JP6549902B2 - ダイシングダイボンドフィルム、半導体装置の製造方法および半導体装置 - Google Patents
ダイシングダイボンドフィルム、半導体装置の製造方法および半導体装置 Download PDFInfo
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- JP6549902B2 JP6549902B2 JP2015107262A JP2015107262A JP6549902B2 JP 6549902 B2 JP6549902 B2 JP 6549902B2 JP 2015107262 A JP2015107262 A JP 2015107262A JP 2015107262 A JP2015107262 A JP 2015107262A JP 6549902 B2 JP6549902 B2 JP 6549902B2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
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Description
(ダイシングダイボンドフィルム1)
図1に示すように、ダイシングダイボンドフィルム1はロール状をなす。
接着フィルム11は熱硬化性を備える。
なお、エポキシ樹脂のエポキシ当量は、JIS K 7236−2009に規定された方法で測定できる。
接着フィルム11をるつぼに入れ、大気雰囲気下、700℃で2時間強熱して灰化させる。得られた灰分を純水中に分散させて10分間超音波処理し、レーザー回折散乱式粒度分布測定装置(ベックマンコールター社製、「LS 13 320」;湿式法)を用いて平均粒径を求める。
カバーフィルム13としては、ポリエチレンテレフタレート(PET)フィルムなどが挙げられる。好ましくは、カバーフィルム13は離型処理が施されたポリエチレンテレフタレートフィルムである。
図3に示すように、ダイシングシート一体型接着フィルム71に半導体ウエハ4を圧着する。半導体ウエハ4としては、シリコンウエハ、シリコンカーバイドウエハ、化合物半導体ウエハなどが挙げられる。化合物半導体ウエハとしては、窒化ガリウムウエハなどが挙げられる。
粘着剤層122の接触部122Aは放射線により硬化する性質を有する。粘着剤層122の周辺部122Bも放射線により硬化する性質を有する。半導体装置の製造方法において、ダイボンド用チップ5を形成し、粘着剤層122に紫外線を照射し、ダイボンド用チップ5をピックアップする。これにより、粘着剤層122のダイボンド用チップ5に対する粘着力が低下するので、ダイボンド用チップ5を容易にピックアップできる。
粘着剤層122の接触部122Aは放射線により硬化されている。粘着剤層122の周辺部122Bも放射線により硬化されている。
接着フィルム11は、第1層および第1層上配置された第2層を含む複層形状をなす。
図7に示すように、ダイシングシート12における粘着面の全体が、接着フィルム11と接する。粘着剤層122は、放射線により硬化する性質を有することが好ましい。半導体装置の製造方法において、ダイボンド用チップ5を形成し、粘着剤層122に紫外線を照射し、ダイボンド用チップ5をピックアップする。これにより、粘着剤層122のダイボンド用チップ5に対する粘着力が低下するので、ダイボンド用チップ5を容易にピックアップできる。
基材層121は単層形状をなす。
ダイボンド用チップ5を形成する工程が、エキスパンドによりダイシングシート一体型接着フィルム71上に配置された半導体ウエハ4を分割する段階を含む。たとえば、ダイボンド用チップ5を形成する工程が、ダイシングシート一体型接着フィルム71上に配置された半導体ウエハ4にレーザー光を照射することにより、半導体ウエハ4の内部に脆弱層を形成するステップを含む。このとき、ダイボンド用チップ5を形成する工程は、脆弱層を形成するステップの後にエキスパンドをなすステップをさらに含む。エキスパンドにより接着フィルム11および半導体ウエハ4を同時に分割する。
図8に示すように、半導体装置の製造方法は、接着フィルム11に半導体ウエハ4を圧着する工程と、接着フィルム11に半導体ウエハ4を圧着する工程の後に、ダイ分割をなすことによりダイボンド用チップ5を形成する工程と、ダイボンド用チップ5を被着体61に圧着する工程とを含む。具体的は、ダイボンド用チップ5を被着体61に圧着する工程は、ダイボンド用チップ5を被着体61の半導体チップ641に圧着する工程である。被着体61は、基板606、半導体チップ641および半導体チップ641と基板606を接続するボンディングワイヤー607を含む。より具体的には、被着体61は、基板606、基板606上に配置された接着層611、接着層611上に配置された半導体チップ641および半導体チップ641と基板606を接続するボンディングワイヤー607を含む。ボンディングワイヤー607は、フィルム状接着剤111に埋まった部分を有する。
図9に示すように、ダイボンド用チップ5を被着体61に圧着する工程は、ダイボンド用チップ5を被着体61の基板606に圧着する工程である。ボンディングワイヤー607は、フィルム状接着剤111に埋まった両端を含む。
変形例1〜変形例8などは、任意に組み合わせることができる。
ダイシングシート一体型接着フィルムA〜Eを作製した。図10に示すように、ダイシングシート一体型接着フィルムA〜Eは、ダイシングシート9およびダイシングシート9上に配置された接着フィルム3を有する。ダイシングシート9は、基材91および基材91上に配置された粘着剤層92を有する。基材91は、第1基材911および第1基材911上に配置された第2基材912を有する。第2基材912は、第2面912bを有する。接着フィルムAは、第2主面3bを有する。
接着フィルムを作製するために使用した成分について説明する。
アクリル樹脂:ナガセケムテックス社製のテイサンレジンWS023−EK30(ヒドロキシル基およびカルボキシ基を有するアクリル酸エステル共重合体、Mw:50万、ガラス転移温度:−10℃)
エポキシ樹脂1:三菱化学社製のjER1001(固形エポキシ樹脂、エポキシ当量450g/eq.〜500g/eq.)
エポキシ樹脂2:三菱化学社製のjER828(液状エポキシ樹脂、エポキシ当量180g/eq.)
フェノール樹脂1:明和化成社製のMEH−7851(フェノール樹脂、水酸基当量201〜220g/eq.)
球状シリカ:アドマテックス社製のSO−25R(平均粒径0.5μmの球状シリカ)
導電性高分子:綜研化学社製のWED−S
次に、冷却管、窒素導入管、温度計および撹拌装置を備えた反応容器に、アクリル酸2−エチルヘキシル(以下、「2EHA」という。)100部、アクリル酸−2−ヒドロキシエチル(以下、「HEA」という。)10部、過酸化ベンゾイル0.3部およびトルエン80部を入れ、窒素気流中で60℃にて8時間重合処理をし、アクリル系ポリマーAを得た。このアクリル系ポリマーAに2−メタクリロイルオキシエチルイソシアネート(以下、「MOI」という。)5部を加え、空気気流中で50℃にて50時間、付加反応処理をし、アクリル系ポリマーA’を得た。
第1基材911は、厚み50μmのポリプロピレン製の基材である。第2基材912は、ポリエチレン100重量部に対して、綜研化学社製のWED−Sを20重量部含有する基材である。第2基材912の厚みは30μmである。
第1基材911は、厚み80μmのポリプロピレン製の基材である。第2基材912は、エチレン−酢酸ビニル共重合体100重量部に対して、T&K TOKA社製のPA−200(導電性高分子)を20重量部含有する基材である。第2基材912の厚みは10μmである。
第1基材911は、厚み50μmのポリプロピレン製の基材である。第2基材912は、厚みは30μmのポリエチレン製の基材である。
第1基材911は、ポリエチレン100重量部に対して、綜研化学社製のWED−Sを20重量部含有する基材である。第1基材911の厚みは50μmである。第2基材912は、厚み30μmのポリプロピレン製の基材である。
ダイシングシート一体型接着フィルムA〜Eについて、以下の評価を行った。結果を表2に示す。
アドバンテスト社製ハイメグオームメーターTR−8601の超高抵抗測定用試料箱TR−42を用いた。23±2℃、50±5%雰囲気下にダイシングシート一体型接着フィルムを2時間静置した後、同環境下で第2面912bに印加電圧500Vを加え、印加開始から1分後の数値を読み取った。印加電圧を表面電流で割った数値から、表面抵抗値を求めた。
ダイシングシート9から初期長さ120mm、幅10mmの短冊状のサンプルを切り出し、チャック間距離50mm、引張速度300mm/minで引張試験を行うことにより、サンプルの伸びの変化量(mm)を測定した。引張試験器として島津社製のオートグラフAG−IS、ロードセルとして島津社製のPFG−50NAを用いた。
カバーフィルムにダイシングシート一体型接着フィルムを200枚貼りつけ、ロール状に巻き、ウエハマウント装置MA−3000III(日東精機製)を用いてウエハ貼り合せ試験を行った。ダイシングシート一体型接着フィルム10枚からカバーフィルムを剥離し、ダイシングシート一体型接着フィルム10枚全てにおいてカバーフィルムを剥離できた場合を○と判定し、1枚以上剥離できなかった場合を×と判定した。
ダイシングシート一体型接着フィルムに12インチ、500μm厚のミラーウエハをウエハマウント装置(MA−3000III、日東精機製)にて60℃、10mm/secの速度で貼り合せした。その後、ダイシング装置(DFD6361、ディスコ製)にて10mm×10mmのチップサイズにダイシングを行った(シングルカット、ブレード高さ90μm、速度50mm/sec)。チップ上に導電性成分が付着しているかどうかをSEMにて分析した。導電性成分がチップ上に付着していなかった場合を○と判定し、導電性成分がチップ上に付着していた場合を×と判定した。
アドバンテスト社製ハイメグオームメーターTR−8601の超高抵抗測定用試料箱TR−42を用いた。23±2℃、50±5%雰囲気下にダイシングシート一体型接着フィルムを2時間静置した後、同環境下で第2主面3bに印加電圧500Vを加え、印加開始から1分後の数値を読み取った。印加電圧を表面電流で割った数値から、表面抵抗値を求めた。
直径5.0mmのプローブを、25℃、加圧条件100gf、加圧時間1秒で接着フィルムに押し付け、テストスピード120mm/minでプローブが接着フィルムから離れるときの荷重を測定した。
11 接着フィルム
11a 第1主面
11b 第2主面
12 ダイシングシート
13 カバーフィルム
71 ダイシングシート一体型接着フィルム
121 基材層
121a 第1面
121b 第2面
1211 第1基材層
1212 第2基材層
122 粘着剤層
122A 接触部
122B 周辺部
5 ダイボンド用チップ
41 半導体チップ
111 フィルム状接着剤
6 被着体
7 ボンディングワイヤー
8 封止樹脂
606 基板
607 ボンディングワイヤー
611 接着層
641 半導体チップ
Claims (9)
- ロール状をなすダイシングダイボンドフィルムであって、
カバーフィルムと、
前記カバーフィルム上に配置されたダイシングシート一体型接着フィルムとを含み、
前記ダイシングシート一体型接着フィルムは、
第1面および前記第1面に対向した第2面で両面が定義される基材層および前記第1面と接した粘着剤層を含むダイシングシート、ならびに
前記粘着剤層と接した第1主面および前記第1主面に対向した第2主面で両面が定義される接着フィルムを含み、
前記第2面の表面抵抗値が1.0×1011Ω/sq.以下、前記第2主面の表面抵抗値が1.0×1012Ω/sq.以上1.0×10 17 Ω/sq.以下であるダイシングダイボンドフィルム。 - 前記基材層は、前記第1面を有する第1基材層および前記第2面を有する第2基材層を含み、
前記第2基材層は導電性成分を含む請求項1に記載のダイシングダイボンドフィルム。 - 前記第2基材層の厚みが1μm〜30μmである請求項2に記載のダイシングダイボンドフィルム。
- 前記導電性成分が有機系導電性成分である請求項2または3に記載のダイシングダイボンドフィルム。
- 前記第2基材層が、ポリエチレン、ポリプロピレン、エチレン酢酸ビニル共重合体からなる群より選ばれた1種以上の樹脂をさらに含む請求項2〜4のいずれかに記載のダイシングダイボンドフィルム。
- 前記ダイシングシートの破断伸度が500%以上である請求項1〜5のいずれかに記載のダイシングダイボンドフィルム。
- 前記接着フィルムが、エポキシ樹脂またはフェノール樹脂と、アクリル樹脂とを含み、
前記接着フィルムにおける25℃のタック強度が0.2N以上3.0N以下である請求項1〜6のいずれかに記載のダイシングダイボンドフィルム。 - 前記カバーフィルムがポリエチレンテレフタレートフィルムであり、
前記カバーフィルムの厚みが20μm〜75μmである請求項1〜7のいずれかに記載のダイシングダイボンドフィルム。 - 請求項1〜8のいずれかに記載のダイシングダイボンドフィルムを準備する工程と、
前記ダイシングシート一体型接着フィルムの前記接着フィルムに半導体ウエハを圧着する工程と、
前記接着フィルムに前記半導体ウエハを圧着する工程の後に、ダイ分割をなすことにより半導体チップおよび前記半導体チップ上に配置されたフィルム状接着剤を含むダイボンド用チップを形成する工程と、
前記ダイボンド用チップを被着体に圧着する工程とを含み、
前記接着フィルムに前記半導体ウエハを圧着する工程は、前記カバーフィルムから前記ダイシングシート一体型接着フィルムを剥離するステップを含む半導体装置の製造方法。
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