JP6542760B2 - 高分子フィルムの化学的−機械的平坦化 - Google Patents
高分子フィルムの化学的−機械的平坦化 Download PDFInfo
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- JP6542760B2 JP6542760B2 JP2016516571A JP2016516571A JP6542760B2 JP 6542760 B2 JP6542760 B2 JP 6542760B2 JP 2016516571 A JP2016516571 A JP 2016516571A JP 2016516571 A JP2016516571 A JP 2016516571A JP 6542760 B2 JP6542760 B2 JP 6542760B2
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- 238000005498 polishing Methods 0.000 claims description 281
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- 239000000126 substance Substances 0.000 claims description 16
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- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- VTIIJXUACCWYHX-UHFFFAOYSA-L disodium;carboxylatooxy carbonate Chemical compound [Na+].[Na+].[O-]C(=O)OOC([O-])=O VTIIJXUACCWYHX-UHFFFAOYSA-L 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229940119177 germanium dioxide Drugs 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- PEYVWSJAZONVQK-UHFFFAOYSA-N hydroperoxy(oxo)borane Chemical compound OOB=O PEYVWSJAZONVQK-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- 229940078490 n,n-dimethylglycine Drugs 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JPMIIZHYYWMHDT-UHFFFAOYSA-N octhilinone Chemical compound CCCCCCCCN1SC=CC1=O JPMIIZHYYWMHDT-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000006179 pH buffering agent Substances 0.000 description 1
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229940045872 sodium percarbonate Drugs 0.000 description 1
- PFUVRDFDKPNGAV-UHFFFAOYSA-N sodium peroxide Chemical compound [Na+].[Na+].[O-][O-] PFUVRDFDKPNGAV-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Mechanical Engineering (AREA)
Description
この実施例は、高分子フィルムの除去速度に関する、ルイス酸である金属イオンと、芳香族カルボン酸、芳香族スルホン酸、芳香族酸アミド、アミノ酸、または、ヒドロキシ置換N−複素環であるリガンドとの組み合わせの有効性を実証する。
この実施例は、ルイス酸である金属イオンと、芳香族カルボン酸、芳香族スルホン酸、芳香族酸アミド、アミノ酸、または、ヒドロキシ置換N−複素環であるリガンドとの組み合わせが、高分子フィルムを効果的に除去する一方で、テトラエトキシシラン(TEOS)の除去を最小限にする(または、全く除去しない)ことを実証している。
この実施例は、ルイス酸である金属イオンと、芳香族カルボン酸、芳香族スルホン酸、芳香族酸アミド、アミノ酸、または、ヒドロキシ置換N−複素環であるリガンドとの組み合わせが、高分子フィルムを効果的に除去することを実証している。
この実施例は、ルイス酸である金属イオンと、芳香族カルボン酸、芳香族スルホン酸、芳香族酸アミド、アミノ酸、または、ヒドロキシ置換N−複素環であるリガンドとの組み合わせが、酸化物(例えば、二酸化ケイ素(SiO2))の除去を最小限にする(または、全く除去しない)ことを実証する。
Claims (23)
- (a)セリアを含む研磨粒子、
(b)Fe 3+ 、Al 3+ 、Cu 2+ 、Zn 2+ 、またはこれらの組み合わせである金属イオン、
(c)芳香族カルボン酸、芳香族スルホン酸、芳香族酸アミド、またはヒドロキシ置換N−複素環であるリガンド、および
(d)水性担体
を含む化学−機械研磨組成物であって、
当該化学−機械研磨組成物のpHが2〜3の範囲内にあり、金属イオンとリガンドとのモル濃度比が1:2である、化学−機械研磨組成物。 - 前記研磨粒子がセリアからなり、および前記化学−機械研磨組成物がその他の研磨粒子を含まない、請求項1に記載の化学−機械研磨組成物。
- 前記金属イオンがFe3+である、請求項1に記載の化学−機械研磨組成物。
- 前記金属イオンがAl3+である、請求項1に記載の化学−機械研磨組成物。
- 前記リガンドが、ピコリン酸、イソニコチン酸、ニコチン酸、ピリジンジカルボン酸、ピリジンスルホン酸、p−トルエンスルホン酸、サリチルアミド、アニリンスルホン酸、アミノ安息香酸、ピペコリン酸、2−ヒドロキシピリジン、8−ヒドロキシキノリン、2−ヒドロキシキノリン、またはこれらの組み合わせである、請求項1に記載の化学−機械研磨組成物。
- 前記リガンドがピコリン酸である、請求項5に記載の化学−機械研磨組成物。
- 前記化学−機械研磨組成物が過酸化物タイプの酸化剤を含まない、請求項1に記載の化学−機械研磨組成物。
- 前記化学−機械研磨組成物が、研磨粒子を0.01重量%〜1重量%の総濃度で含む請求項1に記載の化学−機械研磨組成物。
- 前記化学−機械研磨組成物が研磨粒子を0.01重量%〜0.05重量%の総濃度で含む、請求項8に記載の化学−機械研磨組成物。
- 前記化学−機械研磨組成物が、前記金属イオンを0.05mM〜50mMの総濃度で含む、請求項1に記載の化学−機械研磨組成物。
- 前記化学−機械研磨組成物が、芳香族カルボン酸、芳香族スルホン酸、芳香族酸アミド、またはヒドロキシ置換N−複素環である一つ以上のリガンドを0.1mM〜100mMの総濃度で含む、請求項1に記載の化学−機械研磨組成物。
- 基板を研磨する方法であって、
(i)基板を準備し、
(ii)研磨パッドを準備し、
(iii)請求項1に記載の化学−機械研磨組成物を準備し、
(iv)当該基板を、当該研磨パッドおよび当該化学−機械研磨組成物と接触せしめ、および
(v)当該基板を研磨するために、当該基板の少なくとも一部を摩耗させるために、当該研磨パッドおよび当該化学−機械研磨組成物を、当該基板に対して移動させる、工程を含むことを特徴とする基板を研磨する方法。 - 基板を研磨する方法であって、
(i)高分子フィルムを含む基板を準備し、
(ii)研磨パッドを準備し、
(iii)(a)セリアを含む研磨粒子、(b)Fe 3+ 、Al 3+ 、Cu 2+ 、Zn 2+ 、またはこれらの組み合わせである金属イオン、(c)芳香族カルボン酸、芳香族スルホン酸、芳香族酸アミド、またはヒドロキシ置換N−複素環であるリガンド、および(d)水性担体を含む化学−機械研磨組成物であって、当該化学−機械研磨組成物のpHが2〜3の範囲内にあり、金属イオンとリガンドとのモル濃度比が1:2である、化学−機械研磨組成物を準備し、
(iv)当該基板を、当該研磨パッドおよび当該化学−機械研磨組成物と接触せしめ、および
(v)当該基板を研磨するために、当該基板の表面にある高分子フィルムの少なくとも一部を摩耗させるために、当該研磨パッドおよび当該化学−機械研磨組成物を、当該基板に対して移動させる、工程を含むことを特徴とする基板の研磨方法。 - 前記研磨粒子がセリアからなり、および前記化学−機械研磨組成物がその他の研磨粒子を含まない、請求項13に記載の方法。
- 前記金属イオンがFe3+である、請求項13に記載の方法。
- 前記金属イオンがAl3+である、請求項13に記載の方法。
- 前記リガンドが、ピコリン酸、イソニコチン酸、ニコチン酸、ピリジンジカルボン酸、ピリジンスルホン酸、p−トルエンスルホン酸、サリチルアミド、アニリンスルホン酸、アミノ安息香酸、ピペコリン酸、2−ヒドロキシピリジン、8−ヒドロキシキノリン、2−ヒドロキシキノリン、またはこれらの組み合わせである、請求項13に記載の方法。
- 前記リガンドがピコリン酸である、請求項17に記載の方法。
- 前記化学−機械研磨組成物が過酸化物タイプの酸化剤を含まない、請求項13に記載の方法。
- 前記化学−機械研磨組成物が研磨粒子を0.01重量%〜1重量%の総濃度で含む、請求項13に記載の方法。
- 前記化学−機械研磨組成物が研磨粒子を0.01重量%〜0.05重量%の総濃度で含む、請求項20に記載の方法。
- 前記化学−機械研磨組成物が、前記金属イオンを0.05mM〜50mMの総濃度で含む、請求項13に記載の方法。
- 前記化学−機械研磨組成物が、芳香族カルボン酸、芳香族スルホン酸、芳香族酸アミド、またはヒドロキシ置換N−複素環である一つ以上のリガンドを0.1mM〜100mMの総濃度で含む、請求項13に記載の方法。
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US9434859B2 (en) | 2016-09-06 |
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US20150083689A1 (en) | 2015-03-26 |
EP3049216A4 (en) | 2017-07-26 |
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