JP6594361B2 - 通信機器 - Google Patents
通信機器 Download PDFInfo
- Publication number
- JP6594361B2 JP6594361B2 JP2017027025A JP2017027025A JP6594361B2 JP 6594361 B2 JP6594361 B2 JP 6594361B2 JP 2017027025 A JP2017027025 A JP 2017027025A JP 2017027025 A JP2017027025 A JP 2017027025A JP 6594361 B2 JP6594361 B2 JP 6594361B2
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- Prior art keywords
- signal line
- wireless communication
- communication module
- antenna
- land
- Prior art date
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
- H01P3/006—Conductor backed coplanar waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Transceivers (AREA)
- Details Of Aerials (AREA)
Description
Claims (7)
- 基板の表面に形成された、アンテナと無線通信モジュールとを接続する信号線であって、その一部が分断されている箇所を有し、当該分断されている箇所に隣接する隣接部分の線幅が本体部分より広く形成されている信号線と、
前記本体部分に対向するように配置されている第1のグラウンドパターンと、
前記隣接部分に対向するように配置されている第2のグラウンドパターンと、
前記基板の裏面に形成された、前記無線通信モジュールの測定を行う測定機器を接続するための測定ランドと、
を含み、
前記隣接部分から前記第2のグラウンドパターンまでの距離が、前記本体部分から前記第1のグラウンドパターンまでの距離よりも長く、
前記アンテナと前記無線通信モジュールとが、前記信号線、及び前記隣接部分に接着されたはんだを介して接続されており、
前記測定ランドは、前記基板を貫通する貫通孔を介して、前記隣接部分より前記無線通信モジュール側の位置で前記信号線に接続されている
ことを特徴とする通信機器。 - 請求項1に記載の通信機器において、
前記信号線は、前記アンテナ側の端部の位置で、前記アンテナと分断されている
ことを特徴とする通信機器。 - 請求項1又は2に記載の通信機器において、
前記基板は多層基板であって、
前記第1のグラウンドパターンは、前記多層基板内部のパターン層に形成されており、
前記第2のグラウンドパターンは、前記多層基板内部の前記第1のグラウンドパターンが形成されたパターン層とは別のパターン層、又は前記多層基板の裏面に形成されている
ことを特徴とする通信機器。 - 請求項3に記載の通信機器において、
前記隣接部分は、矩形形状に形成されている
ことを特徴とする通信機器。 - 請求項1から4のいずれか一項に記載の通信機器において、
前記貫通孔は、前記測定ランドの中心位置からずれた位置に設けられている
ことを特徴とする通信機器。 - 請求項1から5のいずれか一項に記載の通信機器において、
前記第1のグラウンドパターンは、平面視において前記隣接部分と重なる対向部分と、前記貫通孔の周囲を囲む周辺部分とを避けて形成されており、かつ、前記対向部分と前記周辺部分とが互いに連結するように形成されている
ことを特徴とする通信機器。 - 基板の表面に配置される、アンテナと無線通信モジュールとを接続する信号線であって、その一部が分断されている箇所を有し、当該分断されている箇所に隣接する隣接部分の線幅が本体部分より広い信号線と、前記本体部分に対向する第1のグラウンドパターンと、前記隣接部分に対向する第2のグラウンドパターンと、前記基板の裏面に配置され、前記基板を貫通する貫通孔を介して前記信号線の前記隣接部分より前記無線通信モジュール側の位置に接続される測定ランドと、を形成する工程と、
前記測定ランドに測定機器を接続させて、前記無線通信モジュールの測定を行う工程と、
前記無線通信モジュールの測定を行った後で、前記分断されている箇所をはんだ付けして前記無線通信モジュールと前記アンテナとを接続する工程と、
を含むことを特徴とする通信機器の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017027025A JP6594361B2 (ja) | 2017-02-16 | 2017-02-16 | 通信機器 |
EP18153621.0A EP3364497B1 (en) | 2017-02-16 | 2018-01-26 | Communication apparatus |
US15/887,413 US10854981B2 (en) | 2017-02-16 | 2018-02-02 | Communication apparatus |
CN201810133112.2A CN108449108B (zh) | 2017-02-16 | 2018-02-09 | 通信装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017027025A JP6594361B2 (ja) | 2017-02-16 | 2017-02-16 | 通信機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018133732A JP2018133732A (ja) | 2018-08-23 |
JP6594361B2 true JP6594361B2 (ja) | 2019-10-23 |
Family
ID=61163482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017027025A Active JP6594361B2 (ja) | 2017-02-16 | 2017-02-16 | 通信機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10854981B2 (ja) |
EP (1) | EP3364497B1 (ja) |
JP (1) | JP6594361B2 (ja) |
CN (1) | CN108449108B (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0692841B1 (en) | 1994-07-15 | 1998-09-30 | Berg Electronics Manufacturing B.V. | Assembly of shielded connectors and a board having plated holes |
JPH09257852A (ja) * | 1996-03-20 | 1997-10-03 | Kenwood Corp | 通信機のrf回路特性試験方法 |
CN101673885B (zh) | 2004-11-29 | 2012-07-18 | Fci公司 | 改进的匹配阻抗表面贴装技术基底面 |
JP2008306087A (ja) * | 2007-06-11 | 2008-12-18 | Mitsubishi Electric Corp | 基板及び基板間接続装置 |
CN101232695A (zh) | 2008-02-28 | 2008-07-30 | 深圳华为通信技术有限公司 | 射频电路板及其制造方法 |
KR101332044B1 (ko) * | 2011-08-30 | 2013-11-22 | 삼성전기주식회사 | 임피던스 매칭 장치 |
US8581362B2 (en) | 2011-11-04 | 2013-11-12 | Broadcom Corporation | Wireless communication devices with in-package integrated passive components |
US8970436B2 (en) * | 2013-03-14 | 2015-03-03 | Circomm Technology Corp. | Surface mount device multi-frequency antenna module |
CN103281144A (zh) | 2013-06-03 | 2013-09-04 | 深圳市双赢伟业科技股份有限公司 | 一种无线产品的无线性能测试方法 |
TW201515530A (zh) | 2013-10-11 | 2015-04-16 | Adv Flexible Circuits Co Ltd | 電路板高頻信號連接墊的抗衰減結構 |
JP2015126100A (ja) | 2013-12-26 | 2015-07-06 | 株式会社デンソー | 電子制御装置、および、これを用いた電動パワーステアリング装置 |
CN205941717U (zh) * | 2016-06-27 | 2017-02-08 | 硕诺科技(深圳)有限公司 | 一种射频测试电路 |
-
2017
- 2017-02-16 JP JP2017027025A patent/JP6594361B2/ja active Active
-
2018
- 2018-01-26 EP EP18153621.0A patent/EP3364497B1/en active Active
- 2018-02-02 US US15/887,413 patent/US10854981B2/en active Active
- 2018-02-09 CN CN201810133112.2A patent/CN108449108B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018133732A (ja) | 2018-08-23 |
CN108449108B (zh) | 2021-06-22 |
US10854981B2 (en) | 2020-12-01 |
EP3364497A1 (en) | 2018-08-22 |
US20180233825A1 (en) | 2018-08-16 |
EP3364497B1 (en) | 2019-11-20 |
CN108449108A (zh) | 2018-08-24 |
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