JP6518323B2 - 作業機 - Google Patents
作業機 Download PDFInfo
- Publication number
- JP6518323B2 JP6518323B2 JP2017515305A JP2017515305A JP6518323B2 JP 6518323 B2 JP6518323 B2 JP 6518323B2 JP 2017515305 A JP2017515305 A JP 2017515305A JP 2017515305 A JP2017515305 A JP 2017515305A JP 6518323 B2 JP6518323 B2 JP 6518323B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit substrate
- hole
- lead
- jet
- moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 57
- 229910000679 solder Inorganic materials 0.000 claims description 37
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 17
- 238000005476 soldering Methods 0.000 description 7
- 230000032258 transport Effects 0.000 description 7
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10878—Means for retention of a lead in a hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図1に、部品実装機10を示す。部品実装機10は、回路基材12に対する部品の実装作業を実行するための装置である。部品実装機10は、装置本体20、基材搬送保持装置22、部品装着装置24、マークカメラ26、パーツカメラ28、部品供給装置30、ばら部品供給装置32、はんだ付け装置(図3参照)34、基材支持装置(図3参照)36、制御装置(図4参照)38を備えている。なお、回路基材12として、回路基板、三次元構造の基材等が挙げられ、回路基板として、プリント配線板、プリント回路板等が挙げられる。
部品実装機10では、上述した構成によって、基材搬送保持装置22に保持された回路基材12に対して部品の装着作業が行われる。部品実装機10では、種々の部品を回路基材12に装着することが可能であるが、リードを有する部品(以下、「リード部品」と略して記載する場合がある)を回路基材12に装着する場合について、以下に、具体的に説明する。
Claims (2)
- リード線を有する電子部品を保持するとともに、回路基材に形成された貫通穴に前記リード線を挿入させる保持装置と、
前記貫通穴に挿入された前記リード線に向かって、前記回路基材の下方から溶融はんだを噴流する噴流装置と、
前記噴流装置を前記回路基材の下方において任意の位置に移動させる第1移動装置と、
前記リード線が前記貫通穴に挿入される際に、前記回路基材を下方から支持する支持具と、
前記支持具を前記回路基材の下方において任意の位置に移動させる第2移動装置と、
前記保持装置と前記噴流装置と前記第1移動装置と前記第2移動装置との各々の作動を制御する制御装置と
を備え、
前記制御装置が、
前記支持具により前記回路基材を下方から支持した状態で、前記リード線を前記貫通穴に挿入させた後に、前記貫通穴に挿入された前記リード線に向かって、前記噴流装置により溶融はんだを噴流することで、電子部品を回路基材に実装する第1の実装作業と、前記支持具により前記回路基材を下方から支持することなく、前記リード線を前記貫通穴に挿入させた後に、前記貫通穴に挿入された前記リード線に向かって、前記噴流装置により溶融はんだを噴流することで、電子部品を回路基材に実装する第2の実装作業とを選択的に実行する作動制御部を有することを特徴とする作業機。 - 前記第2移動装置が、
前記支持具を前記回路基材の下方において昇降させる昇降装置と、その昇降装置による前記支持具の移動方向と交わる平面上の任意の位置に、前記支持具を移動させる平面方向移動装置とを有し、
前記第1移動装置と前記平面方向移動装置とが、同じ装置であり、
前記第1移動装置が、
前記噴流装置を前記平面上の任意の位置に移動させることを特徴とする請求項1に記載の作業機。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/062703 WO2016174715A1 (ja) | 2015-04-27 | 2015-04-27 | 作業機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016174715A1 JPWO2016174715A1 (ja) | 2018-02-15 |
JP6518323B2 true JP6518323B2 (ja) | 2019-05-22 |
Family
ID=57198207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017515305A Active JP6518323B2 (ja) | 2015-04-27 | 2015-04-27 | 作業機 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10470350B2 (ja) |
EP (1) | EP3291658B1 (ja) |
JP (1) | JP6518323B2 (ja) |
CN (1) | CN107535054B (ja) |
WO (1) | WO2016174715A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019111437B4 (de) | 2019-05-03 | 2023-09-28 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur Herstellung eines elektronischen Zwischenprodukts und Verfahren zur Herstellung eines Elektronik-Bauteils |
GB2588599B (en) * | 2019-10-24 | 2021-11-17 | Apollo Fire Detectors Ltd | Soldering Process |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3044860C2 (de) * | 1980-11-28 | 1987-04-09 | Blaupunkt-Werke Gmbh, 3200 Hildesheim | Verfahren und Vorrichtung zur Bestückung gedruckter Schaltungen |
US5218753A (en) * | 1989-06-22 | 1993-06-15 | Sanyo Electric Co., Ltd. | Assembling apparatus using back up pins for supporting printed circuit board |
JP2735134B2 (ja) | 1990-07-05 | 1998-04-02 | キヤノン株式会社 | ターレツト式実装機のための制御装置及び実装システム |
US5313401A (en) | 1989-07-17 | 1994-05-17 | Canon Kabushiki Kaisha | Mounting system including a plurality of hand mechanisms for picking up, moving and mounting works on an object board |
US5092035A (en) * | 1990-09-10 | 1992-03-03 | Codex Corporation | Method of making printed circuit board assembly |
JPH07263856A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 半田付け装置 |
JPH10209622A (ja) | 1997-01-27 | 1998-08-07 | Denso Corp | 挿入型部品の実装方法 |
JP2000223827A (ja) | 1999-02-01 | 2000-08-11 | Nippon Avionics Co Ltd | 噴流式局所はんだ付け装置 |
JP2001036228A (ja) | 1999-07-23 | 2001-02-09 | Matsushita Electric Ind Co Ltd | はんだ噴流装置 |
EP2012570B1 (en) * | 2006-04-26 | 2011-10-19 | Senju Metal Industry Co., Ltd. | Jet solder tank |
US8403199B2 (en) * | 2009-03-24 | 2013-03-26 | Senju Metal Industry Co., Ltd. | Localized jet soldering device and partial jet soldering method |
JP5747167B2 (ja) | 2012-02-02 | 2015-07-08 | パナソニックIpマネジメント株式会社 | 下受けピンの配置方法および下受けピンの返戻方法 |
WO2014045370A1 (ja) | 2012-09-20 | 2014-03-27 | 富士機械製造株式会社 | 対基板作業機、および装着方法 |
-
2015
- 2015-04-27 JP JP2017515305A patent/JP6518323B2/ja active Active
- 2015-04-27 WO PCT/JP2015/062703 patent/WO2016174715A1/ja active Application Filing
- 2015-04-27 CN CN201580079088.3A patent/CN107535054B/zh active Active
- 2015-04-27 EP EP15890699.0A patent/EP3291658B1/en active Active
- 2015-04-27 US US15/569,107 patent/US10470350B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20180116080A1 (en) | 2018-04-26 |
EP3291658A1 (en) | 2018-03-07 |
US10470350B2 (en) | 2019-11-05 |
EP3291658A4 (en) | 2018-05-02 |
CN107535054B (zh) | 2019-10-08 |
WO2016174715A1 (ja) | 2016-11-03 |
JPWO2016174715A1 (ja) | 2018-02-15 |
EP3291658B1 (en) | 2021-01-13 |
CN107535054A (zh) | 2018-01-02 |
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