JP6581831B2 - 保持部の姿勢維持機構 - Google Patents
保持部の姿勢維持機構 Download PDFInfo
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- JP6581831B2 JP6581831B2 JP2015148521A JP2015148521A JP6581831B2 JP 6581831 B2 JP6581831 B2 JP 6581831B2 JP 2015148521 A JP2015148521 A JP 2015148521A JP 2015148521 A JP2015148521 A JP 2015148521A JP 6581831 B2 JP6581831 B2 JP 6581831B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/003—Programme-controlled manipulators having parallel kinematics
- B25J9/0045—Programme-controlled manipulators having parallel kinematics with kinematics chains having a rotary joint at the base
- B25J9/0048—Programme-controlled manipulators having parallel kinematics with kinematics chains having a rotary joint at the base with kinematics chains of the type rotary-rotary-rotary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/102—Gears specially adapted therefor, e.g. reduction gears
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
- B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/904—Devices for picking-up and depositing articles or materials provided with rotary movements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K49/00—Dynamo-electric clutches; Dynamo-electric brakes
- H02K49/10—Dynamo-electric clutches; Dynamo-electric brakes of the permanent-magnet type
- H02K49/102—Magnetic gearings, i.e. assembly of gears, linear or rotary, by which motion is magnetically transferred without physical contact
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
前記第3の磁性体は、前記保持部に支持され、
前記第1の磁性体及び前記第2の磁性体は、各々磁極対を円周方向に沿って等間隔で複数配置して、前記第1の磁性体と前記第2の磁性体とは着磁面が対向するように構成され、前記第3の磁性体は、磁極対を外周面に沿って等間隔に複数配置して構成され、前記第3の磁性体が偶数個設けられ、
前記第3の磁性体における磁極対の磁極の最内周部の円周方向の距離と、前記第1の磁性体と前記第2の磁性体における、前記第3の磁性体の最内周部と平面視で重なる部分の円周方向軌跡上に位置する磁極対の磁極の距離とが一致するように前記第1の磁性体、前記第2の磁性体と前記第3の磁性体の各磁極対は配列され、
前記第3の磁性体の半数が、各々外周面上端部と下端部に磁極対の中間に対応する位置がある場合には、前記各第3の磁性体の他の半数は、各々外周面上端部と下端部に磁極対のいずれか一方の極における周方向中心が位置するように配置されていることを特徴としている。
2 カセットステーション
3 処理ステーション
4 ロードロック室
10 カセット載置部
20 処理チャンバ
30 ウェハ搬送装置
31 フォーク
60 磁気ギア
61 第1の磁性体
62 第2の磁性体
71 第3の磁性体
W ウェハ
Claims (2)
- 搬送対象物を保持する保持部と、一端部が前記保持部に連結される第1のリンクと、一端部が前記保持部に連結される第2のリンクと、を有し、前記第1のリンク及び前記第2のリンクを前記保持部に対して相対的に移動させることにより前記保持部を搬送位置と待機位置との間で移動させる搬送装置において、前記保持部の姿勢を維持する姿勢維持機構であって、
前記第1のリンクの一端部及び前記第2のリンクの一端部を、前記保持部に回転可能に連結する磁気ギアを有し、
前記磁気ギアは、前記第1のリンクにおける前記保持部に連結された一端部が第1の軸線の回りを回転し、前記第2のリンクにおける前記保持部に連結された一端部が前記第1の軸線の回りを回転するように配置され、
前記磁気ギアは、前記第1の軸線上に、対向して各々水平に配置された円盤形状の第1の磁性体及び第2の磁性体と、前記第1の磁性体及び前記第2の磁性体の間に配置された円筒形状の第3の磁性体を有し、
前記第3の磁性体は、当該第3の磁性体の中心軸が前記第1の磁性体及び前記第2の磁性体と平行で、且つ当該第3の磁性体の中心軸と前記第1の磁性体及び前記第2の磁性体の前記第1の軸線とが交差するように配置され、
前記第1の磁性体は、前記第1のリンクに支持され、
前記第2の磁性体は、前記第2のリンクに支持され、
前記第3の磁性体は、前記保持部に支持され、
前記第1の磁性体及び前記第2の磁性体は、各々磁極対を円周方向に沿って等間隔で複数配置して、前記第1の磁性体と前記第2の磁性体とは着磁面が対向するように構成され、
前記第3の磁性体は、磁極対を外周面に沿って等間隔に複数配置して構成され、
前記第3の磁性体が偶数個設けられ、
前記第3の磁性体における磁極対の磁極の最内周部の円周方向の距離と、前記第1の磁性体と前記第2の磁性体における、前記第3の磁性体の最内周部と平面視で重なる部分の円周方向軌跡上に位置する磁極対の磁極の距離とが一致するように前記第1の磁性体、前記第2の磁性体と前記第3の磁性体の各磁極対は配列され、
前記第3の磁性体の半数が、各々外周面上端部と下端部に磁極対の中間に対応する位置がある場合には、前記各第3の磁性体の他の半数は、各々外周面上端部と下端部に磁極対のいずれか一方の極における周方向中心が位置するように配置されていることを特徴とする、保持部の姿勢維持機構。 - 前記保持部には、脱調を復元させる干渉部材が設けられていることを特徴とする、請求項1に記載の保持部の姿勢維持機構。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015148521A JP6581831B2 (ja) | 2015-07-28 | 2015-07-28 | 保持部の姿勢維持機構 |
KR1020160089846A KR101832062B1 (ko) | 2015-07-28 | 2016-07-15 | 유지부의 자세 유지 기구 |
US15/212,838 US9776321B2 (en) | 2015-07-28 | 2016-07-18 | Posture holding device for holding part |
TW105123585A TWI694907B (zh) | 2015-07-28 | 2016-07-26 | 保持部之姿勢維持機構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015148521A JP6581831B2 (ja) | 2015-07-28 | 2015-07-28 | 保持部の姿勢維持機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017024152A JP2017024152A (ja) | 2017-02-02 |
JP6581831B2 true JP6581831B2 (ja) | 2019-09-25 |
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Application Number | Title | Priority Date | Filing Date |
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JP2015148521A Active JP6581831B2 (ja) | 2015-07-28 | 2015-07-28 | 保持部の姿勢維持機構 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9776321B2 (ja) |
JP (1) | JP6581831B2 (ja) |
KR (1) | KR101832062B1 (ja) |
TW (1) | TWI694907B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107789059B (zh) * | 2017-09-19 | 2019-06-07 | 山东科技大学 | 一种微创腹腔手术机器人 |
JP6935741B2 (ja) * | 2017-12-20 | 2021-09-15 | 東京エレクトロン株式会社 | 成膜装置 |
TW202012128A (zh) * | 2018-06-27 | 2020-04-01 | 美商法伯沃克斯分解股份有限公司 | 配備有彎管硬停件之機械臂總成 |
WO2020138017A1 (ja) * | 2018-12-28 | 2020-07-02 | 川崎重工業株式会社 | ロボット制御装置、ロボットシステム及びロボット制御方法 |
CN113382624B (zh) * | 2021-06-16 | 2022-10-11 | 珠海凌智自动化科技有限公司 | 热敏电阻供料器 |
JP7470470B1 (ja) | 2023-10-31 | 2024-04-18 | 弘幸 福田 | 発電システム |
Family Cites Families (17)
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JPS62121090U (ja) * | 1986-12-16 | 1987-07-31 | ||
JPH04122589A (ja) * | 1990-09-14 | 1992-04-23 | Ulvac Japan Ltd | 真空中における多関節搬送装置 |
JPH0773833B2 (ja) | 1992-04-23 | 1995-08-09 | アプライド マテリアルズ インコーポレイテッド | ロボット・アセンブリ |
TW349897B (en) * | 1996-02-02 | 1999-01-11 | Komatsu Mfg Co Ltd | Operational robot |
US5789878A (en) * | 1996-07-15 | 1998-08-04 | Applied Materials, Inc. | Dual plane robot |
US5894760A (en) * | 1997-06-12 | 1999-04-20 | Brooks Automation, Inc. | Substrate transport drive system |
JP4122589B2 (ja) | 1997-11-27 | 2008-07-23 | 三菱化学株式会社 | エポキシ化合物の製造方法 |
JPH11156767A (ja) * | 1997-12-02 | 1999-06-15 | Hitachi Ltd | 搬送装置 |
JP4463409B2 (ja) * | 2000-10-24 | 2010-05-19 | 株式会社アルバック | 搬送装置及び真空処理装置 |
JP4412245B2 (ja) * | 2005-06-28 | 2010-02-10 | ヤマハ株式会社 | 調律器及びプログラム |
JP4072186B2 (ja) | 2005-07-20 | 2008-04-09 | 株式会社松栄工機 | 動力伝達機構 |
US8459140B2 (en) * | 2007-04-18 | 2013-06-11 | Fabworx Solutions, Inc. | Adjustable wrist design for robotic arm |
US8267636B2 (en) * | 2007-05-08 | 2012-09-18 | Brooks Automation, Inc. | Substrate transport apparatus |
JP5525399B2 (ja) | 2010-09-16 | 2014-06-18 | 東京エレクトロン株式会社 | 搬送装置、基板処理システム及び姿勢制御機構 |
WO2012048346A1 (en) * | 2010-10-08 | 2012-04-12 | Brooks Automation, Inc. | Coaxial drive vacuum robot |
JP5996857B2 (ja) * | 2011-09-30 | 2016-09-21 | 東京エレクトロン株式会社 | 駆動装置及び基板処理システム |
JP6400977B2 (ja) * | 2013-09-25 | 2018-10-03 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
-
2015
- 2015-07-28 JP JP2015148521A patent/JP6581831B2/ja active Active
-
2016
- 2016-07-15 KR KR1020160089846A patent/KR101832062B1/ko active IP Right Grant
- 2016-07-18 US US15/212,838 patent/US9776321B2/en active Active
- 2016-07-26 TW TW105123585A patent/TWI694907B/zh active
Also Published As
Publication number | Publication date |
---|---|
US9776321B2 (en) | 2017-10-03 |
TWI694907B (zh) | 2020-06-01 |
JP2017024152A (ja) | 2017-02-02 |
US20170028547A1 (en) | 2017-02-02 |
KR20170013808A (ko) | 2017-02-07 |
KR101832062B1 (ko) | 2018-02-23 |
TW201718199A (zh) | 2017-06-01 |
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