JP6821775B2 - ストレッチャブル表示装置 - Google Patents
ストレッチャブル表示装置 Download PDFInfo
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- JP6821775B2 JP6821775B2 JP2019226217A JP2019226217A JP6821775B2 JP 6821775 B2 JP6821775 B2 JP 6821775B2 JP 2019226217 A JP2019226217 A JP 2019226217A JP 2019226217 A JP2019226217 A JP 2019226217A JP 6821775 B2 JP6821775 B2 JP 6821775B2
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
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- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
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- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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Description
その他の実施例の具体的な事項は、詳細な説明及び図面に含まれている。
Claims (20)
- 複数のサブ画素が定義され、互いに離隔された複数の第1領域、前記複数の第1領域のうち互いに隣り合う第1領域を連結する複数の連結配線が配置された複数の第2領域、及び前記複数の第1領域と前記複数の第2領域を除く領域である複数の第3領域を含む下部基板と、
前記複数の第3領域それぞれに配置された複数の追加サブ画素と、
前記複数の追加サブ画素それぞれと電気的に連結された複数の圧電パターンとを含む、ストレッチャブル表示装置。 - 前記複数の第1領域に配置され、前記複数のサブ画素が定義された複数のアイランド基板と、
前記複数のアイランド基板上で前記複数のサブ画素に配置された複数の発光素子と、
前記複数の追加サブ画素に配置された複数の追加発光素子とをさらに含み、
前記複数の発光素子は、
発光層と、
前記発光層と電気的に連結された第1電極と、
前記発光層と電気的に連結され、前記第1電極と離隔された第2電極とを含み、
前記複数の追加発光素子それぞれは、
追加発光層と、
前記追加発光層と電気的に連結された第1追加電極と、
前記追加発光層と電気的に連結され、前記第1追加電極と離隔された第2追加電極とを含み、
前記複数の圧電パターンは、前記複数の追加発光素子の第2追加電極と電気的に連結された、請求項1に記載のストレッチャブル表示装置。 - 前記複数の発光素子のうち第1発光素子の第1電極と、前記複数の追加発光素子のうち第1追加発光素子の第1追加電極は、同一の電圧が印加されるように構成された、請求項2に記載のストレッチャブル表示装置。
- 前記複数のアイランド基板のうち前記第1発光素子が配置されたアイランド基板に配置され、前記第1発光素子の第1電極及び前記第1追加発光素子の第1追加電極に同一電圧を印加する第1トランジスタをさらに含む、請求項3に記載のストレッチャブル表示装置。
- 前記複数の発光素子と前記複数の追加発光素子は、独立して駆動されるように構成された、請求項2に記載のストレッチャブル表示装置。
- 前記複数の発光素子のうち第1発光素子の第1電極に連結され、前記複数のアイランド基板のうち前記第1発光素子が配置されたアイランド基板に配置された第1トランジスタと、
前記複数の追加発光素子のうち第1追加発光素子の第1追加電極に連結され、前記第1トランジスタと同一のアイランド基板に配置された第2トランジスタとをさらに含む、請求項5に記載のストレッチャブル表示装置。 - 前記複数の追加発光素子それぞれの第1追加電極と電気的に連結される複数の追加連結配線と、
前記複数の追加連結配線と前記下部基板との間に配置され、前記複数のアイランド基板と一体になされる複数の追加連結基板とをさらに含む、請求項2に記載のストレッチャブル表示装置。 - 前記複数の追加連結基板に隣接するように配置され、前記複数の圧電パターンと前記複数の追加発光素子の第2追加電極を電気的に連結する複数の追加接続パターンをさらに含む、請求項7に記載のストレッチャブル表示装置。
- 前記複数の追加連結配線と前記複数の追加連結基板との間に配置された追加絶縁層をさらに含む、請求項7に記載のストレッチャブル表示装置。
- 前記複数の追加サブ画素それぞれは、前記複数の連結配線の延長方向に対して傾斜するように配置された、請求項1に記載のストレッチャブル表示装置。
- 前記下部基板は、前記複数の第3領域に配置された溝をさらに含み、
前記複数の圧電パターンは、前記溝内に配置された、請求項1に記載のストレッチャブル表示装置。 - 前記複数の追加サブ画素に配置された強化層をさらに含み、
前記強化層は、前記追加発光素子と重畳された、請求項2に記載のストレッチャブル表示装置。 - 前記複数の圧電パターンは、前記下部基板と接する複数個の突出部を含む、請求項2に記載のストレッチャブル表示装置。
- 複数の発光素子が配置され、互いに離隔する複数の剛性基板と、
前記複数の剛性基板のうち互いに隣り合う剛性基板に配置されたパッドを電気的に連結する複数の連結配線と、
前記複数の剛性基板及び前記複数の連結配線の下に配置された下部基板と、
前記下部基板上で前記複数の剛性基板及び前記複数の連結配線と離隔されるように配置された複数の追加発光素子と、
前記複数の追加発光素子と電気的に連結され、前記下部基板の延伸により第1電圧を発生する複数の圧電パターンとを含み、
前記下部基板の延伸時に発生する格子感を最小化するように前記下部基板の延伸時、前記複数の圧電パターンからの前記第1電圧により前記複数の追加発光素子から光が発光される、ストレッチャブル表示装置。 - 前記下部基板の延伸により前記複数の圧電パターンに外力が加えられる場合、前記複数の圧電パターンから前記複数の追加発光素子に前記第1電圧が印加され、
前記複数の圧電パターンに加えられる外力が除去される場合、前記複数の圧電パターンは電気的にフローティング(floating)される、請求項14に記載のストレッチャブル表示装置。 - 前記複数の追加発光素子は、
複数の追加発光層と、
前記複数の追加発光層それぞれと電気的に連結された複数の第1追加電極と、
前記複数の追加発光層それぞれと電気的に連結され、前記複数の第1追加電極それぞれと離隔された複数の第2追加電極を含み、
前記複数の第2追加電極それぞれは、前記複数の圧電パターンそれぞれと電気的に連結された、請求項14に記載のストレッチャブル表示装置。 - 前記複数の剛性基板上に配置され、前記複数の発光素子それぞれと電気的に連結された複数の第1トランジスタと、
前記複数の第1トランジスタと前記複数の追加発光素子の前記複数の第1追加電極を電気的に連結する複数の追加連結配線をさらに含む、請求項16に記載のストレッチャブル表示装置。 - 前記複数の剛性基板上に配置され、前記複数の発光素子それぞれと電気的に連結された複数の第1トランジスタ;
前記複数の剛性基板上に配置された複数の第2トランジスタ;及び
前記複数の第2トランジスタと前記複数の追加発光素子の前記複数の第1追加電極を電気的に連結する複数の追加連結配線をさらに含む、請求項16に記載のストレッチャブル表示装置。 - 前記複数の追加連結配線は、前記複数の連結配線に対して傾斜を有するように配置された、請求項17または18に記載のストレッチャブル表示装置。
- 前記複数の圧電パターンの下面は、前記下部基板の下面と前記下部基板の上面との間に配置された、請求項14に記載のストレッチャブル表示装置。
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