JP6883007B2 - 窒化物半導体装置 - Google Patents
窒化物半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 337
- 150000004767 nitrides Chemical class 0.000 title claims description 51
- 239000000203 mixture Substances 0.000 claims description 55
- 230000010287 polarization Effects 0.000 claims description 47
- 229910052738 indium Inorganic materials 0.000 claims description 13
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 12
- 230000002269 spontaneous effect Effects 0.000 claims description 3
- 229910002601 GaN Inorganic materials 0.000 description 45
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 44
- 230000004888 barrier function Effects 0.000 description 33
- 239000013078 crystal Substances 0.000 description 16
- 230000005533 two-dimensional electron gas Effects 0.000 description 16
- 239000012535 impurity Substances 0.000 description 14
- 125000004429 atom Chemical group 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 description 2
- OTRPZROOJRIMKW-UHFFFAOYSA-N triethylindigane Chemical compound CC[In](CC)CC OTRPZROOJRIMKW-UHFFFAOYSA-N 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000000370 acceptor Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
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Description
2 第2の半導体層
3 第3の半導体層
4 第4の半導体層
5 基板
6 ソース電極
7 ドレイン電極
8 ゲート電極
9 絶縁層
100 半導体装置
Claims (16)
- Alx1Ga(1−x1)N(0<x1≦1)である第1の半導体層と、
前記第1の半導体層上にあり、インジウムを含む窒化物半導体Iny2Alx2Ga(1−x2−y2)N(0<x2<1、0<y2<1、0<x2+y2≦1)である第2の半導体層と、
前記第2の半導体層上にあり、Alx3Ga(1−x3)N(0≦x3<1)である第3の半導体層と、
前記第3の半導体層上にあり、Iny4Alx4Ga(1−x4−y4)N(0<x4<1、0≦y4<1、0<x4+y4≦1)である第4の半導体層と、
を備え、
前記第1の半導体層と前記第2の半導体層において、Alの組成x1およびx2、Inの組成y2は、y2≦0.224*x2+0.131、x2−x1≦1.44*y2の関係を満たす窒化物半導体装置。 - Alx1Ga(1−x1)N(0<x1≦1)である第1の半導体層と、
前記第1の半導体層上にあり、インジウムを含む窒化物半導体Iny2Alx2Ga(1−x2−y2)N(0<x2<1、0<y2<1、0<x2+y2≦1)である第2の半導体層と、
前記第2の半導体層上にあり、Alx3Ga(1−x3)N(0≦x3<1)である第3の半導体層と、
前記第3の半導体層上にあり、Iny4Alx4Ga(1−x4−y4)N(0<x4<1、0≦y4<1、0<x4+y4≦1)である第4の半導体層と、
を備え、
前記第1の半導体層と前記第2の半導体層において、Alの組成x1およびx2、Inの組成y2は、y2≦0.224*x2、x2−x1≦−0.143*y2の関係を満たす窒化物半導体装置。 - 前記第3の半導体層の格子定数は、前記第2の半導体層の格子定数よりも大きい請求項1または請求項2に記載の窒化物半導体装置。
- 前記第1の半導体層、前記第2の半導体層、前記第3の半導体層、前記第4の半導体層
の順に、各半導体層の自発分極とピエゾ分極の和は小さい請求項1ないし請求項3のいずれか1項に記載の窒化物半導体装置。 - Alx1Ga(1−x1)N(0<x1≦1)である第1の半導体層と、
前記第1の半導体層上にあり、インジウムを含む窒化物半導体Iny2Alx2Ga(1−x2−y2)N(0<x2<1、0<y2<1、0<x2+y2≦1)である第2の半導体層と、
前記第2の半導体層上にあり、Alx3Ga(1−x3)N(0≦x3<1)である第3の半導体層と、
前記第3の半導体層上にあり、Iny4Alx4Ga(1−x4−y4)N(0<x4<1、0≦y4<1、0<x4+y4≦1)である第4の半導体層と、
を備え、
前記第1の半導体層、前記第2の半導体層、前記第3の半導体層、前記第4の半導体層の順に、各半導体層の自発分極とピエゾ分極の和は小さい窒化物半導体装置。 - 前記第2の半導体層のAlの組成x2の原子比は、前記第2の半導体層に含まれるIII族原子の全体に対して、0.1以上である請求項1ないし請求項5のいずれか1項に記載の窒化物半導体装置。
- 前記第2の半導体層のAlの組成x2の原子比は、前記第2の半導体層に含まれるIII族原子の全体に対して、0.15以上である請求項1ないし請求項6のいずれか1項に記載の窒化物半導体装置。
- 前記第3の半導体層の厚さは10nm以上200nm以下である請求項1ないし請求項7のいずれか1項に記載の窒化物半導体装置。
- 前記第3の半導体層の厚さは20nm以上100nm以下である請求項1ないし請求項8のいずれか1項に記載の窒化物半導体装置。
- 前記第4の半導体層上にあるソース電極と、
ドレイン電極と、
前記ソース電極と前記ドレイン電極の間にあるゲート電極と、
をさらに備える請求項1ないし請求項9のいずれか1項に記載の窒化物半導体装置。 - 前記第4の半導体層上にあり、前記ソース電極と前記ドレイン電極の間にある絶縁層をさらに備え、前記ドレイン電極は前記第4の半導体層上にあり、前記ゲート電極は前記絶縁層上にある請求項10に記載の窒化物半導体装置。
- 前記ゲート電極の下においては、第4の半導体層のAlの組成x4の原子比は、第4の
半導体層に含まれるIII族原子の全体に対して、0.2以下である請求項11に記載の
窒化物半導体装置。 - Alx1Ga(1−x1)N(0<x1≦1)である第1の半導体層と、
前記第1の半導体層上にあり、インジウムを含む窒化物半導体Iny2Alx2Ga(1−x2−y2)N(0<x2<1、0<y2<1、0<x2+y2≦1)である第2の半導体層と、
前記第2の半導体層上にあり、Alx3Ga(1−x3)N(0≦x3<1)である第3の半導体層と、
前記第3の半導体層上にあり、Iny4Alx4Ga(1−x4−y4)N(0<x4<1、0≦y4<1、0<x4+y4≦1)である第4の半導体層と、
前記第4の半導体層上にあるソース電極と、
ドレイン電極と、
前記ソース電極と前記ドレイン電極の間にあるゲート電極と、
前記第4の半導体層上にあり、前記ソース電極と前記ドレイン電極の間にある絶縁層と、
を備え、
前記ドレイン電極は前記第4の半導体層上にあり、
前記ゲート電極は前記絶縁層上にあり、
前記ゲート電極の下においては、第4の半導体層のAlの組成x4の原子比は、第4の半導体層に含まれるIII族原子の全体に対して、0.2以下である窒化物半導体装置。 - 前記ゲート電極の下においては、第4の半導体層の厚さは0nm以上5nm以下である請求項12または請求項13に記載の窒化物半導体装置。
- 前記ゲート電極の下以外の第4の半導体層においては、Alの組成x4の原子比は、第4の半導体層に含まれるIII族原子の全体に対して、0.15以上である請求項10ないし請求項14のいずれか1項に記載の窒化物半導体装置。
- 前記ゲート電極の下以外の第4の半導体層においては、第4の半導体層の厚さは20nm以上100nm以下である請求項15に記載の窒化物半導体装置。
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