSイメージセンサ10cの構成例の一部を模式的に示す断面図である。なお、図中、図3と対応する部分には、同じ符号を付してある。
次に、図16を参照して、CMOSイメージセンサ10cにおけるパッド125の結線例について説明する。図16のA及び図16のBは、画素基板101のパッド125付近を上から見た図である。
次に、図17及び図18を参照して、図1のCMOSイメージセンサ10の第4の実施の形態であるCMOSイメージセンサ10dについて説明する。
図17は、CMOSイメージセンサ10dの構成例の一部を模式的に示す断面図である。なお、図中、図15と対応する部分には、同じ符号を付してある。
次に、図18を参照して、CMOSイメージセンサ10dにおけるパッド125の結線例について説明する。図18のA及び図18のBは、画素基板101のパッド125付近を上から見た図である。
以下、上述した本技術の実施の形態の変形例について説明する。
図19は、上述の固体撮像素子の使用例を示す図である。
・自動停止等の安全運転や、運転者の状態の認識等のために、自動車の前方や後方、周囲、車内等を撮影する車載用センサ、走行車両や道路を監視する監視カメラ、車両間等の測距を行う測距センサ等の、交通の用に供される装置
・ユーザのジェスチャを撮影して、そのジェスチャに従った機器操作を行うために、TVや、冷蔵庫、エアーコンディショナ等の家電に供される装置
・内視鏡や、赤外光の受光による血管撮影を行う装置等の、医療やヘルスケアの用に供される装置
・防犯用途の監視カメラや、人物認証用途のカメラ等の、セキュリティの用に供される装置
・肌を撮影する肌測定器や、頭皮を撮影するマイクロスコープ等の、美容の用に供され装置
・スポーツ用途等向けのアクションカメラやウェアラブルカメラ等の、スポーツの用に供される装置
・畑や作物の状態を監視するためのカメラ等の、農業の用に供される装置
図20は、本技術を適用した半導体装置を有する電子機器500の構成例を示す図である。
入射光を光電変換素子に集光する集光層と、
前記光電変換素子が形成されている半導体層と、
配線及び外部接続用のパッドが形成されている配線層と
が積層され、前記集光層及び前記半導体層を貫通する貫通孔により前記パッドの第1の面の少なくとも一部が露出している画素基板を
備える固体撮像素子。
(2)
前記配線層の配線が、ビアを介して前記パッドの前記第1の面と反対側の第2の面に接続されている
前記(1)に記載の固体撮像素子。
(3)
前記配線層の配線が、前記パッドの側面に接続されている
前記(1)に記載の固体撮像素子。
(4)
制御回路を備え、前記画素基板の前記配線層側に積層されている制御基板を
さらに備える前記(1)乃至(3)のいずれかに記載の固体撮像素子。
(5)
前記画素基板の前記配線層側に積層されている支持基板を
さらに備える前記(1)乃至(3)のいずれかに記載の固体撮像素子。
(6)
制御回路が配置され、前記画素基板の前記配線層側に積層されている制御基板と、
前記半導体層を貫通し、前記パッドの前記第1の面に接続されている第1のビアと、
前記集光層において前記第1のビアと接続され、前記半導体層及び前記配線層を貫通し、前記制御基板の配線と接続されている第2のビアと
をさらに備える前記(1)に記載の固体撮像素子。
(7)
制御回路が配置され、前記画素基板の前記配線層側に積層されている制御基板と、
前記半導体層及び前記配線層を貫通し、前記パッドの側面と前記制御基板の配線を接続するビアと
をさらに備える前記(1)に記載の固体撮像素子。
(8)
固体撮像素子と、
前記固体撮像素子から出力される信号を処理する信号処理部と
を備え、
前記固体撮像素子は、
入射光を光電変換素子に集光する集光層と、
前記光電変換素子が形成されている半導体層と、
配線及び外部接続用のパッドが形成されている配線層と
が積層され、前記集光層及び前記半導体層を貫通する貫通孔により前記パッドの前記第1の面の少なくとも一部が露出している画素基板を備える
電子機器。
Claims (8)
- 入射光を光電変換素子に集光する集光層と、
前記光電変換素子が形成されている半導体層と、
配線及び外部接続用のパッドが形成されている配線層と
が積層され、前記集光層及び前記半導体層を貫通する貫通孔により前記パッドの第1の面の少なくとも一部が露出している画素基板を備え、
前記パッドは、1つの部材からなり、前記配線層の少なくとも2層以上の高さを有する
固体撮像素子。 - 前記配線層の配線が、ビアを介して前記パッドの前記第1の面と反対側の第2の面に接続されている
請求項1に記載の固体撮像素子。 - 前記配線層の配線が、前記パッドの側面を囲み、前記パッドの側面の少なくとも一部に接続されている
請求項1に記載の固体撮像素子。 - 制御回路を備え、前記画素基板の前記配線層側に積層されている制御基板を
さらに備える請求項1に記載の固体撮像素子。 - 前記画素基板の前記配線層側に積層されている支持基板を
さらに備える請求項1に記載の固体撮像素子。 - 制御回路が配置され、前記画素基板の前記配線層側に積層されている制御基板と、
前記半導体層を貫通し、前記パッドの前記第1の面の露出している部分の周囲に接続されている第1のビアと、
前記集光層において前記第1のビアと接続され、前記半導体層及び前記配線層を貫通し、前記制御基板の配線と接続されている第2のビアと
をさらに備える請求項1に記載の固体撮像素子。 - 制御回路が配置され、前記画素基板の前記配線層側に積層されている制御基板と、
前記半導体層及び前記配線層を貫通し、前記パッドの側面と前記制御基板の配線を接続するビアと
をさらに備える請求項1に記載の固体撮像素子。 - 固体撮像素子と、
前記固体撮像素子から出力される信号を処理する信号処理部と
を備え、
前記固体撮像素子は、
入射光を光電変換素子に集光する集光層と、
前記光電変換素子が形成されている半導体層と、
配線及び外部接続用のパッドが形成されている配線層と
が積層され、前記集光層及び前記半導体層を貫通する貫通孔により前記パッドの面の少なくとも一部が露出している画素基板を備え、
前記パッドは、1つの部材からなり、前記配線層の少なくとも2層以上の高さを有する
電子機器。
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