JP6733246B2 - Electronic component cooling device and electronic component provided with cooling device - Google Patents

Electronic component cooling device and electronic component provided with cooling device Download PDF

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JP6733246B2
JP6733246B2 JP2016056688A JP2016056688A JP6733246B2 JP 6733246 B2 JP6733246 B2 JP 6733246B2 JP 2016056688 A JP2016056688 A JP 2016056688A JP 2016056688 A JP2016056688 A JP 2016056688A JP 6733246 B2 JP6733246 B2 JP 6733246B2
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cooling medium
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正義 三好
正義 三好
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NEC Corp
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Description

本発明は、効率的な冷却が可能な電子部品冷却装置、冷却装置を備えた電子部品及び電子部品冷却方法に関する。 The present invention relates to an electronic component cooling device capable of efficient cooling, an electronic component including the cooling device, and an electronic component cooling method.

電子部品等の対象物を冷却する技術として特許文献１に示されるラジエータが知られている。
この特許文献１に示されるラジエータでは、隣接する放熱フィンのいずれか一方に、温度変化により変形される形状記憶合金からなる遮蔽板の一端を支持した構成とされる。
この遮蔽板は、設定温度よりも高いときに、支持された放熱フィンに沿った真直状態とされることで放熱を促進する一方で、設定温度よりも低いときに、その先端を隣接するフィンの表面に近接ないし接触させて該隣接するフィンとの間隙を密閉する。
そして、このような遮蔽板によるフィンの間隙封鎖により、対象部品が動作を開始してから所定の使用環境温度に上昇するまで冷却を抑止する。 A radiator disclosed in Patent Document 1 is known as a technique for cooling an object such as an electronic component.
In the radiator shown in Patent Document 1, one end of a shield plate made of a shape memory alloy that is deformed by a temperature change is supported by one of the adjacent radiating fins.
This shield plate promotes heat dissipation by being in a straight state along the supported heat radiation fins when the temperature is higher than the set temperature, while at the time when the temperature is lower than the set temperature, the tip of the adjacent fins is The space between the adjacent fins is closed by bringing the surface close to or in contact with it.
Then, the fins are closed by the shielding plate to suppress the cooling from the start of the operation of the target component until the temperature rises to a predetermined operating environment temperature.

実開平０２−１１４９９１号公報Japanese Utility Model Publication No. 02-114991

ところで、特許文献１に示される技術は、冷却媒体として空気を用いているために、熱伝達効率が悪く、最適な温度で遮蔽板を作動させることが難しいという問題があった。
また、特許文献１では、隣接するフィンの間という開放された空間に遮蔽板が設置されているので、ヒートパイプのような閉空間に収容される低沸点の作動液を冷却媒体として流通させることはできず、この点において改善が期待されていた。 By the way, the technique disclosed in Patent Document 1 has a problem that the heat transfer efficiency is poor and it is difficult to operate the shielding plate at an optimum temperature because air is used as the cooling medium.
Further, in Patent Document 1, since the shielding plate is installed in the open space between the adjacent fins, the working fluid having a low boiling point contained in a closed space such as a heat pipe is circulated as a cooling medium. However, improvement was expected in this respect.

この発明は、上述した事情に鑑みてなされたものであって、熱伝達効率の高い冷却媒体を使用することができ、対象部品が動作を開始して所定の使用環境温度に上昇した際に適切なタイミングで冷却を開始することができる、電子部品冷却装置、冷却装置を備えた電子部品及び電子部品冷却方法を提供する。 The present invention has been made in view of the above circumstances, and can use a cooling medium having high heat transfer efficiency, and is suitable when a target component starts operating and rises to a predetermined operating environment temperature. Provided are an electronic component cooling device, an electronic component including the cooling device, and an electronic component cooling method capable of starting cooling at various timings.

上記課題を解決するために、この発明は以下の手段を提案している。
本発明は、動作に伴って熱を発生する発熱部品に設けられ、該発熱部品から熱を受ける冷却媒体が収容された冷却媒体タンクと、この冷却媒体タンクの冷媒収容部に接続されて前記発熱部品から熱を受け取った冷却媒体を受け入れて放熱させる放熱部と、これら冷却媒体タンクと放熱部との間で冷却媒体を流通させる通路と、この通路を開閉する弁と、該弁を前記冷却媒体が所定温度以上となることにより開放させる弁機構とを具備することを特徴とする。 In order to solve the above problems, the present invention proposes the following means.
The present invention provides a cooling medium tank that is provided in a heat-generating component that generates heat in accordance with an operation, and that stores a cooling medium that receives heat from the heat-generating component, and the heat-generating component that is connected to a coolant containing portion of the cooling medium tank. A heat radiating portion that receives a cooling medium that has received heat from a component and radiates the heat, a passage that circulates the cooling medium between the cooling medium tank and the heat radiating portion, a valve that opens and closes this passage, and the valve is the cooling medium. Is provided with a valve mechanism that opens when the temperature exceeds a predetermined temperature.

本発明では、発熱部品が動作を開始して所定の使用環境温度に上昇した際、適切なタイミングで冷却を開始することが可能となる。 According to the present invention, when the heat-generating component starts operating and rises to a predetermined operating environment temperature, it becomes possible to start cooling at an appropriate timing.

本発明に係る電子部品冷却装置を示す概略構成図である。It is a schematic block diagram which shows the electronic component cooling device which concerns on this invention. 本発明の第１実施形態に係る電子部品冷却装置の概略構成図である。It is a schematic block diagram of the electronic component cooling device which concerns on 1st Embodiment of this invention. 弁機構の動作を示す図であって、（Ａ）は弁が閉状態、（Ｂ）は弁が開状態にある場合の動作図である。It is a figure which shows operation|movement of a valve mechanism, (A) is an operation|movement figure when a valve is in a closed state and (B) is an open state. 図２の変形例を示す図である。It is a figure which shows the modification of FIG. 本発明の第２実施形態に係る電子部品冷却装置の概略構成図である。It is a schematic block diagram of the electronic component cooling device which concerns on 2nd Embodiment of this invention. 本発明の第３実施形態に係る電子部品冷却装置の概略構成図である。It is a schematic block diagram of the electronic component cooling device which concerns on 3rd Embodiment of this invention.

本発明に係る電子部品冷却装置１００について図１を参照して説明する。
図１に符号１で示すものは動作に伴って熱を発生する発熱部品であって、例えばＣＰＵなどの電子部品で構成されている。 An electronic component cooling device 100 according to the present invention will be described with reference to FIG.
A reference numeral 1 in FIG. 1 is a heat-generating component that generates heat in accordance with an operation, and is composed of an electronic component such as a CPU.

発熱部品１には冷却媒体タンク２が接触して配置されている。
この冷却媒体タンク２は、発熱部品１から熱を受ける冷却媒体Ｓが収容された冷媒収容部３を有するものであって、該冷媒収容部３は閉空間となるように形成されている。また、この冷却冷媒タンク２の冷媒収容部３には、発熱部品１から熱を受け取った冷却媒体Ｓを受け入れて放熱させる放熱部４が接続されている。 A cooling medium tank 2 is arranged in contact with the heat generating component 1.
The cooling medium tank 2 has a coolant containing portion 3 containing a cooling medium S that receives heat from the heat-generating component 1, and the coolant containing portion 3 is formed as a closed space. Further, to the refrigerant storage portion 3 of the cooling refrigerant tank 2, a heat radiation portion 4 that receives the cooling medium S that has received heat from the heat generating component 1 and radiates the heat is connected.

これら冷却媒体タンク２と放熱部４との間には冷却媒体Ｓを流通させる通路５が設けられており、この通路５には弁機構６が設けられている。
この弁機構６は、冷却媒体Ｓが所定温度以上となることにより開放させる開閉弁７を有している。なお所定温度とは、例えば、前記発熱部品１が実際に動作することができる、あるいは、製造者が所定の性能を保証することができる温度領域の最低温度をいう。 A passage 5 for circulating the cooling medium S is provided between the cooling medium tank 2 and the heat radiating portion 4, and a valve mechanism 6 is provided in the passage 5.
The valve mechanism 6 has an opening/closing valve 7 that opens when the cooling medium S reaches a predetermined temperature or higher. The predetermined temperature means, for example, the lowest temperature in a temperature range in which the heat generating component 1 can actually operate or the manufacturer can guarantee a predetermined performance.

そして、以上のように構成された電子部品冷却装置１００では、動作に伴い発熱部品１から熱が発生した場合に、この熱が、冷却媒体タンク２の冷却媒体Ｓに伝達され、その後、該冷却媒体Ｓを通じて放熱部４から放出される。ここで、冷却媒体タンク２の冷媒収容部３は閉空間に形成されているので、該冷媒収容部３内にて熱伝達効率の高い冷却媒体Ｓを使用することができる。
また、冷却媒体タンク２と放熱部４との間で冷却媒体Ｓを流通させる通路５の途中には弁機構６の開閉弁７が設けられており、この開閉弁７が、冷却媒体Ｓが所定温度以上となることにより開放されるように設定されている。
すなわち、本発明の電子部品冷却装置１００では、冷却媒体タンク２の閉空間となる冷媒収容部３内に熱伝達効率の高い冷却媒体Ｓを使用でき、かつ通路５の途中に、該冷却媒体Ｓが所定温度以上となることにより開放される弁機構６を設けることで、発熱部品１が使用環境温度に上昇した後、発熱部品１を適切に冷却して使用環境温度の上限を越えないようにすることが可能となる。 Then, in the electronic component cooling device 100 configured as described above, when heat is generated from the heat generating component 1 during operation, this heat is transferred to the cooling medium S in the cooling medium tank 2 and then the cooling is performed. The heat is radiated from the heat dissipation portion 4 through the medium S. Here, since the refrigerant storage portion 3 of the cooling medium tank 2 is formed in the closed space, the cooling medium S having high heat transfer efficiency can be used in the refrigerant storage portion 3.
Further, an opening/closing valve 7 of a valve mechanism 6 is provided in the middle of a passage 5 for circulating the cooling medium S between the cooling medium tank 2 and the heat radiating section 4, and the opening/closing valve 7 allows the cooling medium S to have a predetermined size. It is set to open when the temperature rises above the temperature.
That is, in the electronic component cooling device 100 of the present invention, the cooling medium S having high heat transfer efficiency can be used in the coolant containing portion 3 which is the closed space of the cooling medium tank 2, and the cooling medium S can be provided in the middle of the passage 5. By providing the valve mechanism 6 that is opened when the temperature exceeds a predetermined temperature, the heat generating component 1 is appropriately cooled after the temperature of the heat generating component 1 rises to the use environment temperature so that the upper limit of the use environment temperature is not exceeded. It becomes possible to do.

（第１実施形態）
図１をさらに具体化した本発明の第１実施形態に係る電子部品冷却装置１０１について、図２及び図３を参照して説明する。
図２に符号１１で示されるのはＣＰＵなどの電子部品で構成される発熱部品であって、キャリア２１を介して台座２２上に固定されている。 (First embodiment)
An electronic component cooling device 101 according to a first embodiment of the present invention, which is a more specific version of FIG. 1, will be described with reference to FIGS. 2 and 3.
Reference numeral 11 in FIG. 2 denotes a heat-generating component including an electronic component such as a CPU, which is fixed on the pedestal 22 via the carrier 21.

発熱部品１１の上面には冷却媒体タンク１２が接触配置されている。
冷却媒体タンク１２は、発熱部品１１から熱を受ける冷却媒体Ｓが収容された冷媒収容部１３を内部に有するものであって、該冷媒収容部１３は閉空間となるように形成されている。また、この冷却冷媒タンク１２の上部には、発熱部品１１から熱を受け取った冷却媒体Ｓを受け入れて放熱させる放熱部１４が接続されている。
この放熱部１４は、ヒートシンク２３と、該ヒートシンク２３の上部に設けられた放熱フィン２４とから構成されたものであって、これらヒートシンク２３及び放熱フィン２４を介して冷媒収容部１３内の冷却媒体Ｓの熱が放出される。 A cooling medium tank 12 is arranged in contact with the upper surface of the heat generating component 11.
The cooling medium tank 12 has therein a refrigerant containing portion 13 containing a cooling medium S that receives heat from the heat generating component 11, and the refrigerant containing portion 13 is formed as a closed space. Further, a heat radiating portion 14 that receives the cooling medium S that has received heat from the heat generating component 11 and radiates the heat is connected to the upper portion of the cooling refrigerant tank 12.
The heat dissipating portion 14 is composed of a heat sink 23 and heat dissipating fins 24 provided on the heat sink 23, and the cooling medium in the refrigerant accommodating portion 13 is provided via the heat sink 23 and the heat dissipating fins 24. The heat of S is released.

これら冷却媒体タンク１２と放熱部１４との間には冷却媒体Ｓを流通させる２本の通路１５が設けられている。
これら通路１５は、下方に位置する冷却媒体タンク１２と上方に位置する放熱部１４とを接続するように上下方向に配置されたものであって、互いが並列するように配置されている。また、これら通路１５内には、冷却媒体タンク１２から放熱部１４に至る閉空間の冷媒収容部１３が形成されている。 Two passages 15 for circulating the cooling medium S are provided between the cooling medium tank 12 and the heat radiating portion 14.
These passages 15 are vertically arranged so as to connect the cooling medium tank 12 located below and the heat dissipation portion 14 located above, and are arranged in parallel with each other. In addition, inside these passages 15, a refrigerant accommodating portion 13 that is a closed space from the cooling medium tank 12 to the heat radiating portion 14 is formed.

また、これら通路１５には弁機構１６が設けられている。
この弁機構１６は各通路１５の下部でかつ冷却媒体タンク１２側の開口部に位置する開閉弁１７を有するものである。
また、各開閉弁１７は、図３に示されるように、冷却媒体Ｓが所定温度以上となることにより開放させる構造、例えば、形状記憶合金又はバイメタルが温度変化にともなって変形することにより弁体を機械的に開閉するアクチュエータが内蔵されている。なお開閉弁に設けられて流路を開閉する弁体自体をバイメタルあるいは形状記憶合金により構成して流路を開く形状または閉じる形状に機械的に変形させることにより、流路を開閉するようにしても良い。 A valve mechanism 16 is provided in these passages 15.
This valve mechanism 16 has an opening/closing valve 17 located at the lower part of each passage 15 and at the opening on the cooling medium tank 12 side.
Further, as shown in FIG. 3, each on-off valve 17 has a structure in which the cooling medium S is opened when the temperature of the cooling medium S becomes a predetermined temperature or higher, for example, a shape memory alloy or a bimetal is deformed due to a temperature change, and thus the valve body is deformed. An actuator that mechanically opens and closes is built in. It should be noted that the valve body itself which is provided in the on-off valve and which opens and closes the flow path is made of bimetal or shape memory alloy and is mechanically deformed into an open shape or a closed shape to open and close the flow path. Is also good.

そして、上記開閉弁１７では、図３（Ａ）に示されるように、冷却媒体Ｓの温度が上昇しない停止時又は起動から所定時間経過するまでの間、通路１５を閉状態として、冷却媒体Ｓの循環及び熱移動を防止する。
また、上記開閉弁１７では、図３（Ｂ）に示されるように、冷却媒体Ｓの温度が上昇した定常運転時において通路１５を開状態として、冷却媒体Ｓの循環及び熱移動を行わせ、放熱部１４を介して発熱部品１１の放熱（冷却）を行わせる。
このとき、冷媒収容部１３では、内部にて冷却溶媒Ｓの気化及び液化が繰り返されることで、発熱部品１１で生じた熱が、冷却媒体タンク１２、通路１５及び放熱部１４の放熱フィン２４を経由して外部に放出される。 Then, in the on-off valve 17, as shown in FIG. 3A, the passage 15 is closed and the cooling medium S is closed until the temperature of the cooling medium S does not rise or a predetermined time elapses from the start. Prevents circulation and heat transfer.
Further, in the on-off valve 17, as shown in FIG. 3(B), during the steady operation in which the temperature of the cooling medium S has risen, the passage 15 is opened to cause the cooling medium S to circulate and transfer heat. Heat generation (cooling) of the heat-generating component 11 is performed via the heat radiation unit 14.
At this time, in the refrigerant containing portion 13, vaporization and liquefaction of the cooling solvent S are repeated inside, so that the heat generated in the heat generating component 11 causes the cooling medium tank 12, the passage 15 and the heat radiation fins 24 of the heat radiation portion 14 to flow. It is released to the outside via.

そして、以上のように構成された電子部品冷却装置１０１では、動作に伴い発熱部品１１から発生した熱が、冷却媒体タンク１２の冷却媒体Ｓに伝達され、その後、該冷却媒体Ｓを通じて放熱部１４から放出される。
また、冷却媒体タンク１２と放熱部１４との間で冷却媒体Ｓを流通させる通路１５の途中には、弁機構１６の開閉弁１７が設けられており、この開閉弁１７が、冷却媒体Ｓが所定温度以上となることにより開放されるように設定されている。
すなわち、本発明の電子部品冷却装置１０１では、冷却媒体タンク１２の冷媒収容部１３内に、相変化を伴う高い熱伝達効率を有する冷却媒体Ｓを使用することができ、かつ通路１５の途中に、該冷却媒体Ｓが所定温度以上となることにより開放される弁機構１６を設けたことで、発熱部品１１が動作を開始してから所定の使用環境温度に上昇した際に迅速に弁を開放することが可能となる。 Then, in the electronic component cooling device 101 configured as described above, the heat generated from the heat generating component 11 in accordance with the operation is transferred to the cooling medium S of the cooling medium tank 12, and then the heat radiating unit 14 passes through the cooling medium S. Emitted from.
Further, an opening/closing valve 17 of the valve mechanism 16 is provided in the middle of the passage 15 for circulating the cooling medium S between the cooling medium tank 12 and the heat radiating portion 14, and the opening/closing valve 17 serves to prevent the cooling medium S from flowing. It is set to open when the temperature rises above a predetermined temperature.
That is, in the electronic component cooling device 101 of the present invention, the cooling medium S having a high heat transfer efficiency with a phase change can be used in the coolant containing portion 13 of the cooling medium tank 12, and the cooling medium S can be provided in the middle of the passage 15. By providing the valve mechanism 16 that is opened when the temperature of the cooling medium S becomes equal to or higher than a predetermined temperature, the valve is quickly opened when the temperature of the heat generating component 11 rises to a predetermined operating environment temperature after the operation starts. It becomes possible to do.

また、上記電子部品冷却装置１０１では、弁機構１６として、冷却媒体Ｓが所定温度以上となった場合に変形して開閉弁１７を機械的に開閉動作させる形状記憶合金又はバイメタルが、弁体を開閉させるアクチュエータとして設けられているので、温度変化に伴うこれら形状記憶合金又はバイメタルの形状変化により、通路１５の開閉を円滑に行うことができる。 Further, in the electronic component cooling device 101, as the valve mechanism 16, a shape memory alloy or a bimetal that deforms when the cooling medium S becomes equal to or higher than a predetermined temperature to mechanically open/close the opening/closing valve 17 serves as a valve body. Since it is provided as an actuator for opening and closing, the passage 15 can be opened and closed smoothly by the shape change of the shape memory alloy or the bimetal due to the temperature change.

なお、上記実施形態では、弁機構１６の開閉弁１７のアクチュエータに形状記憶合金又はバイメタルを使用したが、これに限定されず、図４に示されるように該開閉弁として電磁弁１７´を使用し、該電磁弁１７´を起動制御部２５からの制御信号により開閉動作させるようにしても良い。なお電磁弁に限らず、空圧弁、電動弁等の他の方式の自動弁を用いても良い。 In the above-described embodiment, the shape memory alloy or the bimetal is used for the actuator of the opening/closing valve 17 of the valve mechanism 16, but the invention is not limited to this, and the solenoid valve 17′ is used as the opening/closing valve as shown in FIG. However, the solenoid valve 17 ′ may be opened/closed by a control signal from the activation control unit 25. Not limited to the solenoid valve, another type of automatic valve such as a pneumatic valve or an electric valve may be used.

この起動制御部２５では、発熱部品１１の温度を計測する温度センサ２６または発熱部品１１の内部に有する温度センサでの検出値を取り込み、温度センサの検出値に基づき発熱部品１１が所定温度となったことが検出された場合に、発熱部品１１へ起動信号（例えば、ＣＰＵにおけるリセット信号、イネーブル信号）を出力する。この起動信号を開閉弁１７の開動作の命令として利用することにより、発熱部品１１の温度上昇を、開閉弁１７の開動作に直接反映させることができ、正常に性能を発揮することができる温度範囲（最低温度）に達した後の発熱部品１１の効率的な冷却が可能となる。
また、この起動制御部２５では、温度センサの検出値に基づき開閉弁１７の開閉動作を行っても良いが、これに限定されず、電源ＯＮから所定時間経過した場合に、開閉弁１７を開動作させるとともに、発熱部品１１へ起動信号（例えば、リセット信号、イネーブル信号）を出力しても良い。 The activation control unit 25 takes in the detection value of the temperature sensor 26 that measures the temperature of the heat-generating component 11 or the temperature sensor inside the heat-generating component 11, and the heat-generating component 11 reaches a predetermined temperature based on the detected value of the temperature sensor. When it is detected that the heat is generated, a start signal (for example, a reset signal and an enable signal in the CPU) is output to the heat generating component 11. By using this activation signal as a command for opening the opening/closing valve 17, the temperature rise of the heat-generating component 11 can be directly reflected in the opening operation of the opening/closing valve 17, and the temperature at which normal performance can be achieved. It is possible to efficiently cool the heat-generating component 11 after reaching the range (minimum temperature).
The start control unit 25 may open/close the opening/closing valve 17 based on the detected value of the temperature sensor, but the invention is not limited to this, and the opening/closing valve 17 is opened when a predetermined time elapses after the power is turned on. Along with the operation, a start signal (for example, a reset signal or an enable signal) may be output to the heat generating component 11.

なお、上記実施形態では、電子部品冷却装置１０１について説明したが、構成要素となる冷却媒体タンク１２、放熱部１４、これらを連結する通路１５、弁機構１６からなる冷却装置を備えた電子部品１１として構成しても良い。 Although the electronic component cooling device 101 has been described in the above embodiment, the electronic component 11 includes a cooling medium tank 12 that is a component, a heat radiating portion 14, a passage 15 that connects these components, and a cooling device that includes a valve mechanism 16. May be configured as.

また、上記実施形態に示される電子部品冷却装置１０１では、動作に伴って発熱部品１１から発生する熱を、冷却媒体タンク１２の閉空間に収容された冷却媒体Ｓに受け取らせる工程と、発熱部品１１からの熱を受け取った冷却媒体タンク１２の冷却媒体Ｓを、冷却媒体タンク１２に接続された放熱部１４で放熱させる工程と、放熱部１４と冷却媒体タンク１２との間の通路１５を通じて冷却媒体Ｓを流通させる工程と、冷却媒体Ｓが所定温度以上となることにより放熱部１４と冷却媒体タンク１２との間の通路１５を開放させる工程と、からなる「電子部品冷却方法」が適用されている。 Further, in the electronic component cooling device 101 shown in the above-described embodiment, a step of receiving the heat generated from the heat generating component 11 with the operation in the cooling medium S stored in the closed space of the cooling medium tank 12, and the heat generating component. The heat of the cooling medium S of the cooling medium tank 12 that has received the heat from the cooling medium tank 12 is radiated by the heat radiating portion 14 connected to the cooling medium tank 12, and is cooled through the passage 15 between the heat radiating portion 14 and the cooling medium tank 12. The “electronic component cooling method” including the step of circulating the medium S and the step of opening the passage 15 between the heat radiating portion 14 and the cooling medium tank 12 when the cooling medium S reaches a predetermined temperature or higher is applied. ing.

（第２実施形態）
図１を具体化した本発明の第２実施形態に係る電子部品冷却装置１０２について、図５を参照して説明する。
第２実施形態に係る電子部品冷却装置１０２が、第１実施形態に係る電子部品冷却装置１０１と構成を異にする点は、発熱部品、冷却媒体タンク、放熱部が配置される向きである。すなわち、第２実施形態に係る電子部品冷却装置１０２では、発熱部品、冷却媒体タンク、放熱部が全体として縦向きに配置されている。 (Second embodiment)
An electronic component cooling device 102 according to a second exemplary embodiment of the present invention that embodies FIG. 1 will be described with reference to FIG.
The electronic component cooling device 102 according to the second exemplary embodiment differs from the electronic component cooling device 101 according to the first exemplary embodiment in the direction in which the heat generating component, the cooling medium tank, and the heat radiating portion are arranged. That is, in the electronic component cooling device 102 according to the second embodiment, the heat generating component, the cooling medium tank, and the heat radiating portion are vertically arranged as a whole.

図５に符号３１で示されるのはＣＰＵなどの電子部品で構成される発熱部品であって、キャリア４１を介して台座４２上に固定されている。 Reference numeral 31 in FIG. 5 denotes a heat-generating component including an electronic component such as a CPU, which is fixed on the pedestal 42 via the carrier 41.

発熱部品３１の側方に位置する表面には冷却媒体タンク３２が接触して配置されている。冷却媒体タンク３２は、発熱部品３１から熱を受ける冷却媒体Ｓが収容された冷媒収容部３３を内部に有するものであって、該冷媒収容部３３は閉空間となるように形成されている。また、この冷却冷媒タンク３２の側部には、発熱部品３１から熱を受け取った冷却媒体Ｓを受け入れて放熱させる放熱部３４が接続されている。
この放熱部３４は、ヒートシンク４３と、該ヒートシンク４３の上部位置に設けられた放熱フィン４４とから構成されたものであって、これらヒートシンク４３及び放熱フィン４４を介して冷却媒体Ｓの熱が放出される。 A cooling medium tank 32 is arranged in contact with the surface of the heat generating component 31 on the side thereof. The cooling medium tank 32 has therein a refrigerant containing portion 33 in which a cooling medium S that receives heat from the heat generating component 31 is contained, and the refrigerant containing portion 33 is formed as a closed space. Further, a heat radiating portion 34 for receiving and radiating the cooling medium S, which has received heat from the heat generating component 31, is connected to a side portion of the cooling refrigerant tank 32.
The heat dissipating portion 34 is composed of a heat sink 43 and heat dissipating fins 44 provided at the upper position of the heat sink 43. The heat of the cooling medium S is released through the heat sink 43 and the heat dissipating fins 44. To be done.

これら冷却媒体タンク３２と放熱部３４との間には冷却媒体Ｓを流通させる２本の通路３５Ａ，３５Ｂが設けられている。
これら通路３５Ａ，３５Ｂは、冷却媒体タンク３２と放熱部３４とを接続するように水平方向に配置されたものであって、上下に並列するように配置されている。また、これら通路３５Ａ，３５Ｂ内には、冷却媒体タンク３２から放熱部３４に至る閉空間の冷媒収容部３３が形成されており、この冷媒収容部３３にて冷却溶媒Ｓの気化及び液化が繰り返される。
また、これら通路３５Ａ，３５Ｂの中で、上側に位置する通路３５Ａは、冷却媒体タンク３２と放熱部３４との間で気体を流通させる第１の通路を形成し、また、下側に位置する通路３５Ｂは、冷却媒体タンク３２と放熱部３４との間で液体を流通させる第２の通路を形成している。 Two passages 35A and 35B for circulating the cooling medium S are provided between the cooling medium tank 32 and the heat radiation section 34.
These passages 35A and 35B are arranged horizontally so as to connect the cooling medium tank 32 and the heat radiating portion 34, and are arranged vertically in parallel. In addition, in these passages 35A and 35B, a refrigerant containing portion 33 that is a closed space from the cooling medium tank 32 to the heat radiating portion 34 is formed, and in this refrigerant containing portion 33, vaporization and liquefaction of the cooling solvent S are repeated. Be done.
Further, among these passages 35A and 35B, the passage 35A located on the upper side forms a first passage through which the gas flows between the cooling medium tank 32 and the heat dissipation portion 34, and is also located on the lower side. The passage 35B forms a second passage through which the liquid flows between the cooling medium tank 32 and the heat dissipation portion 34.

これら通路３５Ａ，３５Ｂの中で、上側に位置する通路３５Ａには弁機構３６が設けられている。
この弁機構３６は、通路３５Ａの開口部に位置する開閉弁３７を有するものであって、該通路３５Ａを開放した場合に、気体又は液体状態の冷却媒体Ｓを内部空間内で循環させることができる。
また、この開閉弁３７は、冷却媒体Ｓが所定温度以上となることにより機械的に変形して開放させる構造、例えば、形状記憶合金又はバイメタルを用いて開閉する機構が採用されている。 Of these passages 35A and 35B, a valve mechanism 36 is provided in the passage 35A located on the upper side.
The valve mechanism 36 has an opening/closing valve 37 located at the opening of the passage 35A, and when the passage 35A is opened, the cooling medium S in a gas or liquid state can be circulated in the internal space. it can.
Further, the opening/closing valve 37 employs a structure that mechanically deforms and opens when the cooling medium S reaches a predetermined temperature or higher, for example, a mechanism that opens and closes using a shape memory alloy or bimetal.

そして、上記開閉弁３７では、冷却媒体Ｓの温度が上昇しない停止時又は起動時において通路３５Ａを閉状態として、冷却媒体Ｓの循環による熱移動を防止する。
また、上記開閉弁３７では、冷却媒体Ｓの温度が上昇した定常運転時において通路３５Ａを開状態として、冷却媒体Ｓの循環及び熱移動を行わせ、放熱部３４を介した発熱部品３１の発熱を行わせる。
このとき、冷媒収容部３３では、冷媒収容部３３内で気化した冷却溶媒Ｓが上側の通路３５Ａを通じて放熱部３４に移動し、放熱部３４にて放熱されることにより該冷却冷媒Ｓの液化がなされる。その後、液化した冷却溶媒Ｓは下側の通路３５Ｂを通じて冷却媒体タンク３２に戻る。
すなわち、通路３５Ａに設けられた開閉弁３７が開状態となった場合に、冷却媒体タンク３２、通路３５Ａ，３５Ｂ及び放熱部３４を経由して冷却溶媒Ｓを循環させつつ、該冷却溶媒Ｓの気化及び液化を繰り返すことにより、発熱部品３１の強制的な放熱を行わせる。 In the opening/closing valve 37, the passage 35A is closed at the time of stop or start when the temperature of the cooling medium S does not rise to prevent heat transfer due to circulation of the cooling medium S.
Further, in the opening/closing valve 37, the passage 35A is opened during normal operation in which the temperature of the cooling medium S has risen to cause circulation and heat transfer of the cooling medium S, and heat generation of the heat generating component 31 via the heat radiating portion 34. To do.
At this time, in the refrigerant containing portion 33, the cooling solvent S vaporized in the refrigerant containing portion 33 moves to the heat radiating portion 34 through the upper passage 35A and is radiated by the heat radiating portion 34, whereby the cooling refrigerant S is liquefied. Done. Then, the liquefied cooling solvent S returns to the cooling medium tank 32 through the lower passage 35B.
That is, when the opening/closing valve 37 provided in the passage 35A is in the open state, the cooling solvent S is circulated through the cooling medium tank 32, the passages 35A and 35B, and the heat dissipation portion 34 while the cooling solvent S is circulated. By repeating vaporization and liquefaction, the heat-generating component 31 is forcibly radiated.

そして、以上のように構成された電子部品冷却装置１０２では、動作に伴い発熱部品３１から熱が発生した場合に、この熱が、冷却媒体タンク３２の冷却媒体Ｓに伝達され、その後、該冷却媒体Ｓを通じて放熱部３４から放出される。
また、冷却媒体タンク３２と放熱部３４との間で冷却媒体Ｓを流通させる通路３５Ａの途中には弁機構３６の開閉弁３７が設けられており、この開閉弁３７が、冷却媒体Ｓが所定温度以上となることにより開放されるように設定されている。
すなわち、本発明の電子部品冷却装置１０２では、冷却媒体タンク３２の冷媒収容部３３内に熱伝達効率の高い冷却媒体Ｓを使用でき、かつ通路３５Ａの途中に、該冷却媒体Ｓが所定温度以上となることにより開放される弁機構３６を設けたことで、発熱部品３１が動作を開始してから所定の使用環境温度に上昇した際の弁開放のレスポンス性能を高めことが可能となる。 In the electronic component cooling device 102 configured as described above, when heat is generated from the heat generating component 31 during operation, this heat is transferred to the cooling medium S in the cooling medium tank 32, and then the cooling is performed. The heat is radiated from the heat dissipation portion 34 through the medium S.
Further, an opening/closing valve 37 of the valve mechanism 36 is provided in the middle of the passage 35A for circulating the cooling medium S between the cooling medium tank 32 and the heat radiating section 34. It is set to open when the temperature rises above the temperature.
That is, in the electronic component cooling device 102 of the present invention, the cooling medium S having a high heat transfer efficiency can be used in the refrigerant storage portion 33 of the cooling medium tank 32, and the cooling medium S can have a predetermined temperature or higher in the middle of the passage 35A. By providing the valve mechanism 36 that is opened by the above, it becomes possible to improve the response performance of the valve opening when the temperature of the heat generating component 31 rises to a predetermined operating environment temperature after the operation.

図６は第３実施形態を示すものである。
この第３実施形態は、第２実施形態における冷却媒体タンク３２の冷媒収容部３３が上方に延長されて、ほぼ、発熱部品３１と接触する範囲の全体に冷却媒体Ｓが収容されている。
これら第２、第３実施形態の電子部品冷却装置１０２では、放熱部３４が冷却媒体タンク３２の上方に設けられることにより、発熱部品３１から熱を受けて気化した冷却媒体Ｓが、放熱部３４側に移動し、これによって該放熱部３４を介した発熱部品３１の効率的な放熱が可能となる。
なお、第２、第３実施形態では、通路３５Ａ，３５Ｂの中で、上側に位置する通路３５Ａに弁機構３６を設けたが、これに限定されず、下側に位置する通路３５Ｂ又は上側、下側の通路３５Ａ，３５Ｂの双方に設けても良い。
また、各実施形態における部材間の接触部、例えば発熱部品と冷却媒体タンクとの間、あるいは冷却フィンと冷却媒体タンクとを別部材で構成した場合、これらの接触面の間には、熱伝導グリース（オイル）、熱伝導コンパウンド、部材間変形可能な熱伝導シートなど、接触面において変形して隙間を埋めることにより熱抵抗を低減して熱伝導効率を高める物質を介在させることが望ましい。 FIG. 6 shows a third embodiment.
In the third embodiment, the cooling medium storage portion 33 of the cooling medium tank 32 in the second embodiment is extended upward, and the cooling medium S is stored substantially in the entire area in contact with the heat generating component 31.
In the electronic component cooling devices 102 of the second and third embodiments, the heat radiating portion 34 is provided above the cooling medium tank 32, so that the cooling medium S that is vaporized by receiving heat from the heat generating component 31 is radiated by the heat radiating portion 34. To the side, which enables efficient heat dissipation of the heat-generating component 31 through the heat dissipation portion 34.
In the second and third embodiments, the valve mechanism 36 is provided in the upper passage 35A of the passages 35A and 35B, but the present invention is not limited to this, and the lower passage 35B or the upper passage 35B is not limited thereto. It may be provided in both of the lower passages 35A and 35B.
Further, in the contact portion between the members in each embodiment, for example, between the heat-generating component and the cooling medium tank, or when the cooling fin and the cooling medium tank are configured by different members, heat conduction is performed between these contact surfaces. It is desirable to interpose a substance such as grease (oil), a heat conduction compound, or a heat conduction sheet that can be deformed between members, which deforms at the contact surface and fills the gap to reduce the heat resistance and improve the heat conduction efficiency.

以上、本発明の実施形態について図面を参照して詳述したが、具体的な構成はこの実施形態に限られるものではなく、本発明の要旨を逸脱しない範囲の設計変更等も含まれる。 Although the embodiment of the present invention has been described in detail above with reference to the drawings, the specific configuration is not limited to this embodiment, and includes design changes and the like within a range not departing from the gist of the present invention.

本発明は、効率的な冷却が可能な電子部品冷却装置、冷却装置を備えた電子部品及び電子部品冷却方法に関する。 The present invention relates to an electronic component cooling device capable of efficient cooling, an electronic component including the cooling device, and an electronic component cooling method.

１ 発熱部品
２ 冷却媒体タンク
３ 冷媒収容部
４ 放熱部
５ 通路
６ 弁機構
７ 開閉弁
１１ 発熱部品
１２ 冷却媒体タンク
１３ 冷媒収容部
１４ 放熱部
１５ 通路
１６ 弁機構
１７ 開閉弁
２６ 温度センサ
３１ 発熱部品
３２ 冷却媒体タンク
３３ 冷媒収容部
３４ 放熱部
３５（３５Ａ，３５Ｂ） 通路
３６ 弁機構
３７ 開閉弁
１００ 電子部品冷却装置
１０１ 電子部品冷却装置
１０２ 電子部品冷却装置
Ｓ 冷却溶媒 DESCRIPTION OF SYMBOLS 1 Heat generating component 2 Cooling medium tank 3 Refrigerant accommodating part 4 Radiating part 5 Passage 6 Valve mechanism 7 Open/close valve 11 Exothermic part 12 Cooling medium tank 13 Refrigerant accommodating part 14 Radiating part 15 Passage 16 Valve mechanism 17 Open/close valve 26 Temperature sensor 31 Exothermic part 32 Cooling medium tank 33 Refrigerant accommodation part 34 Radiating part 35 (35A, 35B) Passage 36 Valve mechanism 37 Open/close valve 100 Electronic component cooling device 101 Electronic component cooling device 102 Electronic component cooling device S Cooling solvent

Claims (4)

動作に伴って熱を発生する発熱部品に設けられ、該発熱部品から熱を受け取ることにより液体から気体となる冷却媒体が所定の液面高さで収容された第一の冷却媒体タンクと、
この第一の冷却媒体タンクの前記液面より下の位置と、前記液面より上の位置との両方で接続されていて、所定の液面高さで冷却媒体を収容し、前記発熱部品から熱を受け取った冷却媒体を受け入れて放熱させる放熱部を有する第二の冷却媒体タンクと、
これら第一および第二の冷却媒体タンクの間で冷却媒体を流通させるものであって、前記液面より上に設けられた第一の通路、および、前記液面より下に設けられた第二の通路と、
前記第一の通路を開閉する弁と、
該弁を前記冷却媒体が所定温度以上となることにより開放させる弁機構と、
を具備することを特徴とする電子部品冷却装置。 A first cooling medium tank provided in a heat-generating component that generates heat in accordance with an operation, and a cooling medium that becomes a gas from a liquid by receiving heat from the heat-generating component is stored at a predetermined liquid level ,
The first cooling medium tank is connected at both a position below the liquid surface and a position above the liquid surface , and stores the cooling medium at a predetermined liquid surface height from the heat generating component. A second cooling medium tank having a heat radiating portion for receiving and radiating the cooling medium that has received heat ,
A cooling medium is circulated between the first and second cooling medium tanks, the first passage being provided above the liquid level, and the second passage being provided below the liquid level. And the passage
A valve for opening and closing the first passage,
A valve mechanism that opens the valve when the cooling medium reaches a predetermined temperature or higher;
An electronic component cooling device comprising: 前記弁機構は、前記冷却媒体が所定温度以上となることにより変形して前記弁の開閉動作をさせるバイメタルが内蔵されていることを特徴とする請求項１に記載の電子部品冷却装置。 The electronic component cooling device according to claim 1 , wherein the valve mechanism has a built-in bimetal that deforms when the cooling medium reaches a predetermined temperature or higher to open and close the valve. 前記弁機構は、前記冷却媒体が所定温度以上となることにより変形して前記弁の開閉動作をさせる形状記憶合金が内蔵されていることを特徴とする請求項１に記載の電子部品冷却装置。 The electronic component cooling device according to claim 1 , wherein the valve mechanism includes a shape memory alloy that is deformed when the cooling medium reaches a predetermined temperature or higher to open and close the valve. 動作に伴って熱を発生する発熱部品と、
この発熱部品が取り付けられ、該発熱部品から熱を受け取る冷却媒体が所定の液面高さで収容された第一の冷却媒体タンクと、
この第一の冷却媒体タンクの冷媒収容部に前記液面より下の位置と、前記液面より上の位置との両方で接続されていて、所定の液面高さで冷却媒体を収容し、前記発熱部品から熱を受け取った冷却媒体を受け入れて放熱させる放熱部を有する第二の冷却媒体タンクと、
これら第一および第二の冷却媒体タンクの間で冷却媒体を流通させるものであって、前記液面より上に設けられた第一の通路、および、前記液面より下に設けられた第二の通路と、
前記第一の通路を開閉する弁と、
該弁を前記冷却媒体が所定温度以上となることにより開放させる弁機構と、
を具備することを特徴とする冷却装置を備えた電子部品。 A heat-generating component that generates heat with operation,
A first cooling medium tank in which the heat generating component is attached, and a cooling medium which receives heat from the heat generating component is accommodated at a predetermined liquid level ;
The refrigerant storage portion of the first cooling medium tank is connected at both a position below the liquid surface and a position above the liquid surface , and stores the cooling medium at a predetermined liquid surface height, A second cooling medium tank having a heat radiating portion for receiving and radiating the cooling medium that has received heat from the heat generating component,
A cooling medium is circulated between the first and second cooling medium tanks, the first passage being provided above the liquid level, and the second passage being provided below the liquid level. And the passage
A valve for opening and closing the first passage,
A valve mechanism that opens the valve when the cooling medium reaches a predetermined temperature or higher;
An electronic component provided with a cooling device comprising:
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JP4353026B2 (en) * 2003-12-16 2009-10-28 富士電機ホールディングス株式会社 Pure water boiling cooling device with cooling medium opening and closing means
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