JP6792106B2 - Work carrier and manufacturing method of work carrier - Google Patents
Work carrier and manufacturing method of work carrier Download PDFInfo
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- JP6792106B2 JP6792106B2 JP2017068834A JP2017068834A JP6792106B2 JP 6792106 B2 JP6792106 B2 JP 6792106B2 JP 2017068834 A JP2017068834 A JP 2017068834A JP 2017068834 A JP2017068834 A JP 2017068834A JP 6792106 B2 JP6792106 B2 JP 6792106B2
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- side recess
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- hole
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- front side
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims description 80
- 239000011347 resin Substances 0.000 claims description 80
- 239000000758 substrate Substances 0.000 claims description 76
- 239000000463 material Substances 0.000 claims description 22
- 229920003002 synthetic resin Polymers 0.000 claims description 21
- 239000000057 synthetic resin Substances 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 230000000873 masking effect Effects 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000005498 polishing Methods 0.000 description 15
- 238000001746 injection moulding Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229910001315 Tool steel Inorganic materials 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Description
本発明は、酸化物ウエーハ、シリコンウエーハ、ガラス、サファイア、セラミックス、水晶等の薄板状のワークを研磨装置によって研磨加工する際に、ワークの保持に使用されるワークキャリア及びワークキャリアの製造方法に関するものである。 The present invention relates to a work carrier used for holding a work carrier and a method for manufacturing the work carrier when a thin plate-shaped work piece such as an oxide wafer, a silicon wafer, glass, sapphire, ceramics, or crystal is polished by a polishing device. It is a thing.
シリコンウエーハなどのワークの両面又は片面を研磨装置によって研磨加工する際に、ワーク保持孔を有するワークキャリアにワークを保持させることが知られている（特許文献１−４など参照）。 It is known that when both sides or one side of a work such as a silicon wafer is polished by a polishing device, a work carrier having a work holding hole holds the work (see Patent Documents 1-4 and the like).
ワークキャリアの本体となるキャリア基板は、ＳＫ鋼やステンレス鋼といった硬質の金属素材によって形成されているため、キャリア基板に穿孔されたワーク保持孔に直接、ワークを保持させると、研磨加工中にワークがワーク保持孔の内周面に接触し、ワークに割れや欠けなどの損傷が生じるおそれがある。 Since the carrier substrate, which is the main body of the work carrier, is made of a hard metal material such as SK steel or stainless steel, if the work is held directly in the work holding holes drilled in the carrier substrate, the work is held during polishing. May come into contact with the inner peripheral surface of the work holding hole, causing damage such as cracking or chipping of the work.
そこで、特許文献１−４に開示されているように、ワーク保持孔の内周面に沿って合成樹脂製の軟質のインサートを取り付け、研磨加工中のワークの損傷を防ぐ処理が行われている。 Therefore, as disclosed in Patent Documents 1-4, a soft insert made of synthetic resin is attached along the inner peripheral surface of the work holding hole to prevent damage to the work during polishing. ..
特許文献１には、ワーク保持孔の内周面に周方向に間隔を置いて突出部を設け、射出成型によって突出部間にも樹脂部が充填されるようにすることで、樹脂部を金属板に一体化させることが記載されている。さらに、突出部の上方部及び下方部に面取り部を形成することで、樹脂部が上下方向に抜けて脱落するのを防ぐことができる構造となっている。 In Patent Document 1, protrusions are provided on the inner peripheral surface of the work holding hole at intervals in the circumferential direction so that the resin portion is also filled between the protrusions by injection molding, whereby the resin portion is made of metal. It is described that it is integrated with the board. Further, by forming chamfered portions on the upper portion and the lower portion of the protruding portion, the structure is such that the resin portion can be prevented from coming off in the vertical direction and falling off.
また、特許文献２には、キャリア基板のワーク保持孔の内周面に沿って溝を設け、その溝に合成樹脂材が入り込むように射出成型することによって、軟質のリング状のインサートを設けることが記載されている。 Further, in Patent Document 2, a groove is provided along the inner peripheral surface of the work holding hole of the carrier substrate, and a soft ring-shaped insert is provided by injection molding so that the synthetic resin material enters the groove. Is described.
一方、特許文献３には、ワーク保持孔を形成するキャリア本体の内壁面を、径方向に凹形状とすることで、インサートの上面部と下面部の径方向の長さを短くして、インサートの摩耗や変形を少なくする構造が記載されている。 On the other hand, in Patent Document 3, the inner wall surface of the carrier body forming the work holding hole is formed to have a concave shape in the radial direction, thereby shortening the radial lengths of the upper surface portion and the lower surface portion of the insert. A structure that reduces wear and deformation of the material is described.
さらに、特許文献４には、薄物のワークの研磨加工に使用するための金属キャリアが開示されている。この金属キャリアのワーク保持孔にも樹脂コート保持部（インサート）が設けられるが、樹脂コート保持部が剥がれないように、金属キャリアに小径の穴を設け、その穴に樹脂コート保持部の一部となる樹脂が充填されるようにしている。 Further, Patent Document 4 discloses a metal carrier for use in polishing a thin workpiece. A resin coat holding part (insert) is also provided in the work holding hole of this metal carrier, but a small diameter hole is provided in the metal carrier so that the resin coat holding part does not come off, and a part of the resin coat holding part is provided in the hole. The resin is filled.
しかしながら特許文献１，２に開示されたワークキャリアは、キャリア基板のワーク保持孔の内周面を平面視凹凸に加工しており、突出部となる部分の上面や下面に面取りをして厚さを薄くすると、突出部が変形しやすくなる。このため、このような加工は、特許文献４に開示されているような薄物用のワークキャリアには、適用することが難しい。 However, in the work carrier disclosed in Patent Documents 1 and 2, the inner peripheral surface of the work holding hole of the carrier substrate is processed to have unevenness in a plan view, and the upper surface and the lower surface of the protruding portion are chamfered to have a thickness. When the thickness is reduced, the protruding portion is easily deformed. Therefore, it is difficult to apply such processing to a work carrier for thin materials as disclosed in Patent Document 4.
そこで、本発明は、キャリア基板が薄い場合であっても、樹脂インサート部の径方向の外れや表裏方向の抜けなどの脱落を防ぐことが可能なワークキャリア及びワークキャリアの製造方法を提供することを目的としている。 Therefore, the present invention provides a work carrier and a method for manufacturing the work carrier, which can prevent the resin insert portion from coming off in the radial direction or coming off in the front and back directions even when the carrier substrate is thin. It is an object.
前記目的を達成するために、本発明のワークキャリアは、金属製のキャリア基板に形成されたワーク保持孔の内周面に沿って樹脂インサート部が設けられたワークキャリアであって、前記ワーク保持孔の外縁部となる前記キャリア基板には、周方向に交互に、表裏方向にそれぞれ窪む表側凹部と裏側凹部とが形成されているとともに、前記表側凹部及び裏側凹部に連続した前記表裏方向に貫通する貫通穴部が設けられ、前記表側凹部、裏側凹部及び貫通穴部並びに前記ワーク保持孔の内周面に沿った部分に樹脂インサート部となる合成樹脂材が充填されていることを特徴とする。 In order to achieve the above object, the work carrier of the present invention is a work carrier in which a resin insert portion is provided along the inner peripheral surface of a work holding hole formed in a metal carrier substrate, and holds the work. The carrier substrate, which is the outer edge of the hole, is formed with front side recesses and back side recesses that are alternately recessed in the front and back directions in the circumferential direction, and is continuous with the front side recesses and the back side recesses in the front and back directions. A through hole portion is provided, and a synthetic resin material serving as a resin insert portion is filled in the front side recess, the back side recess, the through hole portion, and the portion along the inner peripheral surface of the work holding hole. To do.
ここで、前記表側凹部と前記裏側凹部とは、周方向に間隔を置いて設けられていることが好ましい。また、前記貫通穴部は、前記表側凹部と前記裏側凹部との間ごとに設けられている構成とすることができる。 Here, it is preferable that the front side recess and the back side recess are provided at intervals in the circumferential direction. Further, the through-hole portion may be provided at intervals between the front side recess and the back side recess.
さらに、前記表側凹部及び裏側凹部の底面には突起部又は穴部が設けられており、前記突起部の周囲又は前記穴部の内部には前記樹脂インサート部の一部が充填されている構成とすることができる。
また、前記表側凹部及び裏側凹部の前記ワーク保持孔の中心側に狭隘部が設けられている構成とすることができる。
Further, a protrusion or a hole is provided on the bottom surface of the front side recess and the back side recess, and a part of the resin insert portion is filled around the protrusion or inside the hole. can do.
Further, the narrow portion may be provided on the center side of the work holding hole of the front side recess and the back side recess.
さらに、ワークキャリアの製造方法の発明は、前記キャリア基板の表面及び裏面を所定の描画パターンでマスキングをする工程と、マスキングされた前記キャリア基板にエッチング液を付着させる工程と、前記エッチング液によって加工された前記キャリア基板に対して前記樹脂インサート部を設ける工程とを備えたことを特徴とする。 Further, the invention of the work carrier manufacturing method is a step of masking the front surface and the back surface of the carrier substrate with a predetermined drawing pattern, a step of adhering an etching solution to the masked carrier substrate, and processing with the etching solution. It is characterized by including a step of providing the resin insert portion on the carrier substrate.
このように構成された本発明のワークキャリアは、表裏方向にそれぞれ窪む表側凹部と裏側凹部とをワーク保持孔の外縁部の周方向に交互に設ける。このため、表側凹部及び裏側凹部に充填された合成樹脂材によって、樹脂インサート部の表裏方向の抜けを防ぐことができる。 In the work carrier of the present invention configured as described above, front side recesses and back side recesses, which are recessed in the front and back directions, are alternately provided in the circumferential direction of the outer edge portion of the work holding hole. Therefore, the synthetic resin material filled in the front side recess and the back side recess can prevent the resin insert portion from coming off in the front and back directions.
また、表側凹部及び裏側凹部に連続した表裏方向に貫通する貫通穴部が設けられて合成樹脂材が充填されるので、樹脂インサート部の径方向の外れを防ぐことができるうえに、樹脂インサート部を剥がれ難くすることができる。 Further, since the front side recess and the back side recess are provided with continuous through holes penetrating in the front and back directions and filled with the synthetic resin material, it is possible to prevent the resin insert portion from coming off in the radial direction and the resin insert portion. Can be made difficult to peel off.
さらに、表側凹部及び裏側凹部は、ワーク保持孔の中心に向けて径方向に突出していないため、キャリア基板が薄い場合であっても適用することができる。特に、表側凹部と裏側凹部とを周方向に間隔を置いて設けることで、表側凹部と裏側凹部の両側に全厚のキャリア基板が残されることになって、キャリア基板の変形をより生じ難くすることができる。 Further, since the front side recess and the back side recess do not protrude in the radial direction toward the center of the work holding hole, it can be applied even when the carrier substrate is thin. In particular, by providing the front side recess and the back side recess at intervals in the circumferential direction, a carrier substrate having a full thickness is left on both sides of the front side recess and the back recess, making it more difficult for the carrier substrate to be deformed. be able to.
また、貫通穴部を表側凹部と裏側凹部との間ごとに設けることで、貫通穴部を介してすべての表側凹部と裏側凹部とが周方向に連続して一体化されるので、樹脂インサート部をより剥がれ難くすることができる。 Further, by providing the through hole portion between the front side concave portion and the back side concave portion, all the front side concave portion and the back side concave portion are continuously integrated in the circumferential direction through the through hole portion, so that the resin insert portion Can be made more difficult to peel off.
さらに、表側凹部及び裏側凹部の底面に突起部又は穴部を設け、その周囲又は穴部の内部に樹脂インサート部の一部を充填することで、樹脂インサート部の径方向の移動を確実に抑えて、キャリア基板との一体性を高めることができる。 Further, by providing a protrusion or a hole on the bottom surface of the front side recess and the back side recess and filling a part of the resin insert part around the protrusion or the inside of the hole, the radial movement of the resin insert part is surely suppressed. Therefore, the integration with the carrier substrate can be enhanced.
また、表側凹部及び裏側凹部のワーク保持孔の中心側に狭隘部を設けることで、樹脂インサート部の径方向の移動を確実に抑えて、キャリア基板との一体性を高めることができる。 Further, by providing the narrow portion on the center side of the work holding holes of the front side recess and the back side recess, the radial movement of the resin insert portion can be reliably suppressed, and the integrity with the carrier substrate can be enhanced.
さらに、ワークキャリアの製造方法の発明であれば、所定の描画パターンでマスキングされたキャリア基板にエッチング液を付着させることでエッチング加工をし、樹脂インサート部を設ける工程を経ることで、キャリア基板と樹脂インサート部との一体性が高いワークキャリアを効率的に製造することができる。 Further, in the case of an invention of a method for manufacturing a work carrier, an etching process is performed by adhering an etching solution to a carrier substrate masked with a predetermined drawing pattern, and a resin insert portion is provided. It is possible to efficiently manufacture a work carrier having a high degree of integration with the resin insert portion.
以下、本発明の実施の形態について図面を参照して説明する。図１Ａ，１Ｂ及び図２は、本実施の形態のワークキャリア１０の構成を説明する図であって、図２が全体の概略構成を示し、図１Ａ及び図１Ｂがワーク保持孔２の外縁部１３付近を拡大して示している。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1A, 1B and 2B are views for explaining the configuration of the work carrier 10 of the present embodiment, FIG. 2 shows a schematic configuration of the whole, and FIGS. 1A and 1B show the outer edge portion of the work holding hole 2. The area around 13 is enlarged and shown.
ワークキャリア１０は、薄板状のワークの両面又は片面を研磨加工する平面研磨装置に装着して使用される。例えばワークの両面を研磨加工する平面研磨装置は、定盤である上定盤及び下定盤と、この上定盤及び下定盤の中心部に配置されたサンギアと、上定盤及び下定盤の外周側に配置されたインターナルギアとを備えている。上定盤、下定盤、サンギア及びインターナルギアは、それぞれ回転自在となっている。 The work carrier 10 is used by being attached to a flat surface polishing device for polishing both sides or one side of a thin plate-shaped work. For example, a flat surface polishing device that polishes both sides of a work includes an upper surface plate and a lower surface plate, a sun gear arranged at the center of the upper surface plate and the lower surface plate, and an outer circumference of the upper surface plate and the lower surface plate. It has an internal gear located on the side. The upper surface plate, lower surface plate, sun gear, and internal gear are each rotatable.
そして、図２に示すようなワークキャリア１０は、平面研磨装置の上定盤と下定盤との間に配置される。
ワークキャリア１０は、金属製のキャリア基板１によって円板状の本体が形成される。このキャリア基板１には、例えば複数の円形のワーク保持孔２，・・・が穿孔される。そして、ワーク保持孔２の内周面に沿って樹脂インサート部３が設けられる。
Then, the work carrier 10 as shown in FIG. 2 is arranged between the upper surface plate and the lower surface plate of the surface polishing apparatus.
The work carrier 10 has a disk-shaped main body formed by the metal carrier substrate 1. For example, a plurality of circular work holding holes 2, ... Are drilled in the carrier substrate 1. Then, the resin insert portion 3 is provided along the inner peripheral surface of the work holding hole 2.
このワークキャリア１０には、外形部１１にサンギア及びインターナルギアに噛合する歯部（図示省略）が設けられており、サンギア及びインターナルギアの回転により自転及び公転する。そして、ワークキャリア１０が自転及び公転することで、ワークキャリア１０のワーク保持孔２内に配置されたワークの両面が、上定盤と下定盤により研磨される。 The work carrier 10 is provided with a tooth portion (not shown) that meshes with the sun gear and the internal gear in the outer shape portion 11, and rotates and revolves by rotation of the sun gear and the internal gear. Then, as the work carrier 10 rotates and revolves, both sides of the work arranged in the work holding hole 2 of the work carrier 10 are polished by the upper surface plate and the lower surface plate.
キャリア基板１は、金属板から円板状に切り出される。金属板としては、ステンレス鋼（ＳＵＳ）、高炭素クロム軸受鋼、炭素工具鋼（ＳＫ鋼）、高速度工具鋼、合金工具鋼、高張力鋼、チタンなどが使用できる。 The carrier substrate 1 is cut out from a metal plate in a disk shape. As the metal plate, stainless steel (SUS), high carbon chrome bearing steel, carbon tool steel (SK steel), high speed tool steel, alloy tool steel, high tension steel, titanium and the like can be used.
特に、薄板状のワークを研磨加工する場合には、薄いキャリア基板１が使用される。例えば、0.1mmから1.0mm程度の厚さ（表裏方向の高さ）のキャリア基板１が使用される。また、ワークの厚さに応じて0.7mm以下、さらには0.5mm以下の厚さの薄いキャリア基板１が使用される。 In particular, when polishing a thin plate-shaped work, a thin carrier substrate 1 is used. For example, a carrier substrate 1 having a thickness of about 0.1 mm to 1.0 mm (height in the front and back directions) is used. Further, a thin carrier substrate 1 having a thickness of 0.7 mm or less and further 0.5 mm or less is used depending on the thickness of the work.
一方、樹脂インサート部３は、合成樹脂材によって成形される。合成樹脂材には、ポリアミド（ＰＡ）、ポリアセタール（ＰＯＭ）、ポリイミド（ＰＩ）、ポリ塩化ビニル（ＰＶＣ）、ポリアミドイミド（ＰＡＩ）、ポリカーボネート（ＰＣ）、エポキシ（ＥＰ）などの樹脂や、ガラスエポキシ、布ベークなどの繊維強化プラスチックなどが使用できる。後述するように射出成型によって樹脂インサート部３を設ける場合には、熱可塑性樹脂が使用される。また、熱圧着によって樹脂インサート部３を設ける場合には、熱硬化性樹脂が使用される。 On the other hand, the resin insert portion 3 is formed of a synthetic resin material. Synthetic resin materials include resins such as polyamide (PA), polyacetal (POM), polyimide (PI), polyvinyl chloride (PVC), polyamideimide (PAI), polycarbonate (PC), epoxy (EP), and glass epoxy. , Fiber reinforced plastic such as cloth bake can be used. When the resin insert portion 3 is provided by injection molding as described later, a thermoplastic resin is used. Further, when the resin insert portion 3 is provided by thermocompression bonding, a thermosetting resin is used.
本実施の形態のワーク保持孔２の外縁部１３となるキャリア基板１には、樹脂インサート部３との一体性を高めるために、図１Ａ及び図１Ｂに示すように、周方向に交互に、表裏方向にそれぞれ窪む表側凹部４Ａと裏側凹部４Ｂとが形成される。 As shown in FIGS. 1A and 1B, the carrier substrate 1 serving as the outer edge portion 13 of the work holding hole 2 of the present embodiment is alternately arranged in the circumferential direction in order to enhance the integrity with the resin insert portion 3. A front side recess 4A and a back side recess 4B that are recessed in the front and back directions are formed.
表側凹部４Ａは、キャリア基板１の表側から裏側に向けて窪んだ平面視で長方形状に形成される。表側凹部４Ａの表裏方向の深さは、キャリア基板１の厚さの半分程度となる。 The front side recess 4A is formed in a rectangular shape in a plan view in which the carrier substrate 1 is recessed from the front side to the back side. The depth of the front side recess 4A in the front and back directions is about half the thickness of the carrier substrate 1.
一方、表側凹部４Ａからワーク保持孔２の周方向に間隔を置いて設けられる裏側凹部４Ｂは、キャリア基板１の裏側から表側に向けて窪んだ平面視で長方形状に形成される。裏側凹部４Ｂの表裏方向の深さは、キャリア基板１の厚さの半分程度となる。 On the other hand, the back side recesses 4B provided at intervals from the front side recesses 4A in the circumferential direction of the work holding hole 2 are formed in a rectangular shape in a plan view recessed from the back side to the front side of the carrier substrate 1. The depth of the back side recess 4B in the front and back directions is about half the thickness of the carrier substrate 1.
ここで、表側凹部４Ａと裏側凹部４Ｂとの間は、平面視で離隔しているので、その間には、全厚のキャリア基板１の本体が残存している。すなわち、表側凹部４Ａ及び裏側凹部４Ｂは、ワーク保持孔２の中心側は開放されているが、周方向の両側及び径方向の奥行き側は、後述する隅角部付近を除いてキャリア基板１の本体に支持された状態となっている。 Here, since the front side recess 4A and the back side recess 4B are separated from each other in a plan view, the main body of the carrier substrate 1 having a full thickness remains between them. That is, the front side recess 4A and the back side recess 4B are open on the center side of the work holding hole 2, but both sides in the circumferential direction and the depth side in the radial direction are the carrier substrate 1 except for the vicinity of the corner portion described later. It is in a state of being supported by the main body.
そして、表側凹部４Ａと裏側凹部４Ｂとの間ごとには、貫通穴部８が設けられる。この貫通穴部８は、表裏方向に貫通する穴で、表側凹部４Ａ及び裏側凹部４Ｂにそれぞれ連続した空間が形成される。 Then, a through hole portion 8 is provided between the front side recess 4A and the back side recess 4B. The through hole portion 8 is a hole that penetrates in the front and back directions, and a continuous space is formed in each of the front side recess 4A and the back side recess 4B.
詳細には、貫通穴部８は、表側凹部４Ａの奥側（ワーク保持孔２の中心と反対側）の隅角部と裏側凹部４Ｂの奥側の隅角部とを繋ぐように、例えば平面視長円状に形成される。このため、表側凹部４Ａ（又は裏側凹部４Ｂ）と貫通穴部８とが重なる位置では、キャリア基板１の表側から裏側（又はキャリア基板１の裏側から表側）に向けての窪みが欠けて貫通した穴となる。
また、表側凹部４Ａ（又は裏側凹部４Ｂ）に対して接するように貫通穴部を設けることもできる。この場合は、キャリア基板１の表側から裏側（又はキャリア基板１の裏側から表側）に向けての窪みに欠けは生じない。
Specifically, the through hole portion 8 is, for example, a flat surface so as to connect the corner portion on the back side of the front side recess 4A (the side opposite to the center of the work holding hole 2) and the corner portion on the back side of the back side recess 4B. It is formed in an oval shape. Therefore, at the position where the front side recess 4A (or the back side recess 4B) and the through hole portion 8 overlap, the recess from the front side to the back side (or from the back side to the front side of the carrier board 1) of the carrier substrate 1 is missing and penetrates. It becomes a hole.
Further, a through hole portion may be provided so as to be in contact with the front side recess 4A (or the back side recess 4B). In this case, the recesses from the front side to the back side of the carrier substrate 1 (or from the back side to the front side of the carrier substrate 1) are not chipped.
この貫通穴部８に、図５に示すように、樹脂インサート部３の一部となるように合成樹脂材が充填されて穴充填部３３が形成されると、樹脂インサート部３の径方向の移動を阻止する抵抗部となる。
穴充填部３３は、キャリア基板１の厚さと同じ厚さとなるため、強い引っ掛かりとすることができる。
As shown in FIG. 5, when the through hole portion 8 is filled with a synthetic resin material so as to be a part of the resin insert portion 3 to form the hole filling portion 33, the resin insert portion 3 is in the radial direction. It becomes a resistance part that prevents movement.
Since the hole filling portion 33 has the same thickness as the carrier substrate 1, it can be strongly hooked.
すなわち樹脂インサート部３は、ワーク保持孔２の直径と同程度の直径のリング状に形成される円環部３１と、表側凹部４Ａ及び裏側凹部４Ｂの内空に形成される直方体状の充填部３２，・・・と、貫通穴部８の内空に形成される穴充填部３３，・・・とによって構成される。この円環部３１と充填部３２，・・・と穴充填部３３，・・・とは、合成樹脂材によって一体に成形される。 That is, the resin insert portion 3 is a ring-shaped ring portion 31 having a diameter similar to that of the work holding hole 2, and a rectangular parallelepiped filling portion formed in the inner space of the front side recess 4A and the back side recess 4B. It is composed of 32, ... And a hole filling portion 33, ... Formed in the inner space of the through hole portion 8. The ring portion 31, the filling portion 32, ..., And the hole filling portion 33, ... Are integrally formed of a synthetic resin material.
次に、本実施の形態のワークキャリア１０の製造方法について、図３Ａ，３Ｂ及び図４Ａ，４Ｂを参照しながら説明する。
まず、キャリア基板１の表面及び裏面に、所定の描画パターンでマスキングを施す。詳細には、ＣＡＤ／ＣＡＭシステムなどで作成されたデータを使って、レーザープロッタなどから高精度の描画パターンの原版を作成する。
Next, the manufacturing method of the work carrier 10 of the present embodiment will be described with reference to FIGS. 3A and 3B and FIGS. 4A and 4B.
First, the front surface and the back surface of the carrier substrate 1 are masked with a predetermined drawing pattern. Specifically, using the data created by a CAD / CAM system or the like, an original plate of a high-precision drawing pattern is created from a laser plotter or the like.
また、キャリア基板１の表面及び裏面に対しては、酸化膜除去のための酸処理又は電解研磨などの前処理を行う。続いて、キャリア基板１の表面及び裏面の全面に、それぞれフォトレジストを塗布する。 Further, the front surface and the back surface of the carrier substrate 1 are subjected to pretreatment such as acid treatment or electrolytic polishing for removing the oxide film. Subsequently, the photoresist is applied to the entire front surface and the back surface of the carrier substrate 1, respectively.
そして、描画パターンの原版を用いて、フォトレジストによってコーティングされたキャリア基板１の表面と裏面に露光することで、焼き付けを行う。図示されたマスキング部５Ａ，５Ｂは、焼き付け後に現像して残ったフォトレジスト層を示している。 Then, using the original plate of the drawing pattern, the front surface and the back surface of the carrier substrate 1 coated with the photoresist are exposed to perform printing. The illustrated masking portions 5A and 5B show the photoresist layer remaining after development after baking.
要するに、キャリア基板１の表面においては、図３Ａ及び図４Ａに示すように、表側凹部４Ａ，・・・及び貫通穴部８，・・・以外がマスキング部５Ａとなる。また、キャリア基板１の裏面においては、図３Ｂ及び図４Ｂに示すように、裏側凹部４Ｂ，・・・及び貫通穴部８以外がマスキング部５Ｂとなる。 In short, on the surface of the carrier substrate 1, as shown in FIGS. 3A and 4A, the masking portion 5A is provided except for the front side recesses 4A, ..., And the through hole portions 8, .... Further, on the back surface of the carrier substrate 1, as shown in FIGS. 3B and 4B, the masking portion 5B is provided except for the back side recesses 4B, ..., And the through hole portion 8.
さらに、マスキングされたキャリア基板１の表面及び裏面に対しては、エッチング液を噴霧して付着させる。このエッチング液の付着によって、マスキング部５Ａ，５Ｂ以外のキャリア基板１の露出した面が除去され、表裏方向に窪んだ表側凹部４Ａ及び裏側凹部４Ｂ、並びに表裏方向に貫通する貫通穴部８が形成されることになる。 Further, the etching solution is sprayed and adhered to the front surface and the back surface of the masked carrier substrate 1. By the adhesion of this etching solution, the exposed surfaces of the carrier substrate 1 other than the masking portions 5A and 5B are removed, and front side recesses 4A and back side recesses 4B recessed in the front and back directions, and through hole portions 8 penetrating in the front and back directions are formed. Will be done.
所望する深さまで表側凹部４Ａ及び裏側凹部４Ｂが溶解され、貫通穴部８は貫通した段階でマスキング部５Ａ，５Ｂを取り除き、洗浄及び乾燥を行う。ここまでの工程で、図１Ｂに示したように、キャリア基板１のワーク保持孔２の外縁部１３に、表側凹部４Ａ、裏側凹部４Ｂ及び貫通穴部８が形成される。 When the front side recess 4A and the back side recess 4B are melted to a desired depth and the through hole portion 8 penetrates, the masking portions 5A and 5B are removed, and cleaning and drying are performed. In the steps up to this point, as shown in FIG. 1B, the front side recess 4A, the back side recess 4B, and the through hole 8 are formed in the outer edge portion 13 of the work holding hole 2 of the carrier substrate 1.
このようにしてエッチング加工されたキャリア基板１のワーク保持孔２，・・・の内周面に対して、樹脂インサート部３を設ける。樹脂インサート部３は、合成樹脂材の射出成型又は熱圧着によって設けられる。 The resin insert portion 3 is provided on the inner peripheral surfaces of the work holding holes 2, ... Of the carrier substrate 1 etched in this way. The resin insert portion 3 is provided by injection molding or thermocompression bonding of a synthetic resin material.
射出成型では、ワーク保持孔２の内側面となる位置に型枠を設置して、その型枠とキャリア基板１の外縁部１３との間の空間に加熱溶融させた合成樹脂材を射出注入し、冷却によって固化させる。貫通穴部８は表側凹部４Ａと裏側凹部４Ｂに連続して形成されているので、合成樹脂材が流れ込むことができる。
一方、熱圧着であれば、プリプレグを積層して所望の形状にし、加熱加圧プレスすることによって、樹脂インサート部３を設けることができる。
In injection molding, a mold is installed at a position on the inner surface of the work holding hole 2, and a heat-melted synthetic resin material is injected and injected into the space between the mold and the outer edge 13 of the carrier substrate 1. , Solidified by cooling. Since the through hole portion 8 is continuously formed in the front side recess 4A and the back side recess 4B, the synthetic resin material can flow into the through hole portion 8.
On the other hand, in the case of thermocompression bonding, the resin insert portion 3 can be provided by laminating prepregs to form a desired shape and pressing by heating and pressing.
次に、本実施の形態のワークキャリア１０及びワークキャリア１０の製造方法の作用について説明する。
このように構成された本実施の形態のワークキャリア１０は、表裏方向にそれぞれ窪む表側凹部４Ａと裏側凹部４Ｂとをワーク保持孔２の外縁部１３の周方向に交互に設ける。さらに、表側凹部４Ａ及び裏側凹部４Ｂに連続した表裏方向に貫通する貫通穴部８を設ける。
Next, the operation of the work carrier 10 of the present embodiment and the method of manufacturing the work carrier 10 will be described.
In the work carrier 10 of the present embodiment configured as described above, front side recesses 4A and back side recesses 4B, which are recessed in the front and back directions, are alternately provided in the circumferential direction of the outer edge portion 13 of the work holding hole 2. Further, a through hole portion 8 that penetrates the front side recess 4A and the back side recess 4B in the front and back directions is provided.
この表側凹部４Ａと裏側凹部４Ｂと貫通穴部８とに、それぞれ樹脂インサート部３の一部である充填部３２，３２及び穴充填部３３が設けられると、樹脂インサート部３が周方向に移動する（ずれる）ことを防止することができる。 When the filling portions 32 and 32 and the hole filling portions 33, which are a part of the resin insert portion 3, are provided in the front side recess 4A, the back side recess 4B, and the through hole portion 8, the resin insert portion 3 moves in the circumferential direction. It is possible to prevent it from shifting.
さらに、キャリア基板１の表側と裏側の両方に、周方向に交互に表側凹部４Ａと裏側凹部４Ｂとが形成され、その内空にそれぞれ充填部３２，３２が設けられることにより、キャリア基板１が充填部３２，３２によって挟まれることになるので、キャリア基板１の表裏いずれの方向に対しても樹脂インサート部３が脱落することを防止できるようになる。
例えば射出成型や熱圧着によって樹脂インサート部３を設けた場合、冷却して固化させた際に収縮が起きるが、キャリア基板１の両面に表側凹部４Ａと裏側凹部４Ｂとによる充填部３２，３２が設けられていれば、樹脂インサート部３が多少収縮したとしても脱落を防ぐことができる。
Further, front side recesses 4A and back side recesses 4B are alternately formed on both the front side and the back side of the carrier substrate 1 in the circumferential direction, and the filling portions 32 and 32 are provided in the inner space thereof, whereby the carrier substrate 1 is formed. Since it is sandwiched between the filling portions 32 and 32, it is possible to prevent the resin insert portion 3 from falling off in either the front or back direction of the carrier substrate 1.
For example, when the resin insert portion 3 is provided by injection molding or thermocompression bonding, shrinkage occurs when it is cooled and solidified, but the filling portions 32 and 32 by the front side recesses 4A and the back side recesses 4B are formed on both sides of the carrier substrate 1. If it is provided, it is possible to prevent the resin insert portion 3 from falling off even if it shrinks to some extent.
また、表裏方向に貫通する貫通穴部８に設けられた穴充填部３３は、樹脂インサート部３の径方向の移動を阻止する抵抗部となる。すなわち、樹脂インサート部３が縮むなどしてワーク保持孔２の中心に向けた径方向のずれが起きそうになっても、穴充填部３３が引っ掛かりとなって外れ（剥がれ）を防ぐことができる。 Further, the hole filling portion 33 provided in the through hole portion 8 penetrating in the front and back directions serves as a resistance portion that prevents the resin insert portion 3 from moving in the radial direction. That is, even if the resin insert portion 3 shrinks and the radial deviation toward the center of the work holding hole 2 is likely to occur, the hole filling portion 33 is caught and can be prevented from coming off (peeling). ..
さらに、表側凹部４Ａ及び裏側凹部４Ｂは、凸歯のようなワーク保持孔２の中心に向けて径方向に突出していないため、キャリア基板１が薄い場合であっても適用することができる。例えば、薄板状のワークの研磨加工に使用される1.0mm以下のキャリア基板１に適用できる。また、さらに薄いワークを研磨加工する場合に使用される0.7mm以下、さらには0.5mm以下の厚さの薄いキャリア基板１であっても、適用することができる。 Further, since the front side recess 4A and the back side recess 4B do not project in the radial direction toward the center of the work holding hole 2 such as the convex teeth, the carrier substrate 1 can be applied even when the carrier substrate 1 is thin. For example, it can be applied to a carrier substrate 1 having a thickness of 1.0 mm or less, which is used for polishing a thin plate-shaped workpiece. Further, even a thin carrier substrate 1 having a thickness of 0.7 mm or less, further 0.5 mm or less, which is used when polishing a thinner work, can be applied.
本実施の形態のワークキャリア１０においては、表側凹部４Ａと裏側凹部４Ｂとを周方向に間隔を置いて設けているため、表側凹部４Ａと裏側凹部４Ｂの両側に、それぞれ全厚のキャリア基板１が残されている。このため、厚さが薄くなる表側凹部４Ａ及び裏側凹部４Ｂは、両側と背面側の三辺（隅角部付近を除く）で支持されることになって変形が生じ難くなる。 In the work carrier 10 of the present embodiment, since the front side recess 4A and the back side recess 4B are provided at intervals in the circumferential direction, the carrier substrate 1 having a full thickness is provided on both sides of the front side recess 4A and the back side recess 4B, respectively. Is left. Therefore, the front side recess 4A and the back side recess 4B, which are thinned in thickness, are supported by three sides (excluding the vicinity of the corner portion) on both sides and the back side, so that deformation is less likely to occur.
また、貫通穴部８を表側凹部４Ａと裏側凹部４Ｂとの間ごとに設けることで、樹脂インサート部３の剥がれを、より生じ難くすることができる。すなわち、研磨面に露出された樹脂インサート部３は、研磨加工時にキャリア基板１よりも摩耗や変形が起きやすいが、貫通穴部８に形成される穴充填部３３のようにキャリア基板１と同じ厚さがあれば、繰り返し研磨加工に使用しても樹脂インサート部３の剥がれを生じ難くすることができる。 Further, by providing the through hole portion 8 at each space between the front side recess 4A and the back side recess 4B, it is possible to make it more difficult for the resin insert portion 3 to peel off. That is, the resin insert portion 3 exposed on the polished surface is more likely to be worn or deformed than the carrier substrate 1 during polishing, but is the same as the carrier substrate 1 like the hole filling portion 33 formed in the through hole portion 8. If it is thick, it is possible to prevent the resin insert portion 3 from peeling off even if it is used for repeated polishing.
さらに、このような穴充填部３３を介してすべての表側凹部４Ａと裏側凹部４Ｂとが、キャリア基板１の内部側（ワーク保持孔２の中心と反対側）でも周方向に連続して一体化されていれば、樹脂インサート部３をより剥がれ難くすることができる。 Further, all the front side recesses 4A and the back side recesses 4B are continuously integrated in the circumferential direction on the inner side of the carrier substrate 1 (the side opposite to the center of the work holding hole 2) through such a hole filling portion 33. If so, the resin insert portion 3 can be made more difficult to peel off.
そして、本実施の形態のワークキャリア１０の製造方法であれば、所定の描画パターンでマスキングされたキャリア基板１にエッチング液を付着させることでエッチング加工をし、樹脂インサート部３を設ける工程を経ることで、キャリア基板１と樹脂インサート部３との一体性が高いワークキャリア１０を効率的に製造することができる。 Then, in the manufacturing method of the work carrier 10 of the present embodiment, the etching process is performed by adhering the etching solution to the carrier substrate 1 masked by the predetermined drawing pattern, and the resin insert portion 3 is provided. As a result, the work carrier 10 having a high degree of integration between the carrier substrate 1 and the resin insert portion 3 can be efficiently manufactured.
以下、前記実施の形態で説明したワークキャリア１０とは別の形態の実施例１について、図６，図７Ａ，図７Ｂを参照しながら説明する。なお、前記実施の形態で説明した内容と同一乃至均等な部分の説明については、同一用語又は同一符号を用いて説明する。 Hereinafter, Example 1 of an embodiment different from the work carrier 10 described in the above-described embodiment will be described with reference to FIGS. 6, 7A, and 7B. The same or equivalent parts as those described in the above-described embodiment will be described using the same terms or the same reference numerals.
前記実施の形態では、抵抗部として貫通穴部８に形成される穴充填部３３について説明した。本実施例１では、表側凹部４Ｃ及び裏側凹部４Ｄの底面４１に、抵抗部となる円柱部４２を追加して設ける場合について説明する。 In the above-described embodiment, the hole filling portion 33 formed in the through hole portion 8 as the resistance portion has been described. In the first embodiment, a case where a cylindrical portion 42 serving as a resistance portion is additionally provided on the bottom surface 41 of the front side recess 4C and the back side recess 4D will be described.
本実施例１のキャリア基板１Ａには、表側凹部４Ｃと裏側凹部４Ｄに、図６に示すように円柱部４２が平面視の略中央に設けられる。この円柱部４２は、表側凹部４Ｃ（又は裏側凹部４Ｄ）の底面４１から上方（又は下方）に向けて延伸される突起部である。この円柱部４２の高さは、表側凹部４Ｃ（又は裏側凹部４Ｄ）の深さと等しくキャリア基板１Ａの半分程度になる。 In the carrier substrate 1A of the first embodiment, a cylindrical portion 42 is provided in the front side recess 4C and the back side recess 4D as shown in FIG. 6 at substantially the center in a plan view. The columnar portion 42 is a protrusion extending upward (or downward) from the bottom surface 41 of the front side recess 4C (or the back side recess 4D). The height of the columnar portion 42 is equal to the depth of the front side recess 4C (or the back side recess 4D) and is about half that of the carrier substrate 1A.
この円柱部４２の周囲に、図７Ａ及び図７Ｂに示すように、樹脂インサート部３Ａの一部となるように合成樹脂材が充填されて充填部３２が形成されると、円柱部４２は、樹脂インサート部３Ａの径方向の移動を阻止する抵抗部となる。 As shown in FIGS. 7A and 7B, a synthetic resin material is filled around the columnar portion 42 so as to be a part of the resin insert portion 3A to form the filling portion 32, and the columnar portion 42 becomes a cylinder portion 42. It is a resistance portion that prevents the resin insert portion 3A from moving in the radial direction.
この抵抗部としての機能の高さ（効果）は、突起部の形状によって異なる。図７Ａ及び図７Ｂに示すように、円柱部４２の奥側（ワーク保持孔２の中心と反対側）の側面と底面４１とがなす角度θは、約９０°である。この角度θが大きくなるほど、樹脂インサート部３Ａのワーク保持孔２の中心方向への移動を阻止する機能は高くなる。この角度θは、７０°以上が好ましいが、より好ましくは９０°以上で、角度θが鈍角になって奥側に傾けば、より強い引っ掛かりとすることができる。また、円柱部４２の側面の形状も、側面視で直線状に限定されるものではなく、曲線状や凹凸がある形状であってもよい。 The height (effect) of the function as the resistance portion differs depending on the shape of the protrusion. As shown in FIGS. 7A and 7B, the angle θ formed by the side surface of the cylindrical portion 42 (the side opposite to the center of the work holding hole 2) and the bottom surface 41 is about 90 °. The larger the angle θ, the higher the function of preventing the resin insert portion 3A from moving in the work holding hole 2 toward the center. The angle θ is preferably 70 ° or more, but more preferably 90 ° or more, and if the angle θ becomes obtuse and tilted toward the back side, a stronger catch can be obtained. Further, the shape of the side surface of the cylindrical portion 42 is not limited to a linear shape in a side view, and may be a curved shape or a shape having irregularities.
さらには、表側凹部４Ｃ及び裏側凹部４Ｄに設けられる突起部の形状は、円柱状に限定されるものではなく、直方体状、多角柱状など様々な形状にすることができる。突起部がいかなる形状であっても、樹脂インサート部３Ａの径方向の移動を阻止する移動抑制機能を発揮させることができる。 Further, the shape of the protrusions provided on the front side recess 4C and the back side recess 4D is not limited to a columnar shape, and can be various shapes such as a rectangular parallelepiped shape and a polygonal columnar shape. Regardless of the shape of the protrusion, it is possible to exert a movement suppressing function of preventing the resin insert portion 3A from moving in the radial direction.
この円柱部４２は、マスキング工程において、表側凹部４Ｃ内の円柱部４２となる箇所にマスキングを施し、裏側凹部４Ｄ内の円柱部４２となる箇所にもマスキングを施すことによって、形成することができる。 The columnar portion 42 can be formed by masking the portion of the front side recess 4C that becomes the columnar portion 42 and masking the portion of the back side recess 4D that becomes the columnar portion 42 in the masking step. ..
射出成型では、ワーク保持孔２の内側面となる位置に型枠を設置して、その型枠とキャリア基板１Ａの外縁部１３との間の空間に加熱溶融させた合成樹脂材を射出注入し、冷却によって固化させる。突起部が円柱部４２であれば、合成樹脂材を隙間なくまわり込ませることができる。 In injection molding, a mold is installed at a position on the inner side surface of the work holding hole 2, and a heat-melted synthetic resin material is injection-injected into the space between the mold and the outer edge 13 of the carrier substrate 1A. , Solidified by cooling. If the protruding portion is the cylindrical portion 42, the synthetic resin material can be wrapped around without a gap.
また、表側凹部４Ｃと裏側凹部４Ｄに樹脂インサート部３Ａの径方向の移動を阻止する抵抗部として円柱部４２が追加で設けられると、樹脂インサート部３Ａが縮むなどしてワーク保持孔２の中心に向けた径方向のずれが起きそうになっても、円柱部４２が引っ掛かりとなって外れ（剥がれ）を防ぐことができる。要するに、穴充填部３３の外れ防止機能に、円柱部４２の効果が加算されることになる。 Further, when a cylindrical portion 42 is additionally provided as a resistance portion for preventing the resin insert portion 3A from moving in the radial direction in the front side recess 4C and the back side recess 4D, the resin insert portion 3A shrinks and the center of the work holding hole 2 Even if the radial deviation is likely to occur, the columnar portion 42 can be caught and prevented from coming off (peeling). In short, the effect of the cylindrical portion 42 is added to the function of preventing the hole filling portion 33 from coming off.
さらに、この円柱部４２は、キャリア基板１Ａ自体であって硬質の金属素材によって形成されているため、樹脂インサート部３Ａの移動に対して強い抵抗となって、外れや剥がれを確実に阻止することができる。
なお、実施例１のこの他の構成及び作用効果については、前記実施の形態又は他の実施例と略同様であるため説明を省略する。
Further, since the columnar portion 42 is the carrier substrate 1A itself and is formed of a hard metal material, it becomes a strong resistance to the movement of the resin insert portion 3A and surely prevents the resin insert portion 3A from coming off or peeling off. Can be done.
The other configurations and effects of Example 1 will be omitted because they are substantially the same as those of the above-described embodiment or other examples.
以下、前記実施の形態及び実施例１で説明したワークキャリア１０とは別の形態の実施例２について、図８，図９Ａ，図９Ｂを参照しながら説明する。なお、前記実施の形態又は実施例１で説明した内容と同一乃至均等な部分の説明については、同一用語又は同一符号を用いて説明する。 Hereinafter, the second embodiment different from the work carrier 10 described in the first embodiment and the first embodiment will be described with reference to FIGS. 8, 9A, and 9B. The same or equivalent parts as those described in the above-described embodiment or the first embodiment will be described using the same terms or the same reference numerals.
前記実施例１では、抵抗部として表側凹部４Ｃ及び裏側凹部４Ｄの底面４１に円柱部４２を追加した場合について説明した。本実施例２では、表側凹部６Ａ及び裏側凹部６Ｂの底面６１に、抵抗部となる穴部として円筒部６２を円柱部４２に代えて設ける場合について説明する。 In the first embodiment, the case where the cylindrical portion 42 is added to the bottom surface 41 of the front side recess 4C and the back side recess 4D as the resistance portion has been described. In the second embodiment, a case where a cylindrical portion 62 is provided in the bottom surface 61 of the front side recess 6A and the back side recess 6B as a hole portion to be a resistance portion instead of the cylindrical portion 42 will be described.
本実施例２のキャリア基板１Ｂには、ワーク保持孔２の外縁部１３に設けられる表側凹部６Ａと裏側凹部６Ｂとに、図８に示すように円筒部６２が平面視の略中央に設けられる。この円筒部６２は、表側凹部６Ａ（又は裏側凹部６Ｂ）の底面６１から下方（又は上方）の面に向けて貫通された穴部である。この円筒部６２の深さは、キャリア基板１Ｂの半分程度になる。 In the carrier substrate 1B of the second embodiment, a cylindrical portion 62 is provided in a front side recess 6A and a back side recess 6B provided in the outer edge portion 13 of the work holding hole 2 at substantially the center in a plan view as shown in FIG. .. The cylindrical portion 62 is a hole portion penetrated from the bottom surface 61 of the front side recess 6A (or the back side recess 6B) toward the lower (or upper) surface. The depth of the cylindrical portion 62 is about half that of the carrier substrate 1B.
この円筒部６２の内部に、図９Ａ及び図９Ｂに示すように、樹脂インサート部３Ｂの一部となるように合成樹脂材が充填されて柱状部３５が形成されると、柱状部３５は、樹脂インサート部３Ｂの径方向の移動を阻止する抵抗部となる。 As shown in FIGS. 9A and 9B, the inside of the cylindrical portion 62 is filled with a synthetic resin material so as to be a part of the resin insert portion 3B to form the columnar portion 35. It is a resistance portion that prevents the resin insert portion 3B from moving in the radial direction.
樹脂インサート部３Ｂは、リング状に形成される円環部３１と、表側凹部６Ａ及び裏側凹部６Ｂの内空に形成される直方体状の充填部３４，・・・と、円筒部６２，・・・の内部に形成される円柱状の柱状部３５，・・・と、貫通穴部８の内空に形成される穴充填部３３，・・・とによって構成される。この円環部３１と充填部３４，・・・と柱状部３５，・・・と穴充填部３３，・・・とは、合成樹脂材によって一体に成形される。 The resin insert portion 3B includes a ring-shaped annular portion 31, a rectangular parallelepiped filling portion 34 formed in the inner space of the front side recess 6A and the back side recess 6B, and a cylindrical portion 62. -It is composed of a columnar columnar portion 35, ... Formed inside, and a hole filling portion 33, ... Formed in the inner space of the through hole portion 8. The annular portion 31, the filling portion 34, ..., The columnar portion 35, ..., And the hole filling portion 33, ... Are integrally formed of a synthetic resin material.
このように構成された実施例２のワークキャリア１０は、表裏方向にそれぞれ窪む表側凹部６Ａと裏側凹部６Ｂとがワーク保持孔２の外縁部１３の周方向に交互に設けられるとともに、表側凹部６Ａ及び裏側凹部６Ｂの円筒部６２には、樹脂インサート部３Ｂの一部である柱状部３５が設けられる。 In the work carrier 10 of the second embodiment configured in this way, front side recesses 6A and back side recesses 6B, which are recessed in the front and back directions, are alternately provided in the circumferential direction of the outer edge portion 13 of the work holding hole 2, and the front side recesses are provided. The cylindrical portion 62 of the 6A and the back side recess 6B is provided with a columnar portion 35 which is a part of the resin insert portion 3B.
この円筒部６２の内部に延伸される柱状部３５は、樹脂インサート部３Ｂが縮むなどしてワーク保持孔２の中心に向けた径方向のずれが起きそうになっても、引っ掛かりとなって外れを防ぐ抵抗部となる。要するに、穴充填部３３の外れ防止機能に、柱状部３５の効果が加算されることになる。 The columnar portion 35 extending inside the cylindrical portion 62 is caught and disengaged even if the resin insert portion 3B shrinks and the radial deviation toward the center of the work holding hole 2 is likely to occur. It becomes a resistance part to prevent. In short, the effect of the columnar portion 35 is added to the function of preventing the hole filling portion 33 from coming off.
ここで、表側凹部６Ａ及び裏側凹部６Ｂに設けられる穴部の形状は、円筒状に限定されるものではなく、直方筒状、多角筒状など様々な形状にすることができる。穴部がいかなる形状であっても、樹脂インサート部３Ｂの径方向の移動を阻止する移動抑制機能を発揮させることができる。 Here, the shape of the holes provided in the front side recess 6A and the back side recess 6B is not limited to a cylindrical shape, and may be various shapes such as a rectangular cylinder shape and a polygonal cylinder shape. Regardless of the shape of the hole, it is possible to exert a movement suppressing function of preventing the resin insert portion 3B from moving in the radial direction.
また、実施例２のワークキャリア１０では、表側凹部６Ａ及び裏側凹部６Ｂに設けられる充填部３４，・・・によって周方向の回り止め機能及び表裏方向への抜け防止機能が発揮され、貫通穴部８に設けられる穴充填部３３，・・・と円筒部６２，・・・に設けられる柱状部３５，・・・とによって周方向の回り止め機能及び径方向の移動抑制機能が発揮されるので、キャリア基板１Ｂと樹脂インサート部３Ｂとの高い一体性を確保することができる。
なお、実施例２のこの他の構成及び作用効果については、前記実施の形態又は他の実施例と略同様であるため説明を省略する。
Further, in the work carrier 10 of the second embodiment, the filling portions 34, ... Provided in the front side recess 6A and the back side recess 6B exert a function of preventing rotation in the circumferential direction and a function of preventing pulling out in the front and back directions, and a through hole portion. Since the hole filling portion 33, ... Provided in 8 and the columnar portion 35, ... Provided in the cylindrical portion 62, ..., the rotation prevention function in the circumferential direction and the movement suppression function in the radial direction are exhibited. , High integrity between the carrier substrate 1B and the resin insert portion 3B can be ensured.
Since the other configurations and effects of Example 2 are substantially the same as those of the above-described embodiment or other examples, description thereof will be omitted.
以下、前記実施の形態及び実施例１，２で説明したワークキャリア１０とは別の形態の実施例３について、図１０を参照しながら説明する。なお、前記実施の形態又は実施例１，２で説明した内容と同一乃至均等な部分の説明については、同一用語又は同一符号を用いて説明する。 Hereinafter, the third embodiment different from the work carrier 10 described in the first and second embodiments will be described with reference to FIG. 10. The same or equivalent parts as those described in the above-described embodiment or Examples 1 and 2 will be described using the same terms or the same reference numerals.
前記実施の形態及び実施例１，２では、貫通穴部８の穴充填部３３並びに表側凹部４Ｃ，６Ａ及び裏側凹部４Ｄ，６Ｂの底面４１，６１に円柱部４２又は円筒部６２を設けて抵抗部とする場合について説明した。本実施例３では、表側凹部７Ａ及び裏側凹部７Ｂの平面視の形状によって抵抗部を形成する場合について説明する。 In the above-described embodiment and Examples 1 and 2, a cylindrical portion 42 or a cylindrical portion 62 is provided on the bottom surfaces 41 and 61 of the hole filling portion 33 of the through hole portion 8 and the front side recesses 4C and 6A and the back side recesses 4D and 6B to resist. The case of making a part was explained. In the third embodiment, a case where the resistance portion is formed by the shape of the front side recess 7A and the back side recess 7B in a plan view will be described.
本実施例３の抵抗部は、図１０に示すように、表側凹部７Ａ及び裏側凹部７Ｂの傾斜面となる側面７１，７１によって形成される狭隘部である。すなわち側面７１は、ワーク保持孔２の中心側から外側に向けて広がる方向に傾斜している。この結果、表側凹部７Ａ及び裏側凹部７Ｂは、平面視で開放側（ワーク保持孔２の中心側）が狭くなった狭隘部を有することになり、全体では奥側が広い台形状（楔状）に形成される。 As shown in FIG. 10, the resistance portion of the third embodiment is a narrow portion formed by the side surfaces 71 and 71 which are inclined surfaces of the front side recess 7A and the back side recess 7B. That is, the side surface 71 is inclined in a direction that spreads outward from the center side of the work holding hole 2. As a result, the front side recess 7A and the back side recess 7B have a narrow portion in which the open side (center side of the work holding hole 2) is narrowed in a plan view, and the back side is formed into a wide trapezoidal shape (wedge shape) as a whole. Will be done.
ここで、抵抗部としては、表側凹部７Ａ及び裏側凹部７Ｂに、平面視でワーク保持孔２の中心側が狭くなる狭隘部が形成されていればよいため、側面７１は直線的な傾斜面に限定されるものではなく、曲線的であってもよい。例えば、表側凹部７Ａ及び裏側凹部７Ｂを、平面視でＴ字状やＹ字状やフラスコ状に形成することで、ワーク保持孔２の中心側に狭隘部を設けることもできる。 Here, as the resistance portion, the side surface 71 is limited to a linear inclined surface because it is sufficient that the front side recess 7A and the back side recess 7B are formed with a narrow portion in which the center side of the work holding hole 2 is narrowed in a plan view. It may be curved rather than being done. For example, by forming the front side recess 7A and the back side recess 7B in a T-shape, a Y-shape, or a flask shape in a plan view, a narrow portion can be provided on the center side of the work holding hole 2.
そして、貫通穴部８Ａは、表側凹部７Ａの奥側（ワーク保持孔２の中心と反対側）の頂点部と裏側凹部７Ｂの奥側の頂点部とを繋ぐように、例えば平面視長円状に形成される。このため、表側凹部７Ａ（又は裏側凹部７Ｂ）と貫通穴部８Ａとが重なる位置では、キャリア基板１Ｃの表側から裏側（又はキャリア基板１Ｃの裏側から表側）に向けての窪みが欠けて貫通した穴となる。 Then, the through hole portion 8A has, for example, an oval shape in a plan view so as to connect the apex portion on the back side of the front side recess 7A (the side opposite to the center of the work holding hole 2) and the apex portion on the back side of the back side recess 7B. Is formed in. Therefore, at the position where the front side recess 7A (or the back side recess 7B) and the through hole portion 8A overlap, the recess from the front side to the back side (or from the back side to the front side of the carrier board 1C) of the carrier substrate 1C is missing and penetrates. It becomes a hole.
この貫通穴部８Ａに、樹脂インサート部３Ｃの一部となるように合成樹脂材が充填されて穴充填部３３Ａが形成されると、樹脂インサート部３Ｃの径方向の移動を阻止する抵抗部となる。
穴充填部３３Ａは、キャリア基板１の厚さと同じ厚さとなるため、強い引っ掛かりとすることができる。
When the through hole portion 8A is filled with a synthetic resin material so as to be a part of the resin insert portion 3C to form the hole filling portion 33A, a resistance portion that prevents the resin insert portion 3C from moving in the radial direction is formed. Become.
Since the hole filling portion 33A has the same thickness as the carrier substrate 1, it can be strongly hooked.
さらに、台形状の表側凹部７Ａと裏側凹部７Ｂの内空に、樹脂インサート部３Ｃの一部となるように合成樹脂材が充填されて充填部３６が形成されると、楔状の充填部３６は、狭隘部においてワーク保持孔２の中心側へは移動しにくい状態となって樹脂インサート部３Ｃの径方向の移動を阻止する抵抗部となる。 Further, when a synthetic resin material is filled in the inner space of the trapezoidal front side recess 7A and the back side recess 7B so as to be a part of the resin insert portion 3C to form the filling portion 36, the wedge-shaped filling portion 36 becomes In the narrow portion, it becomes difficult to move to the center side of the work holding hole 2, and it becomes a resistance portion that prevents the resin insert portion 3C from moving in the radial direction.
樹脂インサート部３Ｃは、リング状に形成される円環部３１と、表側凹部７Ａ及び裏側凹部７Ｂの内空に形成される充填部３６，・・・と、貫通穴部８Ａの内空に形成される穴充填部３３Ａ，・・・とによって構成される。この円環部３１と充填部３６，・・・と穴充填部３３Ａ，・・・とは、合成樹脂材によって一体に成形される。 The resin insert portion 3C is formed in the inner space of the ring-shaped annular portion 31, the filling portion 36, ... Formed in the inner space of the front side concave portion 7A and the back side concave portion 7B, and the through hole portion 8A. It is composed of the hole filling portions 33A, ... The ring portion 31, the filling portion 36, ..., And the hole filling portion 33A, ... Are integrally formed of a synthetic resin material.
このように構成された実施例３のワークキャリア１０は、表裏方向にそれぞれ窪む平面視略楔形の表側凹部７Ａと裏側凹部７Ｂとがワーク保持孔２の外縁部１３の周方向に交互に設けられる。 In the work carrier 10 of the third embodiment configured in this way, the front side recesses 7A and the back side recesses 7B, which are recessed in the front and back directions, respectively, are provided alternately in the circumferential direction of the outer edge portion 13 of the work holding hole 2. Be done.
この表側凹部７Ａ及び裏側凹部７Ｂに設けられる平面視略楔形の充填部３６，・・・によって周方向の回り止め機能及び表裏方向への抜け防止機能が発揮されるとともに、径方向の移動抑制機能が発揮されるので、貫通穴部８Ａに形成される穴充填部３３Ａの機能に加えてキャリア基板１Ｃと樹脂インサート部３Ｃとの高い一体性を確保することができる。 The front side recess 7A and the back side recess 7B are provided with a substantially wedge-shaped filling portion 36, ... In addition to the function of the hole filling portion 33A formed in the through hole portion 8A, a high degree of integrity between the carrier substrate 1C and the resin insert portion 3C can be ensured.
また、狭隘部による抵抗部には、突起部や穴部による抵抗部を組み合わせることもできる。この場合も、樹脂インサート部３Ｃの径方向の移動を阻止する移動抑制機能を高めることができる。
なお、実施例３のこの他の構成及び作用効果については、前記実施の形態又は他の実施例と略同様であるため説明を省略する。
Further, the resistance portion formed by the narrow portion may be combined with the resistance portion formed by the protrusion portion or the hole portion. Also in this case, it is possible to enhance the movement suppressing function of preventing the resin insert portion 3C from moving in the radial direction.
Since the other configurations and effects of Example 3 are substantially the same as those of the above-described embodiment or other examples, description thereof will be omitted.
以上、図面を参照して、本発明の実施の形態及び実施例を詳述してきたが、具体的な構成は、この実施の形態及び実施例に限らず、本発明の要旨を逸脱しない程度の設計的変更は、本発明に含まれる。 Although the embodiments and examples of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to the embodiments and the examples, and does not deviate from the gist of the present invention. Design changes are included in the present invention.
例えば前記実施の形態及び実施例では、ワーク保持孔２が円形のワークキャリア１０について説明したが、これに限定されるものではない。例えば長方形（正方形を含む）のワーク保持孔を有するワークキャリアに対しても本発明を適用することができる。要するに、長方形のワーク保持孔の内周面の周方向に交互に、表裏方向にそれぞれ窪む表側凹部と裏側凹部とを形成するとともに表側凹部及び裏側凹部に連続した貫通穴部を形成し、その内周面に沿って長方形の樹脂インサート部を設けることができる。さらに、ワーク保持孔は、円形及び長方形以外の別の形状であってもよい。 For example, in the above-described embodiment and the embodiment, the work carrier 10 having the work holding hole 2 having a circular shape has been described, but the present invention is not limited thereto. For example, the present invention can be applied to a work carrier having a rectangular (including a square) work holding hole. In short, the front side recesses and the back side recesses that are recessed in the front and back directions are formed alternately in the circumferential direction of the inner peripheral surface of the rectangular work holding hole, and continuous through holes are formed in the front side recesses and the back side recesses. A rectangular resin insert portion can be provided along the inner peripheral surface. Further, the work holding hole may have a shape other than circular and rectangular.
また、前記実施の形態及び実施例では、貫通穴部８，８Ａが表側凹部４Ａ，４Ｃ，６Ａ，７Ａと裏側凹部４Ｂ，４Ｄ，６Ｂ，７Ｂとの間ごとに設けられている場合について説明したが、これに限定されるものではなく、１つ置きや２つ置きなどすべての間に設ける必要はない。 Further, in the above-described embodiment and the embodiment, the case where the through-hole portions 8, 8A are provided between the front side recesses 4A, 4C, 6A, 7A and the back side recesses 4B, 4D, 6B, 7B has been described. However, the present invention is not limited to this, and it is not necessary to provide it between every other one or every two.
１０ ワークキャリア
１ キャリア基板
１３ 外縁部
２ ワーク保持孔
３ 樹脂インサート部
４Ａ 表側凹部
４Ｂ 裏側凹部
５Ａ，５Ｂ マスキング部
１Ａ キャリア基板
３Ａ 樹脂インサート部
４Ｃ 表側凹部
４Ｄ 裏側凹部
４１ 底面
４２ 円柱部（突起部）
１Ｂ キャリア基板
６Ａ 表側凹部
６Ｂ 裏側凹部
６１ 底面
６２ 円筒部（穴部）
１Ｃ キャリア基板
３Ｃ 樹脂インサート部
７Ａ 表側凹部
７Ｂ 裏側凹部
10 Work carrier 1 Carrier board 13 Outer edge 2 Work holding hole 3 Resin insert 4A Front recess 4B Back recess 5A, 5B Masking section 1A Carrier board 3A Resin insert 4C Front recess 4D Back recess 41 Bottom 42 Cylindrical part (projection)
1B Carrier board 6A Front side recess 6B Back side recess 61 Bottom surface 62 Cylindrical part (hole part)
1C Carrier board 3C Resin insert 7A Front recess 7B Back recess
Claims (6)
前記ワーク保持孔の外縁部となる前記キャリア基板には、周方向に交互に、表裏方向にそれぞれ窪む表側凹部と裏側凹部とが形成されているとともに、
前記表側凹部及び裏側凹部に連続した前記表裏方向に貫通する貫通穴部が設けられ、
前記表側凹部、裏側凹部及び貫通穴部並びに前記ワーク保持孔の内周面に沿った部分に樹脂インサート部となる合成樹脂材が充填されていることを特徴とするワークキャリア。 A work carrier in which a resin insert portion is provided along the inner peripheral surface of a work holding hole formed in a metal carrier substrate.
The carrier substrate, which is the outer edge of the work holding hole, is formed with front side recesses and back side recesses that are alternately recessed in the front and back directions in the circumferential direction.
The front side recess and the back side recess are provided with a continuous through hole portion penetrating in the front and back directions.
A work carrier characterized in that a synthetic resin material serving as a resin insert portion is filled in the front side recess, the back side recess, the through hole portion, and the portion along the inner peripheral surface of the work holding hole.
前記キャリア基板の表面及び裏面を所定の描画パターンでマスキングをする工程と、
マスキングされた前記キャリア基板にエッチング液を付着させる工程と、
前記エッチング液によって加工された前記キャリア基板に対して前記樹脂インサート部を設ける工程とを備えたことを特徴とするワークキャリアの製造方法。 The work carrier manufacturing method according to any one of claims 1 to 5.
A step of masking the front surface and the back surface of the carrier substrate with a predetermined drawing pattern, and
The process of adhering the etching solution to the masked carrier substrate and
A method for manufacturing a work carrier, which comprises a step of providing the resin insert portion on the carrier substrate processed by the etching solution.
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| JP2017068834A JP6792106B2 (en) | 2017-03-30 | 2017-03-30 | Work carrier and manufacturing method of work carrier |
| KR1020180027540A KR102447660B1 (en) | 2017-03-30 | 2018-03-08 | Work carrier and manufacturing method of work carrier |
| TW107110240A TWI723256B (en) | 2017-03-30 | 2018-03-26 | Workpiece carrier and manufacturing method of workpiece carrier |
| CN201810250478.8A CN108687656B (en) | 2017-03-30 | 2018-03-26 | Workpiece planetary wheel and manufacturing method thereof |
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| CN115847281A (en) * | 2022-12-07 | 2023-03-28 | 西安奕斯伟材料科技有限公司 | Carrier and device for double-sided polishing of silicon wafer |
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| JP3086591B2 (en) | 1994-06-15 | 2000-09-11 | 三洋電機株式会社 | Surveillance video camera |
| JPH10135137A (en) * | 1996-10-31 | 1998-05-22 | Semiconductor Energy Lab Co Ltd | Method of forming crystalline semiconductor |
| JP3482130B2 (en) * | 1998-07-10 | 2003-12-22 | 株式会社岸田製作所 | Holding device for flat polishing of brittle thin plate |
| JP2001179615A (en) * | 1999-12-27 | 2001-07-03 | Seiko Epson Corp | Polishing carrier, surface polishing device and surface polishing method |
| PL360294A1 (en) * | 2000-07-05 | 2004-09-06 | Yamanouchi Pharmaceutical Co.Ltd. | Propane-1,3-dione derivatives |
| MY118114A (en) * | 2000-07-10 | 2004-08-30 | Sumitomo Bakelite Co | Holder for polished work and manufacturing method thereof |
| JP3439726B2 (en) * | 2000-07-10 | 2003-08-25 | 住友ベークライト株式会社 | Material to be polished and method of manufacturing the same |
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| KR100398141B1 (en) * | 2000-10-12 | 2003-09-13 | 아남반도체 주식회사 | Chemical mechanical polishing slurry composition and planarization method using same for semiconductor device |
| JP5114113B2 (en) * | 2007-07-02 | 2013-01-09 | スピードファム株式会社 | Work carrier |
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| JP2009260272A (en) * | 2008-03-25 | 2009-11-05 | Panasonic Corp | Method of processing substrate, method of manufacturing semiconductor chip and method of manufacturing semiconductor chip with resin adhesion layer |
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