JP6520943B2 - 発電回路ユニット - Google Patents
発電回路ユニット Download PDFInfo
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- JP6520943B2 JP6520943B2 JP2016532925A JP2016532925A JP6520943B2 JP 6520943 B2 JP6520943 B2 JP 6520943B2 JP 2016532925 A JP2016532925 A JP 2016532925A JP 2016532925 A JP2016532925 A JP 2016532925A JP 6520943 B2 JP6520943 B2 JP 6520943B2
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- 238000010248 power generation Methods 0.000 title claims description 117
- 239000000758 substrate Substances 0.000 claims description 241
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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Description
図1は、本発明の実施の形態に係る太陽光発電装置の斜視図である。
発電回路ユニットであって、
配線基板と、
前記配線基板に実装された複数の発電素子とを備え、
前記配線基板は、
前記発電素子がそれぞれ実装された第1基板および第2基板と、
前記第1基板と前記第2基板とを連結する連結部とを含み、
前記第1基板は、前記第2基板から第1距離離れた第1位置、および前記第2基板から第1距離より大きい第2距離離れた第2位置の少なくとも2つの位置に配置することが可能であり、
前記連結部はFPC(Flexible Printed Circuits)を有し、
前記第1基板が前記第2位置に配置された状態において、前記連結部の少なくとも一部が捻じれており、
前記発電回路ユニットは、太陽光発電装置において用いられ、
前記太陽光発電装置において、レンズによって収束された太陽光が前記発電素子へ照射される、発電回路ユニット。
12 太陽光発電パネル
13 太陽方向センサ
14 フレーム部
15 発電回路ユニット
17 ボールレンズ
18 パッケージ
19 発電素子
20,20A,20B パッケージ電極
25 集光部
26 フレネルレンズ
27 壁部
30,30P1,30P2,30Q1,30Q2,30R1,30R2, 発電部
32,32A,32B,32C,32D,32E,32F,32G,32H,32I,32J 帯状基板
33,33F,33H,33I,33J,33K,33L,33M,33N,33O,33P 連結部
38 ベース部
39 リード線
40 架台
42A,42B 素子電極
46 土台
48 支柱
58 基板内接着層
59 ベース接着層
60 ランド部
63 配線部
68 開口部
69 配線基板
77,77A,77B 導電部
78 絶縁部
79 FPC
89 補強板
90 機能部
101 太陽光発電装置
144 第1連結片
145 幅広部
244 第2連結片
245 幅広部
344 中間片
Claims (15)
- 配線基板と、
前記配線基板に実装された複数の発電素子とを備え、
前記配線基板は、
帯状に形成され、前記発電素子がそれぞれ実装された第1基板および第2基板と、
前記第1基板と前記第2基板とを連結する連結部とを含み、
前記第1基板は、前記第1基板および前記第2基板が幅方向に並んだ状態で、前記第2基板から第1距離離れた第1位置、および前記第2基板から第1距離より大きい第2距離離れた第2位置の少なくとも2つの位置に配置することが可能であり、
前記連結部はFPC(Flexible Printed Circuits)を有し、
前記第1基板が前記第2位置に配置された状態において、前記連結部の少なくとも一部が捻じれている、発電回路ユニット。 - 前記第1基板が前記第2位置に配置された状態において、前記連結部の少なくとも一部が前記第1基板および前記第2基板の少なくともいずれか一方の高さ位置より上方に位置している、請求項1に記載の発電回路ユニット。
- 前記連結部は、第1連結片と、第2連結片と、中間片とを有し、
前記第1連結片は、前記第1基板と前記中間片とを接続し、
前記第2連結片は、前記第2基板と前記中間片とを接続している、請求項1または請求項2に記載の発電回路ユニット。 - 前記第1基板が前記第2位置に配置された状態において、前記第1連結片、前記第2連結片および前記中間片の少なくともいずれか1つが捻じれている、請求項3に記載の発電回路ユニット。
- 前記第1基板が前記第2位置に配置された状態において、前記第1連結片および前記第2連結片の両方が捻じれている、請求項3または請求項4に記載の発電回路ユニット。
- 前記第1基板が前記第2位置に配置された状態において、前記第1連結片が前記第1基板の高さ位置より上方に位置している、請求項3から請求項5のいずれか1項に記載の発電回路ユニット。
- 前記第1基板が前記第2位置に配置された状態において、前記中間片が前記第1基板の高さ位置より上方に位置している、請求項3から請求項6のいずれか1項に記載の発電回路ユニット。
- 前記第1連結片の延伸方向における長さが前記第2連結片の延伸方向における長さと異なる、請求項3から請求項7のいずれか1項に記載の発電回路ユニット。
- 前記第1基板が前記第1位置に配置された状態において、前記中間片の延伸方向が前記第1連結片の延伸方向と異なる、請求項3から請求項8のいずれか1項に記載の発電回路ユニット。
- 前記第1基板が前記第1位置に配置された状態において、前記中間片の延伸方向が前記第2連結片の延伸方向と異なる、請求項9に記載の発電回路ユニット。
- 前記第1基板が前記第2位置に配置された状態において、前記第1連結片の少なくとも一部の厚み方向が前記第1基板の厚み方向と異なる、請求項3から請求項10のいずれか1項に記載の発電回路ユニット。
- 前記第1基板が前記第2位置に配置された状態において、前記第2連結片の少なくとも一部の厚み方向が前記第2基板の厚み方向と異なる、請求項11に記載の発電回路ユニット。
- 前記第1基板が前記第2位置に配置された状態において、前記中間片の少なくとも一部の厚み方向が前記第1連結片および前記第2連結片の少なくとも一方の厚み方向と異なる、請求項3から請求項12のいずれか1項に記載の発電回路ユニット。
- 前記第1基板が前記第2位置に配置された状態において、前記第1基板および前記中間片の距離が前記第2基板および前記中間片の距離と異なる、請求項3から請求項13のいずれか1項に記載の発電回路ユニット。
- 前記第1連結片、前記中間片および前記第2連結片にわたって前記FPCが連続しており、
前記FPCは、
前記FPCの延伸方向に沿って設けられた導電部と、
前記導電部を覆う絶縁部とを有し、
前記第1連結片および前記第2連結片の少なくともいずれか一方の前記絶縁部が幅広部を有する、請求項3から請求項14のいずれか1項に記載の発電回路ユニット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014142327 | 2014-07-10 | ||
JP2014142327 | 2014-07-10 | ||
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6759778B2 (ja) | 2016-07-07 | 2020-09-23 | 住友電気工業株式会社 | 集光型太陽光発電モジュール、集光型太陽光発電装置及び水素精製システム |
WO2019030989A1 (ja) * | 2017-08-07 | 2019-02-14 | 住友電気工業株式会社 | 集光型太陽光発電モジュール、集光型太陽光発電パネル、集光型太陽光発電装置、及び集光型太陽光発電モジュールの製造方法 |
WO2019030988A1 (ja) * | 2017-08-07 | 2019-02-14 | 住友電気工業株式会社 | 集光型太陽光発電モジュール、集光型太陽光発電パネル、及び集光型太陽光発電装置 |
CN107453699B (zh) * | 2017-08-28 | 2024-01-23 | 江西清华泰豪三波电机有限公司 | 一种光伏组件及光伏装置 |
US10529881B2 (en) * | 2018-03-01 | 2020-01-07 | Solaero Technologies Corp. | Interconnect member |
JP7424288B2 (ja) * | 2018-06-27 | 2024-01-30 | 住友電気工業株式会社 | フレキシブルプリント配線板の原形体、フレキシブルプリント配線板の製造方法、集光型太陽光発電モジュール、及び、発光モジュール |
WO2020004148A1 (ja) * | 2018-06-27 | 2020-01-02 | 住友電気工業株式会社 | 集光型太陽光発電モジュール及び集光型太陽光発電装置 |
CN109067346A (zh) * | 2018-07-20 | 2018-12-21 | 上海空间电源研究所 | 刚挠结合板太阳电池阵 |
CN111609370A (zh) * | 2020-05-19 | 2020-09-01 | 田聪 | 一种基于电容传感的太阳能路灯雨天可保证亮度的装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001298217A (ja) * | 2000-04-13 | 2001-10-26 | Sumitomo Electric Ind Ltd | 光モジュール |
JP2005051133A (ja) | 2003-07-31 | 2005-02-24 | Canon Inc | プリント配線基板 |
US7550097B2 (en) | 2003-09-03 | 2009-06-23 | Momentive Performance Materials, Inc. | Thermal conductive material utilizing electrically conductive nanoparticles |
US8153886B1 (en) * | 2003-10-20 | 2012-04-10 | Amonix, Inc. | Method of improving the efficiency of loosely packed solar cells in dense array applications |
JP4648063B2 (ja) | 2005-04-19 | 2011-03-09 | 日東電工株式会社 | カテーテル用フレキシブル配線回路基板、並びに、該フレキシブル配線回路基板を用いたカテーテル及びその製造方法 |
JP2007019334A (ja) * | 2005-07-08 | 2007-01-25 | Mitsubishi Electric Corp | 太陽電池装置 |
US8759138B2 (en) * | 2008-02-11 | 2014-06-24 | Suncore Photovoltaics, Inc. | Concentrated photovoltaic system modules using III-V semiconductor solar cells |
US20110024162A1 (en) * | 2008-04-21 | 2011-02-03 | Sumitomo Bakelite Co., Ltd. | Flexible wiring unit and electronic apparatus |
KR101439386B1 (ko) | 2008-08-08 | 2014-09-16 | 스페라 파워 가부시키가이샤 | 채광형 태양전지 모듈 |
WO2011043318A1 (ja) | 2009-10-05 | 2011-04-14 | 株式会社村田製作所 | 回路基板 |
EP2362432B1 (en) * | 2010-02-25 | 2017-06-07 | Saint-Augustin Canada Electric Inc. | Solar cell assembly |
JP5853374B2 (ja) | 2010-03-12 | 2016-02-09 | オムロン株式会社 | 照明装置 |
JP2011210747A (ja) * | 2010-03-26 | 2011-10-20 | Mitsubishi Chemicals Corp | 太陽電池モジュール及びその製造方法 |
US8677639B2 (en) * | 2010-10-21 | 2014-03-25 | K-2 Corporation | Ski pole with inclinometer |
JP2013012605A (ja) * | 2011-06-29 | 2013-01-17 | Sharp Corp | 集光型太陽光発電装置、および集光型太陽光発電装置の製造方法 |
JP5942136B2 (ja) * | 2011-08-31 | 2016-06-29 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール及びその製造方法 |
WO2013042417A1 (ja) * | 2011-09-23 | 2013-03-28 | 三洋電機株式会社 | 太陽電池モジュール及び太陽電池 |
JP5814725B2 (ja) * | 2011-10-03 | 2015-11-17 | 住友電気工業株式会社 | 集光型太陽光発電モジュール及び集光型太陽光発電パネル |
JP5214005B2 (ja) | 2011-10-12 | 2013-06-19 | シャープ株式会社 | 集光型太陽電池モジュール及び太陽光発電システム |
US20130104958A1 (en) * | 2011-10-31 | 2013-05-02 | E I Du Pont De Nemours And Company | Integrated back-sheet for back contact photovoltaic module |
JP5948899B2 (ja) | 2012-01-25 | 2016-07-06 | 住友電気工業株式会社 | 集光型太陽光発電モジュール及び集光型太陽光発電パネル |
US9008122B2 (en) * | 2012-07-23 | 2015-04-14 | Cisco Technology, Inc. | Method and apparatus for triggering bandwidth upspeeding within an existing reservation |
JP5643792B2 (ja) * | 2012-08-10 | 2014-12-17 | 株式会社東具 | 電飾広告用のライン照明装置 |
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