JP6625673B2 - 半導体デバイスおよびその製造方法 - Google Patents
半導体デバイスおよびその製造方法Info
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- JP6625673B2 JP6625673B2 JP2018000185A JP2018000185A JP6625673B2 JP 6625673 B2 JP6625673 B2 JP 6625673B2 JP 2018000185 A JP2018000185 A JP 2018000185A JP 2018000185 A JP2018000185 A JP 2018000185A JP 6625673 B2 JP6625673 B2 JP 6625673B2
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- silicon carbide
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- 239000004065 semiconductor Substances 0.000 title claims description 176
- 238000004519 manufacturing process Methods 0.000 title description 11
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 149
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 147
- 238000001465 metallisation Methods 0.000 claims description 77
- 230000004888 barrier function Effects 0.000 claims description 53
- 239000010949 copper Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 150000004767 nitrides Chemical class 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 claims description 10
- 230000015556 catabolic process Effects 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 239000002019 doping agent Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 229910021332 silicide Inorganic materials 0.000 claims description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical group [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 238000003763 carbonization Methods 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000005684 electric field Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 229910000943 NiAl Inorganic materials 0.000 description 3
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910019001 CoSi Inorganic materials 0.000 description 2
- 229910018565 CuAl Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- VLJQDHDVZJXNQL-UHFFFAOYSA-N 4-methyl-n-(oxomethylidene)benzenesulfonamide Chemical compound CC1=CC=C(S(=O)(=O)N=C=O)C=C1 VLJQDHDVZJXNQL-UHFFFAOYSA-N 0.000 description 1
- 229910016570 AlCu Inorganic materials 0.000 description 1
- 229910002515 CoAl Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910008484 TiSi Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910021340 platinum monosilicide Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Description
Claims (13)
- 第1の炭化ケイ素領域(1、1d)と、前記第1の炭化ケイ素領域(1、1d)とpn接合(14)を形成する第2の炭化ケイ素領域(2)と、を有する半導体本体(40)と、
前記半導体本体(40)の前側(101)上に配置される第1の金属化(10)と、
前記第2の炭化ケイ素領域(2)とオーミック接触を形成する接触領域(12)と、
前記第1の金属化(10)と前記接触領域(12)との間に配置されるバリア層(11)であって、前記第1の金属化(10)および前記接触領域(12)とオーミック接続するバリア層(11)と、
前記第1の金属化(10)の反対側にあり、前記第1の炭化ケイ素領域(1、1d)とオーミック接続する第2の金属化(9)と、
前記半導体本体(40)を通り、前記前側(101)と前記第2の金属化(9)との間で、pn接合と交差せずに走る接続経路と、
前記第2の金属化(9)のところに配置され、前記第2の金属化(9)とオーミック接続する炭化ケイ素接触層(1a)と、
前記炭化ケイ素接触層(1a)とオーミック接続する炭化ケイ素緩衝層(1b)であって、前記炭化ケイ素接触層(1a)と前記第1の炭化ケイ素領域(1、1d)との間に配置され、前記炭化ケイ素接触層(1a)より低いドーピング濃度を有する炭化ケイ素緩衝層(1b)と、
前記炭化ケイ素接触層(1a)とオーミック接続する炭化ケイ素ドリフト層(1c)であって、前記炭化ケイ素接触層(1a)および前記炭化ケイ素緩衝層(1b)の少なくとも1つの上に配置され、前記第2の炭化ケイ素領域(2)の少なくとも近傍に延在し、前記炭化ケイ素接触層(1a)、前記第1の炭化ケイ素領域(1、1d)および前記炭化ケイ素緩衝層(1b)の少なくとも1つより低いドーピング濃度を有する炭化ケイ素ドリフト層(1c)と、
を備える半導体デバイスであって、
前記バリア層(11)は、前記第1の炭化ケイ素領域(1、1d)とショットキー接合(15)を形成し、
前記バリア層(11)は、モリブデン窒化物を備え、
前記第1の金属化(10)は、銅を備え、
前記接触領域(12)は、ニッケルおよびアルミニウムを備える、
半導体デバイス。 - 少なくとも2つの第2の炭化ケイ素領域(2)を備え、
前記2つの第2の炭化ケイ素領域(2)の間の距離(w)は、前記前側(101)に垂直な縦方向において、前記2つの第2の炭化ケイ素領域(2)の少なくとも1つの延長(L)の最大2倍である、
請求項1に記載の半導体デバイス。 - 前記バリア層(11)は、前記前側(101)に垂直な縦方向において、50nmから500nmの範囲の厚みを有する、
請求項1または2に記載の半導体デバイス。 - 前記ショットキー接合(15)の降伏電圧より低い絶対値を有する逆電圧差(VA−VC<0)が前記第1の金属化(10)と前記第2の金属化(9)との間に印加されるとき、閉じた空間電荷領域は、前記第1の炭化ケイ素領域(1、1d)内の前記2つの第2の炭化ケイ素領域(2)間に形成される、
請求項2に記載の半導体デバイス。 - 前記炭化ケイ素ドリフト層(1c)は、前記第2の炭化ケイ素領域(2)の下に延在し、
前記第1の炭化ケイ素領域(1、1d)は、前記炭化ケイ素ドリフト層(1c)より高いドーピング濃度を有し、
前記第2の炭化ケイ素領域(2)は、前記第1の炭化ケイ素領域(1、1d)内に埋設される、
請求項1から4のいずれかに記載の半導体デバイス。 - 縦断面において、複数の交互の第1の炭化ケイ素領域(1、1d)および第2の炭化ケイ素領域(2)を備える、または、前記第1の炭化ケイ素領域(1、1d)内に埋設される複数の第2の炭化ケイ素領域(2)を備える、
請求項1から5のいずれかに記載の半導体デバイス。 - 終端構造をさらに備え、
前記終端構造は、前記前側(101)上におよび/または前記前側(101)のところに配置され、上から見られるとき、前記第1の炭化ケイ素領域(1、1d)および前記第2の炭化ケイ素領域(2)を囲む、
請求項1から6のいずれかに記載の半導体デバイス。 - 請求項1から7のいずれかに記載の半導体デバイスを備えるブリッジ回路。
- 第1の炭化ケイ素領域(1、1d)と、各々前記第1の炭化ケイ素領域(1、1d)とそれぞれのpn接合(14)を形成する2つの第2の炭化ケイ素領域(2)と、を備える半導体本体(40)と、
前記半導体本体(40)の前側(101)より上に配置される第1の金属化(10)と、
前記第1の金属化(10)および前記2つの第2の炭化ケイ素領域(2)とオーミック接続する金属窒化物層(11)と、
を備える半導体デバイスであって、
前記金属窒化物層(11)は、前記第1の金属化(10)と前記半導体本体(40)との間に配置され、前記第1の炭化ケイ素領域(1、1d)とショットキー接合(15)を形成し、
前記ショットキー接合(15)は、前記前側(101)への標準投影において、前記pn接合(14)の間に配置され、
前記半導体デバイスは、縦断面において、ニッケルおよびアルミニウムを備える接触領域(12)を備え、
前記第1の金属化(10)は、銅を備え、
前記金属窒化物層(11)は、モリブデン窒化物を備える、
半導体デバイス。 - 前記半導体デバイスは、パワー半導体デバイスとして実装され、
前記半導体デバイスは、2端子半導体デバイスとして実装され、
前記接触領域(12)は、前記金属窒化物層(11)と前記2つの第2の炭化ケイ素領域(2)の1つとの間に延在し、
前記半導体本体(40)は、炭化ケイ素を備える、
請求項9に記載の半導体デバイス。 - 半導体デバイスを形成するための方法であって、前記方法は、
第1の側(101)を有する第1の導電型の炭化ケイ素層(1)を提供するステップと、
前記炭化ケイ素層(1)内に、第1の炭化ケイ素領域(1、1d)と、前記第1の炭化ケイ素領域(1、1d)とpn接合(14)を形成する第2の炭化ケイ素領域(2)と、を形成するステップと、
前記第2の炭化ケイ素領域(2)とオーミック接触を形成する接触領域(12)を形成するステップと、
バリア層(11)を前記接触領域(12)および前記第1の炭化ケイ素領域(1、1d)の上に形成し、ショットキー接合(15)が前記バリア層(11)と前記第1の炭化ケイ素領域(1、1d)との間に形成され、オーミック接続が前記バリア層(11)と前記接触領域(12)との間に形成されるステップと、
銅を備える第1の金属化(10)を前記バリア層(11)上に形成し、前記バリア層(11)とオーミック接続するステップと、
を含み、
前記バリア層(11)は、モリブデン窒化物を備え、
前記接触領域(12)を形成するステップは、
ケイ素化合物領域(12)を前記第2の炭化ケイ素領域(2)のところに形成するステップと、
ニッケルおよびアルミニウムを堆積し、接触層(120)を前記第1の側(101)上に形成するステップと、
前記接触層(120)を構造化するステップと、
を含み、
前記バリア層(11)を形成するステップは、
モリブデン窒化物を堆積するステップと、
タンタル窒化物を堆積するステップと、
タンタルまたはモリブデンを堆積し、金属層を形成するステップと、
窒素を前記金属層内に注入するステップと、
を含む、
方法。 - 前記第2の炭化ケイ素領域(2)を形成するステップは、
前記炭化ケイ素層(1)を露出する開口を備えるマスク(18)を前記第1の側(101)上に形成するステップと、
一様な厚さのストレイ層(17)を前記マスク(18)上に堆積するステップと、
第2の導電型のドーパントを前記炭化ケイ素層(1)内に注入するステップと、
熱的アニールを行うステップと、
のうちの少なくとも1つを含む、
請求項11に記載の方法。 - 前記ドーパントを注入するステップの後に、犠牲酸化層を前記第1の側(101)のところに形成するステップと、
前記接触領域(12)を形成するステップの前に、前記犠牲酸化層を除去するステップと、
前記接触領域(12)を形成するステップの前に、前記炭化ケイ素層(1)を前記第1の側(101)のところでエッチングするステップと、
前記第1の側(101)への投影において、終端構造を前記第1の側(101)の隣に形成し、前記第2の炭化ケイ素領域(2)を囲むステップと、
前記第1の金属化(10)の反対側に、前記炭化ケイ素層(1)とオーミック接続する第2の金属化(9)を形成するステップと、
のうちの少なくとも1つをさらに含む、
請求項12に記載の方法。
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