JP6500565B2 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
- Publication number
- JP6500565B2 JP6500565B2 JP2015075002A JP2015075002A JP6500565B2 JP 6500565 B2 JP6500565 B2 JP 6500565B2 JP 2015075002 A JP2015075002 A JP 2015075002A JP 2015075002 A JP2015075002 A JP 2015075002A JP 6500565 B2 JP6500565 B2 JP 6500565B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- outer peripheral
- metal
- laminated substrate
- semiconductor module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 79
- 229910052751 metal Inorganic materials 0.000 claims description 133
- 239000002184 metal Substances 0.000 claims description 133
- 239000000758 substrate Substances 0.000 claims description 131
- 230000002093 peripheral effect Effects 0.000 claims description 98
- 239000010410 layer Substances 0.000 description 53
- 230000005684 electric field Effects 0.000 description 49
- 238000010586 diagram Methods 0.000 description 20
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
[先行技術文献]
[特許文献]
[特許文献1] 特開2002−270730号公報
Claims (8)
- 絶縁板と、前記絶縁板の第1の面に設けられた回路板と、前記第1の面とは反対側にある第2の面に設けられた金属板とを有する、積層基板と、
前記積層基板に対向して設けられ、金属層を有する配線基板と
を備え、
前記絶縁板は、前記回路板の外周側端部よりも外周側に延出して設けられ、
前記金属層は、前記回路板の前記外周側端部と重なる領域を有し、且つ、前記回路板の前記外周側端部よりも外周側に延出して設けられ、
前記配線基板は、前記金属層から前記積層基板の方向に突出する少なくとも1つの金属突起をさらに備え、
前記金属突起は、少なくとも一部が前記回路板の外周側端部よりも外周側に位置している
半導体モジュール。 - 前記金属層は、前記回路板の前記外周側端部よりも外周側に延出する長さが2mm以下である
請求項1に記載の半導体モジュール。 - 前記金属突起は、前記回路板の端部と重なる領域を有する
請求項1または2に記載の半導体モジュール。 - 互いに分離された複数の前記回路板を有し、
前記金属突起は、少なくとも一部が前記回路板の内周側端部よりも内周側に位置している
請求項1から3のいずれか一項に記載の半導体モジュール。 - 印加される電圧がそれぞれ異なる、互いに分離された複数の前記回路板を有し、
複数の前記回路板のうち、より高い電圧が印加される前記回路板に対向して配置された前記金属層に、前記金属突起が設けられている
請求項1から4のいずれか一項に記載の半導体モジュール。 - 印加される電圧がそれぞれ異なる、互いに分離された複数の前記回路板を有し、
前記金属板には、複数の前記回路板のそれぞれの内周側端部と対向する領域に開口が形成されている
請求項1から5のいずれか一項に記載の半導体モジュール。 - 前記金属板は、複数の前記回路板に対応して、複数配置されている
請求項6に記載の半導体モジュール。 - 前記絶縁板は、分離または開口されず連続して設けられた平板状である
請求項6または7に記載の半導体モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015075002A JP6500565B2 (ja) | 2015-04-01 | 2015-04-01 | 半導体モジュール |
DE102016202716.6A DE102016202716A1 (de) | 2015-04-01 | 2016-02-23 | Halbleitermodul |
US15/059,310 US9622351B2 (en) | 2015-04-01 | 2016-03-03 | Semiconductor module |
CN201610126312.6A CN106057744B (zh) | 2015-04-01 | 2016-03-07 | 半导体模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015075002A JP6500565B2 (ja) | 2015-04-01 | 2015-04-01 | 半導体モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016195206A JP2016195206A (ja) | 2016-11-17 |
JP6500565B2 true JP6500565B2 (ja) | 2019-04-17 |
Family
ID=56937160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015075002A Active JP6500565B2 (ja) | 2015-04-01 | 2015-04-01 | 半導体モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US9622351B2 (ja) |
JP (1) | JP6500565B2 (ja) |
CN (1) | CN106057744B (ja) |
DE (1) | DE102016202716A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7001186B1 (ja) | 2021-03-18 | 2022-01-19 | 富士電機株式会社 | 半導体装置、半導体モジュール、車両、および、半導体装置の製造方法 |
DE102021115845A1 (de) | 2021-06-18 | 2022-12-22 | Rolls-Royce Deutschland Ltd & Co Kg | Leiterplattenanordnung |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS509993B1 (ja) * | 1970-12-23 | 1975-04-17 | ||
US5130768A (en) * | 1990-12-07 | 1992-07-14 | Digital Equipment Corporation | Compact, high-density packaging apparatus for high performance semiconductor devices |
US5296735A (en) * | 1991-01-21 | 1994-03-22 | Mitsubishi Denki Kabushiki Kaisha | Power semiconductor module with multiple shielding layers |
JP3199058B2 (ja) * | 1991-10-14 | 2001-08-13 | 富士電機株式会社 | 半導体装置 |
JP2772184B2 (ja) * | 1991-11-07 | 1998-07-02 | 株式会社東芝 | 半導体装置 |
JPH09283699A (ja) * | 1996-04-09 | 1997-10-31 | Fuji Electric Co Ltd | 半導体装置 |
JP3849381B2 (ja) * | 1999-12-20 | 2006-11-22 | 株式会社日立製作所 | 絶縁回路基板の製造方法 |
DE10158185B4 (de) * | 2000-12-20 | 2005-08-11 | Semikron Elektronik Gmbh | Leistungshalbleitermodul mit hoher Isolationsfestigkeit |
JP2003086763A (ja) * | 2001-09-12 | 2003-03-20 | Toshiba Corp | 半導体パワーモジュール及び電力変換器 |
JP3852698B2 (ja) | 2003-04-10 | 2006-12-06 | 富士電機デバイステクノロジー株式会社 | 半導体装置の製造方法 |
US7106600B2 (en) * | 2004-04-29 | 2006-09-12 | Newisys, Inc. | Interposer device |
JP5241177B2 (ja) | 2007-09-05 | 2013-07-17 | 株式会社オクテック | 半導体装置及び半導体装置の製造方法 |
WO2011077679A1 (ja) * | 2009-12-24 | 2011-06-30 | 住友ベークライト株式会社 | 導電接続材料、電子部品の製造方法、導電接続材料付き電子部材および電子部品 |
JP5328827B2 (ja) | 2010-05-28 | 2013-10-30 | 三菱電機株式会社 | パワーモジュール構造、その構造を有するパワーモジュール、およびその構造の製造方法 |
JP5644440B2 (ja) * | 2010-12-03 | 2014-12-24 | 富士電機株式会社 | パワー半導体モジュール |
JP2012234857A (ja) | 2011-04-28 | 2012-11-29 | Denki Kagaku Kogyo Kk | セラミックス回路基板及びそれを用いたモジュール |
WO2013118415A1 (ja) * | 2012-02-09 | 2013-08-15 | 富士電機株式会社 | 半導体装置 |
EP2908338A4 (en) | 2012-10-15 | 2016-07-13 | Fuji Electric Co Ltd | SEMICONDUCTOR COMPONENT |
-
2015
- 2015-04-01 JP JP2015075002A patent/JP6500565B2/ja active Active
-
2016
- 2016-02-23 DE DE102016202716.6A patent/DE102016202716A1/de active Pending
- 2016-03-03 US US15/059,310 patent/US9622351B2/en active Active
- 2016-03-07 CN CN201610126312.6A patent/CN106057744B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
DE102016202716A1 (de) | 2016-10-06 |
CN106057744A (zh) | 2016-10-26 |
US20160295701A1 (en) | 2016-10-06 |
JP2016195206A (ja) | 2016-11-17 |
CN106057744B (zh) | 2020-05-15 |
US9622351B2 (en) | 2017-04-11 |
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