JP6551794B2 - 導電粒子、ならびに回路部材の接続材料、接続構造、および接続方法 - Google Patents

導電粒子、ならびに回路部材の接続材料、接続構造、および接続方法 Download PDF

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JP6551794B2
JP6551794B2 JP2016107855A JP2016107855A JP6551794B2 JP 6551794 B2 JP6551794 B2 JP 6551794B2 JP 2016107855 A JP2016107855 A JP 2016107855A JP 2016107855 A JP2016107855 A JP 2016107855A JP 6551794 B2 JP6551794 B2 JP 6551794B2
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circuit member
solder material
electrode
solder
resin
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JP2017216300A (ja
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新 岸
新 岸
弘樹 圓尾
弘樹 圓尾
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2016107855A priority Critical patent/JP6551794B2/ja
Priority to US15/582,807 priority patent/US10412838B2/en
Priority to CN201710366152.7A priority patent/CN107454741B/zh
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
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    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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Description

本発明は、導電粒子、ならびに回路部材の接続材料、接続構造、および接続方法に関する。
第１電極を有する第１回路部材と、第２電極を有する第２回路部材との接続には、導電粒子を含む異方導電性接着剤が広く用いられている。異方導電性接着剤を用いた回路部材の接続方法では、異方導電性接着剤を介して第１電極と第２電極とが対向するように、第１回路部材と第２回路部材とを配置した後、第１回路部材と第２回路部材とを熱圧着する。異方導電性接着剤により、第１回路部材と第２回路部材とが接着されるとともに、導電粒子により第１電極と第２電極とが電気的に接続される。
異方導電性接着剤の導電粒子としては、例えば、表面にニッケルめっき層を有する樹脂粒子が用いられ、樹脂粒子の材料にアクリル樹脂などが用いられる（特許文献１参照）。
特開２０１５−１５５５３２号公報
熱圧着の際には、加熱により軟化した樹脂粒子が、押圧により電極間で圧縮されることで変形する。これにより、樹脂粒子（ニッケルめっき層）と電極との接触面積が大きくなる。その後、押圧を解除すると、樹脂粒子は、圧縮状態から解放されるため、樹脂粒子は元の形状に戻ろうと弾性変形する。このように樹脂粒子の弾性力を利用することで、導電粒子を電極に強固に接触させることができる。しかし、ニッケルめっき層は樹脂粒子の弾性変形に追従するため、押圧を解除した後は、押圧時と比べて、樹脂粒子（ニッケルめっき層）と電極との接触面積が小さくなり、電極間の電気的接続に対する信頼性が十分に得られない。
上記に鑑み、本発明の一局面は、樹脂材料を含む芯粒子と、前記芯粒子の表面を覆うとともにはんだ材料を含む表層と、を有し、前記はんだ材料の融点は、前記樹脂材料の軟化点以下であり、前記樹脂材料の軟化点は、１３０℃以下である、導電粒子に関する。
また、本発明の別の一局面は、第１電極を備えた第１主面を有する第１回路部材と、第２電極を備えた第２主面を有する第２回路部材とを接続する、接続材料であって、接着剤と、前記接着剤に分散する導電粒子とを含み、前記導電粒子は、樹脂材料を含む芯粒子と、前記芯粒子の表面を覆うとともにはんだ材料を含む表層と、を有し、前記はんだ材料の融点は、前記樹脂材料の軟化点以下であり、前記樹脂材料の軟化点は、１３０℃以下である、回路部材の接続材料に関する。
本発明の更に別の一局面は、第１電極を備えた第１主面を有する第１回路部材と、第２電極を備えた第２主面を有する第２回路部材と、前記第１主面と前記第２主面との間に介在する接合部と、を備え、前記接合部は、樹脂材料を含む芯粒子と、前記芯粒子の少なくとも一部を覆うとともに前記第１電極と前記第２電極とを電気的に接続するはんだ部と、を有し、前記はんだ部は、前記樹脂材料の軟化点以下の融点を有するはんだ材料を含み、
前記樹脂材料の軟化点は、１３０℃以下である、回路部材の接続構造に関する。
本発明の更に別の一局面は、第１電極を備えた第１主面を有する第１回路部材と、第２電極を備えた第２主面を有する第２回路部材とを接続する、回路部材の接続方法であって、（i）接着剤と、前記接着剤に分散する導電粒子とを含み、前記導電粒子は、樹脂材料を含む芯粒子と、前記芯粒子の表面を覆うとともにはんだ材料を含む表層と、を有する接続材料を準備する工程と、（ii）前記接続材料を介して前記第１電極と前記第２電極とが対向するように、前記第１回路部材と前記第２回路部材とを配置する工程と、（iii）前記第２回路部材を前記第１回路部材に対して押圧しながら加熱して、前記はんだ材料を溶融させる工程と、（iv）前記溶融したはんだ材料を固化することにより、前記第１電極と前記第２電極とを電気的に接続するはんだ部を形成する工程と、を含み、前記はんだ材料の融点は、前記樹脂材料の軟化点以下であり、前記工程（iii）では、前記はんだ材料の温度を融点以上に上昇させて、前記はんだ材料を溶融させると同時に、またはその後に、前記樹脂材料の温度を前記樹脂材料の軟化点以上に上昇させ、前記芯粒子を圧縮することにより、前記溶融したはんだ材料の前記第１電極および第２電極との接触面積を広げ、前記工程（iv）では、前記芯粒子を圧縮状態から解放し、前記樹脂材料の温度を前記樹脂材料の軟化点未満に低下させると同時に、またはその後に、前記はんだ材料の温度を前記はんだ材料の融点未満に低下させる、回路部材の接続方法に関する。
本発明によれば、第１回路部材が有する第１電極と第２回路部材が有する第２電極との電気的接続の信頼性を高めることができる。
本発明の実施形態に係る回路部材の接続方法において、熱圧着工程における導電粒子の状態および形成されるはんだ部の状態の一例を示す要部断面図である。
以下、本発明の実施形態に係る導電粒子、ならびに回路部材の接続材料、接続構造、および接続方法について詳細に説明するが、本発明はこれに限定されない。
回路部材の接続構造は、第１電極を備えた第１主面を有する第１回路部材と、第２電極を備えた第２主面を有する第２回路部材と、第１主面と第２主面との間に介在する接合部とを備える。接合部は、樹脂材料を含む芯粒子と、芯粒子の少なくとも一部を覆うとともに第１電極と第２電極とを電気的に接続するはんだ部とを有する。はんだ部は、樹脂材料の軟化点以下の融点を有するはんだ材料を含む。はんだ部は、後述する導電粒子に含まれるはんだ材料から形成される。
芯粒子に含まれる樹脂材料の軟化点は、通常は、JIS K 7206に準拠して測定されるビカット軟化温度を指す。ただし、樹脂材料が熱硬化性樹脂の硬化物を含む場合には、硬化物のガラス転移点を軟化点とする。ガラス転移点は、例えば、JIS K 7121に準拠して示差走査熱量計（ＤＳＣ）を用いて測定される。
上記はんだ部の形成方法、すなわち回路部材の接続方法は、（i）接着剤と、接着剤に分散する導電粒子とを含む接続材料を準備する工程と、（ii）接続材料を介して第１電極と第２電極とが対向するように、第１回路部材と第２回路部材とを配置する工程と、（iii）第２回路部材を第１回路部材に対して押圧しながら加熱して、はんだ材料を溶融させる工程と、（iv）溶融したはんだ材料を固化することにより、第１電極と第２電極とを電気的に接続するはんだ部を形成する工程と、を含む。工程（iv）では押圧も解除される。通常、加熱は、押圧の解除と同時に、または、押圧を解除した後に停止される。工程（iii）および（iv）は、いわゆる熱圧着の工程である。
工程（i）の接続材料に含まれる導電粒子は、樹脂材料を含む芯粒子と、芯粒子の表面を覆うとともにはんだ材料を含む表層とを有する。表層に含まれるはんだ材料の融点は、芯粒子に含まれる樹脂材料の軟化点以下である。
以下、熱圧着工程において電極間に捕捉された導電粒子から電極間を接続するはんだ部が形成される過程を、図１を参照しながら説明する。なお、便宜上、図１では、接続材料に含まれる導電粒子のみを図示し、接続材料に含まれる接着剤は図示しない。
図１（ａ）は、押圧により電極間に捕捉された導電粒子の状態、図１（ｂ）は、加熱によりはんだ材料の温度がはんだ材料の融点以上に上昇した時の導電粒子の状態、図１（ｃ）は、加熱により樹脂材料の温度が軟化点以上に上昇した時の導電粒子の状態、図１（ｄ）は、押圧を解除し、溶融はんだを固化してはんだ部が形成された状態を模式的に示す。
工程（iii）の押圧により、導電粒子１は、第１回路部材５が有する第１電極４と第２回路部材７が有する第２電極（バンプ）６との間に捕捉される（図１（ａ））。導電粒子１は、樹脂材料を含む芯粒子２と、芯粒子２の表面を覆うとともにはんだ材料を含む表層３とを有する。はんだ材料の融点は、樹脂材料の軟化点以下である。
工程（iii）の加熱によりはんだ材料の温度が融点以上に上昇すると、溶融したはんだ材料８が、第１電極４および第２電極６の表面に濡れ始める（図１（ｂ））。はんだ材料が溶融すると同時に、またはその後に、加熱により樹脂材料の温度が樹脂材料の軟化点以上に上昇すると、芯粒子２が軟化するとともに、押圧により圧縮されることで変形する（図（ｃ））。このとき、溶融したはんだ材料８は芯粒子２の変形に追従して、第１電極４および第２電極６の表面に大きく濡れ広がる（図（ｃ））。
工程（iv）では、押圧の解除により、芯粒子２は圧縮状態から解放され、弾性力により元の形状に戻ろうとする。押圧の解除と同時に、またはその後、樹脂材料の温度は、軟化点未満に低下する。それと同時に、またはその後に、はんだ材料の温度がはんだ材料の融点未満に低下する。これにより、溶融したはんだ材料８が固化して、はんだ部９が形成される（図１（ｄ））。このようにして、第１回路部材５と、第２回路部材７との間に、樹脂材料を含む芯粒子２と、芯粒子２の第１電極４および第２電極６と直に接する部分以外を覆うとともに、第１電極４と第２電極６とを電気的に接続するはんだ部９とを有する接合部が形成される。
芯粒子２が圧縮状態から解放され、元の形状に戻ろうとする際、はんだ材料８は溶融状態であるため、第１電極４および第２電極６との間に表面張力が作用する。よって、第１電極４および第２電極６との接触面付近に存在する溶融したはんだ材料８は、芯粒子２が元の形状に戻ろうとする弾性変形にほとんど追従しない。これにより、芯粒子２が圧縮された際に得られたはんだ材料と電極との大きな接触面積は殆ど維持される（図１（ｄ））。
また、はんだ材料８は溶融しているため、第１電極４および第２電極６との接触面付近において芯粒子２の弾性変形に追従しなくても、はんだ部に割れが生じるという不具合は生じない。
上記接続材料（導電粒子）を用いて熱圧着工程を行うことにより、溶融したはんだ材料の固化により形成されるはんだ部と電極との接触面積を大きく確保することができ、電極間の電気的接続に対する信頼性を高めることができる。すなわち、電極間の電気的接続に対する信頼性の高い接続構造を得ることができる。熱圧着工程において、少なくとも芯粒子が軟化（変形）している間、はんだ材料が溶融していることにより、信頼性の高い、電極間の電気的接続を実現することができる。
一方、はんだ材料の融点が、樹脂材料の軟化点よりも高い場合は、加熱により樹脂材料が軟化しても、表層中のはんだ材料は融点に達しておらず、溶融しない。このため、軟化した芯粒子が押圧により変形したとき、はんだ材料は、図１（ｃ）のように、第１電極４および第２電極６の表面に大きく濡れ広がることはできない。また、表層は芯粒子の変形に追従することができず、その一部が割れて剥がれ落ちてしまう場合がある。よって、回路部材の主面に複数の電極が所定のピッチで配列している場合、剥がれ落ちた表層の一部により、隣接する電極間がショートするなどの不具合を生じるおそれがある。
樹脂材料の軟化点は、１３０℃以下であることが好ましく、１１５℃以下であることがより好ましく、１１０℃以下であることがより好ましい。これにより、熱圧着工程を低温（例えば、樹脂材料の軟化点＋１０℃以下）で行うことができ、回路部材にかかる熱的ストレスを十分に低減することができる。よって、より信頼性の高い接続構造を得ることができる。
はんだ材料の融点は、１２５℃以下であることが好ましく、１１０℃以下であることがより好ましく、９０℃以下であることが更に好ましい。これにより、軟化点の低い（例えば軟化点が１３０℃以下である）樹脂材料を選択することができ、熱圧着工程を低温で行うことができ、回路部材かかる熱的ストレスを十分に低減することができる。よって、より信頼性の高い接続構造を得ることができる。
樹脂材料の軟化点Ｔsと、はんだ材料の融点Ｍｐとは、関係式：０．６２≦Ｍｐ／Ｔs≦０．９６を満たすことが好ましい。上記範囲内であれば、熱圧着工程において、比較的低温での熱圧着でも、形成されるはんだ部と電極との接触面積を大きくすることが容易になる。また、軟化点の低い芯粒子と融点の低いはんだ材料を選択して、熱圧着工程を低温で行うことができ、回路部材にかかる熱的ストレスを十分に低減することができる。よって、より信頼性の高い接続構造を得ることができる。
（樹脂接着部）
接合部は、更に、第１主面と第２主面とを接着する樹脂接着部を有してもよい。樹脂接着部は、接続材料に含まれる接着剤から形成される。接着剤が熱硬化性樹脂を含む場合、樹脂接着部は、熱硬化性樹脂の硬化物を含む。樹脂接着部により、回路部材の接続強度が向上する。
樹脂接着部は、はんだ部の少なくとも一部を覆っていることが好ましい。これにより、はんだ部が補強され、接続構造の強度がより向上する。また、回路部材が、所定のピッチで配列している複数の電極を有する場合には、電極間のピッチが狭い場合でも、隣接する電極間の絶縁を確保しやすくなる。例えば、樹脂部は、複数の第１電極と、複数の第２電極と、を接続する複数のはんだ部の隙間を埋めるように形成されることが望ましい。
（接続材料）
接続材料は、接着剤と、接着剤に分散する導電粒子とを含む。接着剤により第１主面と第２主面とが接着され、導電粒子により第１電極と第２電極とが電気的に接続される。接続材料は、ペースト状でもよく、フィルム状でもよい。工程（ii）では、第１主面または第２主面に、ペースト状の接続材料を塗布するか、または、フィルム状の接続材料を配置すればよい。
接続材料に含まれる導電粒子の量は、１．０体積％〜１０体積％であることが好ましい。導電粒子の量が上記範囲内であれば、導電粒子による電極間の電気的接続に対する高い信頼性を確保することができる。また、回路部材が所定のピッチで配列している複数の電極を有する場合、接着剤による隣接する電極間の絶縁を確実に行うことができる。
（導電粒子）
芯粒子は樹脂材料を含むため、芯粒子は適度な弾性力を有する。この弾性力を利用することで、熱圧着工程において、導電粒子と電極とを強固に密着させることができる。
芯粒子を構成する樹脂材料としては、常温で固体状のものが用いられ、公知の材料を用いればよく、例えば、アクリル樹脂、ポリオレフィン樹脂などの熱可塑性樹脂や、エポキシ樹脂、フェノール樹脂、シリコーン樹脂などの熱硬化性樹脂の硬化物などが挙げられる。
樹脂材料は、エポキシ樹脂の硬化物またはアクリル樹脂であることが好ましい。これらの樹脂は、適度な粘弾性を有する。また、軟化点（もしくはガラス転移点）を１３０℃以下とすることができるため、熱圧着工程を低温で行うことができる。また、これらの樹脂は押圧時に適度に変形するため、その変形に伴い、溶融したはんだ材料と電極との接触面積を十分に大きくすることができる。
はんだ材料は、低温で溶融することが望ましく、錫、銀、ビスマス、インジウム、および亜鉛よりなる群から選択される少なくとも１種を含むことが好ましい。押圧時の芯粒子の変形に伴い、溶融したはんだ材料が電極表面に大きく濡れ広がることができ、電極間の電気的接続を強固に行うことができる。
はんだ材料は、ビスマス−インジウム合金を含むことがより好ましい。ビスマスおよびインジウムを含む合金は、低融点化が可能である。そのため、電極間の接続に必要な加熱温度も低温でよい。回路部材にかかる熱的ストレスを低減することができる。
はんだ材料に含まれるビスマス−インジウム合金は、融点（ｍｐ）７２℃〜１０９℃であることが好ましく、融点８５℃〜１０９℃であることが更に好ましく、融点８８℃〜９０℃であることが特に好ましい。はんだ材料に低融点のビスマス−インジウム合金を用い、更に、軟化点の低い樹脂材料を適宜選択することにより、電極間の接続（熱圧着）を、例えば１１０℃以下、望ましくは１００℃以下の低温で行うことが可能である。よって、回路部材にかかる熱的ストレスを顕著に低減することができる。
融点７２℃〜１０９℃のビスマス−インジウム合金としては、例えば３５Ｂｉ−６５Ｉｎ（ｍｐ：７２℃）、５１Ｂｉ−４９Ｉｎ（ｍｐ：８５℃）、５５Ｂｉ−４５Ｉｎ（ｍｐ：８９℃）、２７Ｂｉ−７３Ｉｎ（ｍｐ：１００℃）、６８Ｂｉ−３２Ｉｎ（ｍｐ：１０９℃）などが挙げられる。ただし、ＸＢｉ−ＹＩｎは、Ｘ質量％のビスマスとＹ質量％のインジウムとを含む合金を意味する。
はんだ材料に含まれるビスマス−インジウム合金において、ビスマス−インジウム合金に含まれるビスマスの量は、２７質量％〜６８質量％であることが好ましく、５１質量％〜５５質量％であることがより好ましい。ビスマス−インジウム合金の残部は、ほとんど（例えば残部の９９質量％以上）がインジウムであることが好ましい。このようなビスマス−インジウム合金は、電極との濡れ性および接続信頼性が高く、かつ低融点である。ビスマス−インジウム合金は、例えば、ＢｉＩｎ２、Ｂｉ３Ｉｎ５およびＢｉＩｎよりなる群から選択される少なくとも１種を含む。
また、電気的接続の信頼性を高める観点から、はんだ材料に含まれるビスマス−インジウム合金において、ビスマス−インジウム合金に含まれるインジウムの量は、３２質量％〜７３質量％が好ましく、３２質量％〜４９質量％がより好ましく、４３質量％〜４７質量％が更に好ましい。
芯粒子の平均粒子径（体積基準のメディアン径（Ｄ５０））は、２．０μｍ〜６．０μｍであることが好ましい。芯粒子の平均粒子径が上記範囲内であれば、電極間の電気的接続に対する高い信頼性を十分に確保することができる。
表層の形成方法としては、公知の手法を用いればよく、例えばめっき法が挙げられる。
表層の厚みは、０．０５μｍ〜３．０μｍであることが好ましい。表層の厚みが上記範囲内であれば、電極間の電気的接続に対する高い信頼性を十分に確保することができる。
電極間の電気的接続に対する高い信頼性を十分に確保するためには、導電粒子の形状は、略球状であることが好ましい。導電粒子のアスペクト比（長径／短径）は、２．０以下であることが好ましく、１．０５以下であることがより好ましい。
導電粒子に含まれるはんだ材料の量は、１．０体積％〜１０体積％であることが好ましい。はんだ材料の量が上記範囲内であれば、電極間の電気的接続に対する高い信頼性を十分に確保することができる。
（接着剤）
接着剤は、熱硬化性樹脂および／または熱可塑性樹脂を含む樹脂組成物であればよい。中でも、熱硬化性樹脂を含む樹脂組成物が好ましく、熱硬化性樹脂はエポキシ樹脂を含むことが好ましい。樹脂組成物は、熱硬化性樹脂の硬化剤を含んでもよい。硬化剤としては、アミン、フェノール樹脂、酸無水物などが挙げられる。樹脂組成物は、更に、種々の添加剤を含んでもよい。添加剤としては、はんだ材料や電極表面の酸化被膜を除去する活性剤、フィラー、硬化促進剤などが挙げられる。
接着剤が熱硬化性樹脂を含む場合には、熱圧着の際に、熱硬化性樹脂の硬化反応を進行させて、接着剤を硬化させることができる。このとき、熱硬化性樹脂の硬化反応の進行が不十分である場合には、アフターキュアを行ってもよい。
熱硬化性樹脂の硬化反応が進行する温度は、はんだ材料の融点より高いことが好ましい。これにより、熱硬化性樹脂の硬化反応の殆どが、はんだ材料が溶融し、はんだ材料により第１電極および第２電極が濡れた後で進行する。よって、第１電極と第２電極との電気的接続に対する信頼性を高めることができる。硬化反応が進行する温度は、例えば、示差走査熱量計（ＤＳＣ）により測定される吸熱ピーク温度により求められる。
（第１回路部材）
第１回路部材は、例えば、所定のピッチで配列している複数の第１電極を備えた第１主面を有する。第１回路部材は、特に限定されないが、例えば、テレビ、タブレット、スマートフォン、ウェアラブルデバイスなどが具備する表示パネルに用いられる透明基板であり得る。透明基板は、半透明であってもよい。透明基板としては、ガラス基板およびフィルム状基板が挙げられる。フィルム状基板は、透明性を有する樹脂フィルムで形成されている。透明性を有する樹脂フィルムとしては、ポリエチレンテレフタレート（ＰＥＴ）、ポリカーボネート（ＰＣ）、ポリエチレンナフタレート（ＰＥＮ）などのフィルムであり得る。
第１回路部材が透明基板である場合には、第１電極に透明電極が用いられる。透明電極は、インジウムとスズとを含む酸化物であればよく、インジウムおよびスズ以外の微量の第三の金属元素を含んでもよい。透明電極の代表例は、いわゆる酸化インジウムスズもしくはスズドープ酸化インジウム（Ｉｎｄｉｕｍ Ｔｉｎ Ｏｘｉｄｅ（ＩＴＯ））電極である。
（第２回路部材）
第２回路部材は、例えば、所定のピッチで配列している複数の第２電極を備えた第２主面を有する。第２電極はバンプを含んでもよい。第２回路部材は、特に限定されないが、例えば半導体チップ、電子部品パッケージ、フィルム基板、コネクタなどであり得る。
第２電極は、特に限定されないが、例えば、金、白金、銅、ニッケル、パラジウム、各種はんだなどを含む金属電極であり得る。金属電極を形成するはんだは、例えば、スズ、銀、ビスマス、インジウム、ニッケル、銅などを含むはんだであり得る。
工程(ii)では、例えば、所定のピッチで配列している複数の第１電極を備えた第１主面を有する第１回路部材と、所定のピッチで配列している複数の第２電極を備えた第２主面を有する第２回路部材とを用いる場合には、第１回路部材の第１主面の第１電極の少なくとも一部を覆う領域（以下、第１接続領域）に、接続材料を配置する。接続材料が未硬化または半硬化状態の熱硬化性樹脂を含むペースト状であれば、印刷装置、ディスペンサ、インクジェットノズルなどを用い、第１接続領域に接続材料を塗布すればよい。接続材料がフィルム状もしくはテープ状であれば、基材から所定形状に切り出された当該フィルムを剥がし、第１接続領域に圧着すればよい。このような操作は、例えば公知のテープ貼り付け装置により行われる。なお、第２回路部材の第２主面の第２電極の少なくとも一部を覆う領域（第２接続領域）に、接続材料を配置してもよく、第１および第２接続領域の両方に配置してもよい。このようにして、接続材料を介して第１回路部材と第２回路部材とが対向配置された積層構造が得られる。
工程（iii）では、第２回路部材を第１回路部材に対して押圧すると、第１回路部材も第２回路部材に対して押圧されることになる。つまり、どちらの回路部材に押圧のためのツールを押し当ててもよい。工程（iii）の加熱は、例えば、加熱のためのツールを用いて、第１回路部材および／または第２回路部材を加熱することで行われる。押圧のためのツールは加熱のためのツールを兼ねていてもよい。
熱圧着の際、第１回路部材および／または第２回路部材を押圧する圧力は、０．５〜４ＭＰａであればよく、１〜２ＭＰａが好ましい。はんだ材料が溶融しているため、あまり高い圧力を回路部材に印加しなくても、はんだ材料の濡れにより電極間の電気的接続を容易に行うことができる。樹脂材料が軟化しているため、あまり高い圧力を回路部材に印加しなくても、樹脂材料を容易に変形させることができる。
本発明に係る回路部材の接続構造は、例えば、タブレット、スマートフォンなどが具備する小型の液晶に好適に用いられる。
１ 導電粒子
２ 芯粒子
３ 表層
４ 第１電極
５ 第１回路部材
６ 第２電極
７ 第２回路部材
８ 溶融したはんだ材料
９ はんだ部

Claims (22)

  1. 樹脂材料を含む芯粒子と、前記芯粒子の表面を覆うとともにはんだ材料を含む表層と、を有し、
    前記はんだ材料の融点は、前記樹脂材料の軟化点以下であり、
    前記樹脂材料の軟化点は、１３０℃以下である、導電粒子。
  2. 前記はんだ材料は、錫、銀、ビスマス、インジウム、および亜鉛よりなる群から選択される少なくとも１種を含む、請求項１に記載の導電粒子。
  3. 前記はんだ材料は、ビスマス−インジウム合金である、請求項１または２に記載の導電粒子。
  4. 前記はんだ材料の融点は、１２５℃以下である、請求項１〜３のいずれか１項に記載の導電粒子。
  5. 前記樹脂材料の軟化点Ｔsと、前記はんだ材料の融点Ｍpとは、
    関係式：０．６２≦Ｍp／Ｔs≦０．９６
    を満たす、請求項１〜４のいずれか１項に記載の導電粒子。
  6. 第１電極を備えた第１主面を有する第１回路部材と、第２電極を備えた第２主面を有する第２回路部材とを接続する、接続材料であって、
    接着剤と、前記接着剤に分散する導電粒子と、を含み、
    前記導電粒子は、樹脂材料を含む芯粒子と、前記芯粒子の表面を覆うとともにはんだ材料を含む表層と、を有し、
    前記はんだ材料の融点は、前記樹脂材料の軟化点以下であり、
    前記樹脂材料の軟化点は、１３０℃以下である、回路部材の接続材料。
  7. 前記はんだ材料は、錫、銀、ビスマス、インジウム、および亜鉛よりなる群から選択される少なくとも１種を含む、請求項６に記載の回路部材の接続材料。
  8. 前記はんだ材料は、ビスマス−インジウム合金である、請求項６または７に記載の回路部材の接続材料。
  9. 前記はんだ材料の融点は、１２５℃以下である、請求項６〜８のいずれか１項に記載の回路部材の接続材料。
  10. 前記樹脂材料の軟化点Ｔsと、前記はんだ材料の融点Ｍpとは、
    関係式：０．６２≦Ｍp／Ｔs≦０．９６
    を満たす、請求項６〜９のいずれか１項に記載の回路部材の接続材料。
  11. 第１電極を備えた第１主面を有する第１回路部材と、
    第２電極を備えた第２主面を有する第２回路部材と、
    前記第１主面と前記第２主面との間に介在する接合部と、を備え、
    前記接合部は、樹脂材料を含む芯粒子と、前記芯粒子の少なくとも一部を覆うとともに前記第１電極と前記第２電極とを電気的に接続するはんだ部と、を有し、
    前記はんだ部は、前記樹脂材料の軟化点以下の融点を有するはんだ材料を含み、
    前記樹脂材料の軟化点は、１３０℃以下である、回路部材の接続構造。
  12. 前記接合部は、更に、前記第１主面と前記第２主面とを接着する樹脂接着部を有する、請求項１１に記載の回路部材の接続構造。
  13. 前記はんだ材料は、錫、銀、ビスマス、インジウム、および亜鉛よりなる群から選択される少なくとも１種を含む、請求項１１または１２に記載の回路部材の接続構造。
  14. 前記はんだ材料は、ビスマス−インジウム合金である、請求項１１〜１３のいずれか１項に記載の回路部材の接続構造。
  15. 前記はんだ材料の融点は、１２５℃以下である、請求項１１〜１４のいずれか１項に記載の回路部材の接続構造。
  16. 前記樹脂材料の軟化点Ｔsと、前記はんだ材料の融点Ｍpとは、
    関係式：０．６２≦Ｍp／Ｔs≦０．９６
    を満たす、請求項１１〜１５のいずれか１項に記載の回路部材の接続構造。
  17. 第１電極を備えた第１主面を有する第１回路部材と、第２電極を備えた第２主面を有する第２回路部材とを接続する、回路部材の接続方法であって、
    （i）接着剤と、前記接着剤に分散する導電粒子と、を含み、前記導電粒子は、樹脂材料を含む芯粒子と、前記芯粒子の表面を覆うとともにはんだ材料を含む表層と、を有する接続材料を準備する工程と、
    （ii）前記接続材料を介して前記第１電極と前記第２電極とが対向するように、前記第１回路部材と前記第２回路部材とを配置する工程と、
    （iii）前記第２回路部材を前記第１回路部材に対して押圧しながら加熱して、前記はんだ材料を溶融させる工程と、
    （iv）前記溶融したはんだ材料を固化することにより、前記第１電極と前記第２電極とを電気的に接続するはんだ部を形成する工程と、
    を含み、
    前記はんだ材料の融点は、前記樹脂材料の軟化点以下であり、
    前記工程（iii）では、前記はんだ材料の温度を融点以上に上昇させ、前記はんだ材料を溶融させると同時に、またはその後に、前記樹脂材料の温度を前記樹脂材料の軟化点以上に上昇させ、前記芯粒子を圧縮することにより、前記溶融したはんだ材料の前記第１電極および第２電極との接触面積を広げ、
    前記工程（iv）では、前記芯粒子を圧縮状態から解放し、前記樹脂材料の温度を前記軟化点未満に低下させると同時に、またはその後に、前記はんだ材料の温度を前記はんだ材料の融点未満に低下させる、回路部材の接続方法。
  18. 前記接着剤から前記第１主面と前記第２主面とを接着する樹脂接着部が形成される、請求項１７に記載の回路部材の接続方法。
  19. 前記はんだ材料は、錫、銀、ビスマス、インジウム、および亜鉛よりなる群から選択される少なくとも１種を含む、請求項１７または１８に記載の回路部材の接続方法。
  20. 前記樹脂材料の軟化点は、１３０℃以下である、請求項１７〜１９のいずれか１項に記載の回路部材の接続方法。
  21. 前記はんだ材料の融点は、１２５℃以下である、請求項１７〜２０のいずれか１項に記載の回路部材の接続方法。
  22. 前記樹脂材料の軟化点Ｔsと、前記はんだ材料の融点Ｍpとは、
    関係式：０．６２≦Ｍp／Ｔs≦０．９６
    を満たす、請求項１７〜２１のいずれか１項に記載の回路部材の接続方法。
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