JP6646863B2 - シート状接着剤およびそれを用いた接着方法 - Google Patents
シート状接着剤およびそれを用いた接着方法 Download PDFInfo
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- JP6646863B2 JP6646863B2 JP2016109684A JP2016109684A JP6646863B2 JP 6646863 B2 JP6646863 B2 JP 6646863B2 JP 2016109684 A JP2016109684 A JP 2016109684A JP 2016109684 A JP2016109684 A JP 2016109684A JP 6646863 B2 JP6646863 B2 JP 6646863B2
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
- C09J2463/006—Presence of epoxy resin in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Description
(A)成分:ウレタンエラストマー
(B)成分:エポキシ樹脂
(C)成分:アミン化合物および/またはフェノール化合物
(A)成分:ウレタンエラストマー
(B)成分:エポキシ樹脂
(C)成分:アミン化合物および/またはフェノール化合物
(D)成分:溶媒
(A)成分:ウレタンエラストマー
(B)成分:エポキシ樹脂
(C)成分:アミン化合物および/またはフェノール化合物
(D)成分:溶媒
(E)成分:カップリング剤
原液または液剤を調製するために下記成分を準備した。
(A)成分:ウレタンエラストマー
・アジペート系ポリウレタンエラストマー(固形分:100質量%) (P22SRNAT 日本ミラクトラン株式会社製)
・ポリカーボネート系ポリウレタンエラストマー(固形分:100質量%)(E980 日本ミラクトラン株式会社製)
(A’)成分:(A)成分以外のエラストマー(ゴムエラストマー)
・2%無水マレイン酸変性SEBS(スチレン−エチレン/ブチレン−スチレン ブロックコポリマー)(クレイトンFG1901GT クレイトンポリマージャパン株式会社製)
(B)成分:エポキシ樹脂
・ビスフェノールA型エポキシ樹脂(jER1004 三菱化学株式会社製)
・ビスフェノールA型フェノキシ樹脂(固形分:40質量%、溶媒:メチルエチルケトン(MEK))(jER1256B40 三菱化学株式会社製)
(B’)成分:(B)成分以外の樹脂
・芳香族変性テルペン重合体(YSレジンTO125 ヤスハラケミカル株式会社製)
(C)成分:アミン化合物および/またはフェノール化合物
・2−フェニルイミダゾール(25℃固体)(キュアゾール2PZ 四国化成工業株式会社製)
・2−メチルイミダゾール(25℃固体)(キュアゾール2MZ 四国化成工業株式会社製)
・2−エチル−4−メチルイミダゾール(25℃液体)(キュアゾール2E4MZ 四国化成工業株式会社製)
・ジシアンジアミド(オミキュアDDA−5 PTIジャパン株式会社製)
・エポキシアダクト型硬化剤(アミキュアPN−23 味の素ファインテクノ株式会社)
・エポキシアダクト型硬化剤(フジキュアFXE−1000 株式会社T&K TOKA製)
・1,2,3−ベンゾトリアゾール(試薬)
・1,3−ビス(ヒドラジノカルボノエチル)−5−イソプロピルヒダントイン(アミキュアVDH−J 味の素ファインテクノ株式会社)
・ポリパラビニルフェノール重合体(マルカリンカーM 丸善石油化学株式会社製)
(C’)成分:(C)成分以外の硬化剤(酸無水物)
・4−メチルヘキサヒドロ無水フタル酸とヘキサヒドロ無水フタル酸の混合物(重量比:70対30)(リカシッドMH−700N 新日本理化株式会社製)
(D)成分:溶媒
・1,3−ジオキソラン(試薬)
・ジメチルホルムアミド(DMF)(試薬)
・メチルエチルケトン(MEK)(試薬)
・トルエン(試薬)
(E)成分:カップリング剤
・N−2−(アミノエチル)−3−アミノプロピルトリメトキシシラン(KBM−603 信越化学工業株式会社製)
・3−アミノプロピルトリメトキシシラン(Z−6610 東レダウコーニング株式会社製)
その他
・タルク粉(ミクロエースL1 日本タルク株式会社製)
ビーカーに(D)成分と(A)成分(または(A’)成分)を秤量して、1時間撹拌する。(A)成分の溶け残りが有る場合は、さらに1時間撹拌する。その後、(B)成分およびその他成分をビーカーに秤量して1時間撹拌する。塗工機により原液1〜3をそれぞれ長さ200mm×幅25mm×厚さ65μmのAL−PETフィルム(パナック株式会社の商品名:アルペット12−50)のアルミ箔側に塗工して、90℃雰囲気下で5分間乾燥して基材層を形成し、ドライ状態での厚さも合わせ表1に記載する。また、(A’)成分であるFG1901GTと(B)成分であるエポキシ樹脂は、極性が大きく異なるため相溶させることはできなかった。ここで、「原液」の番号をそのまま「基材層」の番号として使用する。詳細な調製量は表1に従い、数値は全て質量部で表記する。併せて、原液の固形分(質量%)を表記する。
ビーカーに(D)成分を秤量して、その後、(C)成分(または(C’)成分)および(E)成分を秤量して、15分間撹拌する。この時、液剤中に成分が溶解している状態を目視で確認し、以下の評価基準により「溶解性」とする。また、液剤全体に対する(C)成分(または(C’)成分)および(E)成分の「成分濃度」を質量%で併記する。詳細な調製量は表2に従い、数値は全て質量部で表記する。液剤の調製後、液剤1〜17を長さ100mm×幅25mm×厚さ1.5mmのSUS304製のステンレス板に対して液剤を塗布し、25℃で1時間放置して乾燥して反応層とする。ここで、「液剤」の番号をそのまま「反応層」の番号として使用する。
評価基準
○:相溶している
×:一部溶解していない
表3の通りに基材層と反応層を組み合わせて、各種の確認と測定を行った。表3において、反応層が存在しない場合は、反応層は「無し」と記載する。
前記のAL−PET表面に形成した基材層とステンレス板表面に形成した反応層をプレス機により、圧力は0.2MPaで、加熱は70℃雰囲気下において30秒で行った。その際に、反応層が端部よりはみ出ているか目視にて確認を行い、以下の評価基準で「はみ出し性」を判断する。ただし、比較例3、6および8に関しては、反応層を有さないステンレス板をAL−PET表面に形成した基材層と貼り合わせるため、「−」と表記する。被着体周辺への広がりが無い様にするため、はみ出し性は「○」であることが好ましい。
評価基準
○:端部からはみ出ていない
×:端部からはみ出ている
前記のAL−PET表面に形成した基材層とステンレス板表面に形成した反応層について、25mm×80mmの接着面積で貼り合わせた後、ミカドテクノス株式会社製のプレス機(商品名:真空加圧装置)により圧力は0.2MPaで、加熱は25℃雰囲気下で30秒と70℃雰囲気下で30秒の2種類で貼り合わせた。その後、25℃雰囲気下で24時間放置してから、引張試験器により300mm/分の速度で180°方向で剥離させて最大強度から「接着強さの測定値(N/m)」とし、同一基材層を使用しているが反応層を使用していない比較例3からの測定値の変化を「接着強さの向上率(%)」とする。ただし、比較例3に関しては、反応層を有さないステンレス板をAL−PET表面に形成した基材層と貼り合わせる。そのため、比較例3の「接着強さの向上率」は「−」と表記する。本願発明では、反応層による接着強さの向上率が10%以上であることが好ましい。
前記のAL−PET表面に形成した基材層とステンレス板表面に形成した反応層について、25mm×80mmの接着面積で貼り合わせた後、プレス機により圧力は0.2MPaで、加熱は70℃雰囲気下で30秒で貼り合わせた。その後、25℃雰囲気下で24時間放置してから、引張試験器により300mm/分の速度で180°方向で剥離させて最大強度から「接着強さの測定値(N/m)」とし、同一基材層を使用しているが反応層を使用していない比較例3、6および8からの測定値の変化を「接着強さの向上率(%)」とする。ただし、比較例3、6および8に関しては、反応層を有さないステンレス板をAL−PET表面に形成した基材層と貼り合わせる。そのため、比較例3、6および8の「接着強さの向上率」は「−」と表記する。本願発明では、反応層による接着強さの向上率が10%以上であることが好ましい。
2:反応層の原液
3:噴霧ヘッド
4:反応層
5:PET(被着体)
6:基材層
Claims (8)
- 下記の(A)成分および(B)成分を含む基材層と、下記の(C)成分が45質量%以下の液剤から形成された反応層とからなるシート状接着剤。
(A)成分:ウレタンエラストマー
(B)成分:エポキシ樹脂
(C)成分:アミン化合物および/またはフェノール化合物 - 前記(B)成分が、25℃で固形のエポキシ樹脂を含む請求項1に記載のシート状接着剤。
- 前記(A)成分と前記(B)成分が相溶した状態で形成される基材層である請求項1または2のいずれかに記載のシート状接着剤。
- さらに、反応層に(E)成分としてカップリング剤を含む請求項1〜3のいずれかに記載のシート状接着剤。
- 請求項1〜4のいずれかに記載のシート状接着剤を含む加熱硬化型シート状接着剤。
- 請求項1〜4のいずれかに記載のシート状接着剤を含む常温硬化型シート状接着剤。
- 下記の(A)成分および(B)成分を含む基材層が転写された被着体と、下記の(C)成分および(D)成分を含むと共に(C)成分が45質量%以下の液剤をもう一方の被着体に塗布してから(D)成分を乾燥させて形成された反応層を有する被着体を基材層と貼り合わせる接着方法。
(A)成分:ウレタンエラストマー
(B)成分:エポキシ樹脂
(C)成分:アミン化合物および/またはフェノール化合物
(D)成分:溶媒 - 下記の(A)成分および(B)成分を含む基材層が転写された被着体と、下記の(C)成分、(D)成分および(E)成分を含むと共に(C)成分が45質量%以下の液剤をもう一方の被着体に塗布してから(D)成分を乾燥させて形成された反応層を有する被着体を基材層と貼り合わせる接着方法。
(A)成分:ウレタンエラストマー
(B)成分:エポキシ樹脂
(C)成分:アミン化合物および/またはフェノール化合物
(D)成分:溶媒
(E)成分:カップリング剤
Priority Applications (4)
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JP2016109684A JP6646863B2 (ja) | 2016-06-01 | 2016-06-01 | シート状接着剤およびそれを用いた接着方法 |
US15/603,860 US10633512B2 (en) | 2016-06-01 | 2017-05-24 | Sheet adhesive and adhesion process using the same |
TW106117260A TWI722192B (zh) | 2016-06-01 | 2017-05-24 | 片型接著劑及使用其之接著方法 |
CN201710391964.7A CN107446512B (zh) | 2016-06-01 | 2017-05-27 | 片状胶粘剂及使用其的胶粘方法 |
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JP2016109684A JP6646863B2 (ja) | 2016-06-01 | 2016-06-01 | シート状接着剤およびそれを用いた接着方法 |
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JP2017214500A JP2017214500A (ja) | 2017-12-07 |
JP6646863B2 true JP6646863B2 (ja) | 2020-02-14 |
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US (1) | US10633512B2 (ja) |
JP (1) | JP6646863B2 (ja) |
CN (1) | CN107446512B (ja) |
TW (1) | TWI722192B (ja) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3795807A (en) * | 1972-10-11 | 1974-03-05 | Anaconda Co | Pneumatic conveying system for transferring slurry samples to an analyzer |
US4201808A (en) * | 1978-06-12 | 1980-05-06 | Union Carbide Corporation | Radiation curable silicone release compositions |
AU602822B2 (en) * | 1988-10-05 | 1990-10-25 | National Starch & Chemical Corporation | Self fixturing structural adhesives |
JPH04177863A (ja) * | 1990-11-13 | 1992-06-25 | Mitsui Petrochem Ind Ltd | 保存安定性を改良した硬化性の接着剤によって封止された半導体装置およびその製造方法 |
JPH0945816A (ja) * | 1995-07-26 | 1997-02-14 | Toshiba Chem Corp | 接着シート |
CN2246666Y (zh) * | 1996-03-07 | 1997-02-05 | 周阳 | 分离式双组份粘合胶膜 |
JP3535380B2 (ja) * | 1998-04-24 | 2004-06-07 | 日東電工株式会社 | 柔軟性層の表面粘着化処理法 |
JP2000068295A (ja) | 1998-08-25 | 2000-03-03 | Tomoegawa Paper Co Ltd | 電子部品用接着フィルム |
JP5365003B2 (ja) * | 2008-01-11 | 2013-12-11 | 横浜ゴム株式会社 | ハネムーン型接着剤組成物、実装基板の接着方法および実装基板組み立て体 |
WO2010030519A1 (en) * | 2008-09-10 | 2010-03-18 | Dow Global Technologies Inc. | Improved process for bonding reactive adhesives to substrates |
JP5798714B2 (ja) * | 2008-09-26 | 2015-10-21 | 日東電工株式会社 | 複合半透膜及びその製造方法 |
DE102009026548A1 (de) * | 2009-05-28 | 2011-03-24 | Henkel Ag & Co. Kgaa | Klebefolie oder Klebeband auf Basis von Epoxiden |
WO2015046032A1 (ja) * | 2013-09-26 | 2015-04-02 | 東洋紡株式会社 | ポリウレタン樹脂組成物およびこれを用いた接着剤組成物、積層体、プリント配線板 |
WO2016013621A1 (ja) * | 2014-07-25 | 2016-01-28 | 横浜ゴム株式会社 | 接着剤組成物 |
CN105331305A (zh) * | 2015-12-16 | 2016-02-17 | 太仓康盛化工有限公司 | 一种快速固化环氧树脂胶黏剂 |
CN105400441A (zh) * | 2015-12-22 | 2016-03-16 | 中国航空工业集团公司济南特种结构研究所 | 一种可延长贮存期的胶膜制造方法 |
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