JP6609197B2 - 洗浄装置 - Google Patents
洗浄装置 Download PDFInfo
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- JP6609197B2 JP6609197B2 JP2016034321A JP2016034321A JP6609197B2 JP 6609197 B2 JP6609197 B2 JP 6609197B2 JP 2016034321 A JP2016034321 A JP 2016034321A JP 2016034321 A JP2016034321 A JP 2016034321A JP 6609197 B2 JP6609197 B2 JP 6609197B2
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- cleaning
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- cleaning liquid
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- 238000004140 cleaning Methods 0.000 title claims description 339
- 239000007788 liquid Substances 0.000 claims description 94
- 238000003860 storage Methods 0.000 claims description 33
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 238000005406 washing Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Description
また、前記保持手段に保持された前記ウェーハの下面は、外周側から中央領域にかけて上方向に向かって中凹に湾曲しており、前記ケースに収容された前記洗浄ローラーの該ウェーハの下面の該中央領域に接触する前記一端側を上方向に付勢する弾性部材を備え、該洗浄ローラーは、該弾性部材で上方向に付勢される該一端側が前記他端側よりも高くされるとより好ましい。
また、前記洗浄ローラーの長さは、前記ウェーハの半径以上でかつ該ウェーハの直径未満であり、該洗浄ローラーは、前記保持手段で保持された該ウェーハの下面の中心から外周縁にかけて接触するように位置付けられるとさらに好ましい。
また、保持手段に保持されたウェーハの下面は、外周側から中央領域にかけて上方向に向かって中凹に湾曲しており、ケースに収容された洗浄ローラーのウェーハの下面の中央領域に接触する一端側を上方向に付勢する弾性部材を備え、洗浄ローラーは、弾性部材で上方向に付勢される一端側が他端側よりも高くされることで、ウェーハの下面の洗浄を行う際に、湾曲したウェーハの下面と洗浄ローラーの接触面積を最大化させることができる。
また、洗浄ローラーの長さは、ウェーハの半径以上でかつウェーハの直径未満であり、洗浄ローラーは、保持手段で保持されたウェーハの下面の中心から外周縁にかけて接触するように位置付けられることで、ウェーハWの下面の全面を洗浄することが可能となる。
2:ウェーハ回転手段
3:保持手段 3a,3b:保持ユニット 30:保持部 300:回転軸
301:回転ローラー 301a:一対のフランジ部
31:基台 32a,32b:可動板 33a,33b:連結具
34:可動板回転機構 340:シリンダチューブ 341:ピストンロッド
342a,342b:連結具
4:洗浄手段
40:洗浄ローラー 40a:洗浄ローラーの外側面 400o:洗浄ローラーの回転軸
41:洗浄ローラー回転機構
410:回転シャフト 410a:洗浄液供給路 410b:分岐路
411:モータ
43:ケース 43a:ケースの底板 43b、43c、43d:ケースの側板
430:貯留部 431:洗浄ローラー洗浄液供給口
44:支持台 44a:支持台の底板 44b:支持台の側板 44d:支持軸
440:弾性部材
45:昇降手段 450:シリンダチューブ 451:ピストンロッド
46:移動機構
5:洗浄液供給手段 50:洗浄液供給源 50a:洗浄液供給路
W:ウェーハ Wa:ウェーハの上面 Wb:ウェーハの下面 Wd:ウェーハの外周縁 Wo:ウェーハの中心
L:洗浄液 L1:洗浄ローラー洗浄液
Claims (4)
- ウェーハの外周縁を保持する3つ以上の保持部を有し、該3つ以上の保持部を結ぶ多角形の中に保持された該ウェーハの中心が位置付けられる保持手段と、
該保持手段で保持された該ウェーハの中心を軸に該ウェーハを回転させるウェーハ回転手段と、
該保持手段で保持された該ウェーハの下面に外側面を接触させて該ウェーハの下面を洗浄する円筒状の洗浄ローラーと該洗浄ローラーの長さ方向に伸長する回転軸周りに該洗浄ローラーを回転させる洗浄ローラー回転機構とを有した洗浄手段と、
少なくとも側板と底板とを備え、該洗浄ローラーの上部側をケース外に露出させつつ該洗浄ローラーを回転可能に収容するケースと、
少なくとも該洗浄ローラーと該ウェーハの下面との接触部に洗浄液を供給する洗浄液供給手段と、
を備えた洗浄装置であって、
該洗浄手段は、該洗浄ローラーの該回転軸を挟んで該ウェーハと反対側で該洗浄ローラーを洗浄する洗浄ローラー洗浄液が貯留される貯留部を有し、
該貯留部は、該ケース内の該底板の上面と該洗浄ローラーの下部側との間に形成され、該上部側で該ウェーハを洗浄している状態の該洗浄ローラーの洗浄を貯留された洗浄液で洗浄可能な洗浄装置。 - 前記貯留部は、前記洗浄ローラーの前記回転軸方向において一端から他端に向かって低くなるように傾斜しており、
該貯留部に前記洗浄ローラー洗浄液を供給する洗浄ローラー洗浄液供給口が該一端側に形成されている、請求項1に記載の洗浄装置。 - 前記保持手段に保持された前記ウェーハの下面は、外周側から中央領域にかけて上方向に向かって中凹に湾曲しており、
前記ケースに収容された前記洗浄ローラーの該ウェーハの下面の該中央領域に接触する前記一端側を上方向に付勢する弾性部材を備え、
該洗浄ローラーは、該弾性部材で上方向に付勢される該一端側が前記他端側よりも高くされる、請求項2に記載の洗浄装置。 - 前記洗浄ローラーの長さは、前記ウェーハの半径以上でかつ該ウェーハの直径未満であり、
該洗浄ローラーは、前記保持手段で保持された該ウェーハの下面の中心から外周縁にかけて接触するように位置付けられる、請求項1、2又は3に記載の洗浄装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016034321A JP6609197B2 (ja) | 2016-02-25 | 2016-02-25 | 洗浄装置 |
TW106101030A TWI743076B (zh) | 2016-02-25 | 2017-01-12 | 洗淨裝置 |
KR1020170020901A KR102518002B1 (ko) | 2016-02-25 | 2017-02-16 | 세정 장치 |
CN201710095215.XA CN107123609B (zh) | 2016-02-25 | 2017-02-22 | 清洗装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016034321A JP6609197B2 (ja) | 2016-02-25 | 2016-02-25 | 洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017152565A JP2017152565A (ja) | 2017-08-31 |
JP6609197B2 true JP6609197B2 (ja) | 2019-11-20 |
Family
ID=59717914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016034321A Active JP6609197B2 (ja) | 2016-02-25 | 2016-02-25 | 洗浄装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6609197B2 (ja) |
KR (1) | KR102518002B1 (ja) |
CN (1) | CN107123609B (ja) |
TW (1) | TWI743076B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6951199B2 (ja) * | 2017-11-09 | 2021-10-20 | 株式会社ディスコ | ウェーハ洗浄装置 |
CN107931179B (zh) * | 2017-11-15 | 2020-10-02 | 宜都同创光电科技有限公司 | 一种光学玻璃镜片洗前半自动擦油机 |
JP7100475B2 (ja) * | 2018-03-30 | 2022-07-13 | 株式会社ディスコ | 加工装置 |
JP7288370B2 (ja) * | 2019-08-20 | 2023-06-07 | 株式会社ディスコ | ウェーハ洗浄機構 |
CN114425492B (zh) * | 2022-02-17 | 2023-01-20 | 江苏正永地面装饰材料有限公司 | 一种pvc板材的生产加工*** |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05347287A (ja) * | 1992-04-14 | 1993-12-27 | Sony Corp | 洗浄装置 |
JPH08139062A (ja) * | 1994-11-11 | 1996-05-31 | M Setetsuku Kk | 基板のスクラビング装置 |
JP2930580B1 (ja) * | 1998-03-27 | 1999-08-03 | 株式会社カイジョー | 半導体ウエーハ等用洗浄装置 |
JP2002307023A (ja) * | 2001-04-13 | 2002-10-22 | Display Technologies Inc | 自己洗浄機能付きのブラシ洗浄装置、及びこれを用いる平面表示装置または半導体素子の製造方法 |
JP2009117765A (ja) | 2007-11-09 | 2009-05-28 | Aion Kk | 洗浄用スポンジローラ |
JP2009279536A (ja) * | 2008-05-23 | 2009-12-03 | Hitachi High-Technologies Corp | 基板洗浄装置及び、基板洗浄方法 |
JP5955635B2 (ja) * | 2012-05-11 | 2016-07-20 | 株式会社ディスコ | 洗浄装置 |
JP5886224B2 (ja) * | 2012-05-23 | 2016-03-16 | 株式会社荏原製作所 | 基板洗浄方法 |
JP6054805B2 (ja) * | 2013-04-25 | 2016-12-27 | 株式会社荏原製作所 | 基板洗浄装置 |
JP2015126033A (ja) * | 2013-12-25 | 2015-07-06 | 株式会社ディスコ | 洗浄装置および加工装置 |
-
2016
- 2016-02-25 JP JP2016034321A patent/JP6609197B2/ja active Active
-
2017
- 2017-01-12 TW TW106101030A patent/TWI743076B/zh active
- 2017-02-16 KR KR1020170020901A patent/KR102518002B1/ko active IP Right Grant
- 2017-02-22 CN CN201710095215.XA patent/CN107123609B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN107123609A (zh) | 2017-09-01 |
TW201735148A (zh) | 2017-10-01 |
JP2017152565A (ja) | 2017-08-31 |
KR102518002B1 (ko) | 2023-04-04 |
CN107123609B (zh) | 2022-02-11 |
KR20170100428A (ko) | 2017-09-04 |
TWI743076B (zh) | 2021-10-21 |
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