JP6811827B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP6811827B2 JP6811827B2 JP2019206415A JP2019206415A JP6811827B2 JP 6811827 B2 JP6811827 B2 JP 6811827B2 JP 2019206415 A JP2019206415 A JP 2019206415A JP 2019206415 A JP2019206415 A JP 2019206415A JP 6811827 B2 JP6811827 B2 JP 6811827B2
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- Prior art keywords
- circuit board
- spring
- leaf spring
- upper shield
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- A—HUMAN NECESSITIES
- A63—SPORTS; GAMES; AMUSEMENTS
- A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
- A63F13/00—Video games, i.e. games using an electronically generated display having two or more dimensions
- A63F13/90—Constructional details or arrangements of video game devices not provided for in groups A63F13/20 or A63F13/25, e.g. housing, wiring, connections or cabinets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Unit)などの集積回路を冷却するため、集積回路から熱を受けるヒートシンクが利用される場合がある。
Claims (8)
- 回路基板と、
前記回路基板の一方の面に実装されている集積回路と、
前記集積回路の表面に配置されているヒートシンクと、
前記回路基板の他方の面を覆っている第1シールドと、
前記回路基板に形成されている貫通孔に通されている連結部材と、
前記回路基板と前記第1シールドとの間に配置され、前記連結部材を通して前記ヒートシンクを前記回路基板の前記一方の面に向けて付勢している付勢部材と、
前記回路基板と前記付勢部材との間に位置し、前記付勢部材を支持しているばね受け部材と、を有し、
前記ばね受け部材は、前記付勢部材が配置されている受け部と、前記回路基板上に配置され前記受け部を支持している支持部とを有し、
前記支持部は絶縁性の材料で形成されている
ことを特徴とする電子機器。 - 前記ばね受け部材は樹脂によって一体的に成型されている
ことを特徴とする請求項1に記載の電子機器。 - 前記付勢部材は、前記ばね受け部材によって支持される基部と、前記基部から伸びている第1のばね部と、前記基部から前記第1のばね部とは反対方向に伸びている第2のばね部とを有している
ことを特徴とする請求項1に記載の電子機器。 - 前記回路基板の前記他方の面には、前記回路基板を挟んで前記集積回路の反対側に位置している電子部品が実装されており、
前記電子部品は前記付勢部材の基部と前記回路基板との間に位置している
ことを特徴とする請求項1に記載の電子機器。 - 前記ばね受け部材の厚さは、前記電子部品の高さよりも大きい
ことを特徴とする請求項4に記載の電子機器。 - 前記支持部の厚さは、前記電子部品の高さよりも大きい
ことを特徴とする請求項4に記載の電子機器。 - 前記電子部品は、前記回路基板と前記受け部との間に位置している
ことを特徴とする請求項4に記載の電子機器。 - 前記第1シールドは、前記付勢部材を覆っている部分である対向部を有し、
前記対向部は、その外周縁に、前記付勢部材を取り囲む段差を有している
ことを特徴とする請求項1に記載の電子機器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015077167 | 2015-04-03 | ||
JP2015077167 | 2015-04-03 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018167248A Division JP6619491B2 (ja) | 2015-04-03 | 2018-09-06 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020025138A JP2020025138A (ja) | 2020-02-13 |
JP6811827B2 true JP6811827B2 (ja) | 2021-01-13 |
Family
ID=57004699
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017510272A Active JP6401379B2 (ja) | 2015-04-03 | 2016-04-04 | 電子機器 |
JP2018167248A Active JP6619491B2 (ja) | 2015-04-03 | 2018-09-06 | 電子機器 |
JP2019206415A Active JP6811827B2 (ja) | 2015-04-03 | 2019-11-14 | 電子機器 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017510272A Active JP6401379B2 (ja) | 2015-04-03 | 2016-04-04 | 電子機器 |
JP2018167248A Active JP6619491B2 (ja) | 2015-04-03 | 2018-09-06 | 電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10553520B2 (ja) |
JP (3) | JP6401379B2 (ja) |
CN (1) | CN107431054B (ja) |
WO (1) | WO2016159382A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102003840B1 (ko) | 2018-03-12 | 2019-07-25 | 삼성전자주식회사 | 안테나 모듈 |
TWI700976B (zh) * | 2019-05-17 | 2020-08-01 | 和碩聯合科技股份有限公司 | 電子裝置及其殼體結構 |
JP7350989B2 (ja) * | 2020-03-27 | 2023-09-26 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0742515U (ja) * | 1993-12-28 | 1995-08-04 | 沖電気工業株式会社 | 放熱フィン取付構造 |
US6049469A (en) * | 1997-08-20 | 2000-04-11 | Dell Usa, L.P. | Combination electromagnetic shield and heat spreader |
US6276965B1 (en) * | 1999-05-25 | 2001-08-21 | 3Com Corporation | Shielded I/O connector for compact communications device |
CA2310358A1 (en) * | 1999-06-01 | 2000-12-01 | Showa Aluminum Corporation | Heat sinks for cpus for use in personal computers |
JP2001203485A (ja) | 1999-08-06 | 2001-07-27 | Showa Alum Corp | パーソナルコンピュータ用cpuの放熱器 |
US6282093B1 (en) | 1999-06-11 | 2001-08-28 | Thomas & Betts International, Inc. | LGA clamp mechanism |
JP3579384B2 (ja) | 2001-09-26 | 2004-10-20 | 株式会社東芝 | 電子機器 |
JP2005019882A (ja) * | 2003-06-27 | 2005-01-20 | Tdk Corp | 半導体ic搭載モジュール |
JP2007305649A (ja) * | 2006-05-09 | 2007-11-22 | Matsushita Electric Ind Co Ltd | 放熱器固定手段 |
JP4699967B2 (ja) | 2006-09-21 | 2011-06-15 | 株式会社ソニー・コンピュータエンタテインメント | 情報処理装置 |
CN101309569B (zh) * | 2007-05-18 | 2012-12-26 | 富准精密工业(深圳)有限公司 | 扣具及散热装置组合 |
US20090201646A1 (en) | 2008-02-12 | 2009-08-13 | Inventec Corporation | Retaining device |
JP2012099708A (ja) * | 2010-11-04 | 2012-05-24 | Kitagawa Ind Co Ltd | 固定具 |
JP5971751B2 (ja) | 2012-04-13 | 2016-08-17 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
TWI502733B (zh) | 2012-11-02 | 2015-10-01 | 環旭電子股份有限公司 | 電子封裝模組及其製造方法 |
EP3399386B1 (en) | 2013-06-07 | 2023-10-04 | Apple Inc. | Computer internal architecture |
CN203859327U (zh) * | 2014-05-30 | 2014-10-01 | 上海莫仕连接器有限公司 | 电连接器 |
-
2016
- 2016-04-04 JP JP2017510272A patent/JP6401379B2/ja active Active
- 2016-04-04 WO PCT/JP2016/061034 patent/WO2016159382A1/ja active Application Filing
- 2016-04-04 US US15/559,111 patent/US10553520B2/en active Active
- 2016-04-04 CN CN201680018464.2A patent/CN107431054B/zh active Active
-
2018
- 2018-09-06 JP JP2018167248A patent/JP6619491B2/ja active Active
-
2019
- 2019-11-14 JP JP2019206415A patent/JP6811827B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2020025138A (ja) | 2020-02-13 |
CN107431054A (zh) | 2017-12-01 |
JP2018198334A (ja) | 2018-12-13 |
US20180247881A1 (en) | 2018-08-30 |
JP6401379B2 (ja) | 2018-10-10 |
US10553520B2 (en) | 2020-02-04 |
CN107431054B (zh) | 2019-12-03 |
JPWO2016159382A1 (ja) | 2017-10-12 |
JP6619491B2 (ja) | 2019-12-11 |
WO2016159382A1 (ja) | 2016-10-06 |
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