JP6323013B2 - 樹脂接合体および樹脂部材の接合方法 - Google Patents
樹脂接合体および樹脂部材の接合方法 Download PDFInfo
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- JP6323013B2 JP6323013B2 JP2014003711A JP2014003711A JP6323013B2 JP 6323013 B2 JP6323013 B2 JP 6323013B2 JP 2014003711 A JP2014003711 A JP 2014003711A JP 2014003711 A JP2014003711 A JP 2014003711A JP 6323013 B2 JP6323013 B2 JP 6323013B2
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- Prior art keywords
- resin member
- resin
- hole
- light
- main body
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- 238000003466 welding Methods 0.000 claims description 59
- 230000005540 biological transmission Effects 0.000 claims description 44
- 238000005304 joining Methods 0.000 claims description 41
- 238000002834 transmittance Methods 0.000 claims description 35
- 239000000654 additive Substances 0.000 claims description 22
- 230000000996 additive effect Effects 0.000 claims description 21
- 238000002844 melting Methods 0.000 claims description 20
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- 238000000465 moulding Methods 0.000 claims description 11
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- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
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Images
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Landscapes
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
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- Optics & Photonics (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
Description
図1〜図3を参照して、本発明の第1実施形態による樹脂接合体1が用いられるプロジェクタ100の構成について説明する。なお、プロジェクタ100は、本発明の「所定の電気機器」の一例である。
次に、図6〜図8を参照して、第2実施形態について説明する。この第2実施形態では、平面視において円状の孔部21に円柱状の光透過部材30を配置した上記第1実施形態と異なり、平面視において枠状の孔部221に枠状の光透過部材230を配置する例について説明する。また、上記第1実施形態と同一の構成については、同じ符号を付してその説明を省略する。なお、光透過部材230は、発明の「第3樹脂部材」の一例である。
次に、図9〜図11を参照して、第3実施形態について説明する。この第3実施形態では、上記第1実施形態の構成に加えて、さらに、光透過部材330に板ばね部335を設けた例について説明する。また、上記第1実施形態と同一の構成については、同じ符号を付してその説明を省略する。なお、光透過部材330は、本発明の「第3樹脂部材」の一例である。
次に、図12〜図14を参照して、第4実施形態について説明する。この第4実施形態では、上記第1実施形態の構成に加えて、さらに、孔部421および光透過部材430をテーパ形状に形成した設けた例について説明する。また、上記第1実施形態と同一の構成については、同じ符号を付してその説明を省略する。なお、光透過部材430は、本発明の「第3樹脂部材」の一例である。
次に、図15および図16を参照して、第5実施形態について説明する。この第5実施形態では、上記第1実施形態のレーザ固定部20を貫通する孔部21に代えて、レーザ固定部520を貫通しない凹部521を設けた例について説明する。また、上記第1実施形態と同一の構成については、同じ符号を付してその説明を省略する。なお、レーザ固定部520は、本発明の「第2樹脂部材」の一例である。
次に、図17〜図19を参照して、第6実施形態について説明する。この第6実施形態では、光透過部材30(230、330、430)が溶着される上記第1〜第5実施形態とは異なり、光透過部材630が溶着されない例について説明する。また、上記第1実施形態と同一の構成については、同じ符号を付してその説明を省略する。
10、210 本体部(第1樹脂部材)
20、420、520 レーザ固定部(第2樹脂部材)
21、221、421 孔部
30、230、330、430 光透過部材(第3樹脂部材)
100 プロジェクタ(所定の電気機器)
220 蓋部(第2樹脂部材)
335 板ばね部
521 凹部
630 光透過部材
W 溶着領域
Claims (11)
- 熱可塑性樹脂材から構成される第1樹脂部材と、
孔部または凹部を含み、前記第1樹脂部材に積層された状態で前記孔部または前記凹部の外側における、前記第1樹脂部材の表面との接合面に沿って延びる溶着領域において前記第1樹脂部材と溶着され、熱可塑性樹脂材から構成される第2樹脂部材と、
前記第2樹脂部材の前記孔部または前記凹部に配置された状態で、前記第1樹脂部材の表面および前記第2樹脂部材の表面との接合面に沿って延びる溶着領域において前記第1樹脂部材および前記第2樹脂部材と溶着され、前記第1樹脂部材および前記第2樹脂部材よりも光透過性が相対的に高い熱可塑性樹脂材から構成される第3樹脂部材とを備え、前記第1樹脂部材および前記第2樹脂部材は、前記第3樹脂部材よりも光透過性が相対的に低い、樹脂接合体。 - 前記第1樹脂部材および前記第2樹脂部材の熱可塑性樹脂材は、導電性を有する添加材が添加されることにより、前記第3樹脂部材よりも光透過性が相対的に低くなるように構成されており、
前記第1樹脂部材および前記第2樹脂部材は、所定の電気機器の導電性を要する部分に配置されている、請求項1に記載の樹脂接合体。 - 前記第2樹脂部材の前記溶着領域には、前記第2樹脂部材を厚み方向に貫通する前記孔部が形成されており、
前記第2樹脂部材と前記第2樹脂部材の前記孔部に配置された前記第3樹脂部材とは、二色成形により一体的に形成されている、請求項1または2に記載の樹脂接合体。 - 前記孔部は枠状に形成されており、
前記第3樹脂部材は、枠状の前記孔部に対応するように枠状に形成されている、請求項3に記載の樹脂接合体。 - 前記第2樹脂部材の前記溶着領域には、前記第2樹脂部材を厚み方向に貫通する前記孔部が形成されており、
前記第3樹脂部材は、前記第1樹脂部材と前記第2樹脂部材との溶着時に、前記孔部に配置された状態で前記第2樹脂部材の前記第1樹脂部材と反対側の面を押圧するための板ばね部を有する、請求項1または2に記載の樹脂接合体。 - 前記第2樹脂部材の前記溶着領域には、前記第2樹脂部材を厚み方向に貫通する前記孔部が形成されており、
前記孔部は、前記第1樹脂部材側に向かって径が小さくなるテーパ形状に形成されており、
前記第3樹脂部材は、テーパ形状の前記孔部に対応するようにテーパ形状に形成されている、請求項1または2に記載の樹脂接合体。 - 前記第1樹脂部材、前記第2樹脂部材および前記第3樹脂部材の熱可塑性樹脂材は、共に同一の熱可塑性樹脂を含んでいる、請求項1〜6のいずれか1項に記載の樹脂接合体。
- 光透過部材よりも相対的に光透過性が低い熱可塑性樹脂材から構成される第1樹脂部材と前記光透過部材よりも相対的に光透過性が低い熱可塑性樹脂材から構成される第2樹脂部材とを準備する工程と、
前記第2樹脂部材に孔部または凹部を形成する工程と、
前記第1樹脂部材と前記第2樹脂部材とを積層する工程と、
前記第1樹脂部材および前記第2樹脂部材よりも光透過性が相対的に高い前記光透過部材を前記孔部または前記凹部に配置する工程と、
前記光透過部材を介して光を前記第1樹脂部材側に照射することにより前記孔部または前記凹部の外側における、前記第1樹脂部材の表面と前記第2樹脂部材の表面との接合面に沿って延びる溶着領域における熱可塑性樹脂材を溶融させることによって、前記第1樹脂部材と前記第2樹脂部材とを溶着する工程とを備える、樹脂部材の接合方法。 - 前記第1樹脂部材と前記第2樹脂部材とを準備する工程は、導電性を有する添加材が添加されることにより、前記光透過部材よりも光透過性が低くされた熱可塑性樹脂材から構成され、所定の電気機器の導電性を要する部分に配置される前記第1樹脂部材および前記第2樹脂部材を準備する工程を含む、請求項8に記載の樹脂部材の接合方法。
- 前記光透過部材を配置する工程は、前記第1樹脂部材および前記第2樹脂部材よりも光透過性が相対的に高い熱可塑性樹脂材から構成される前記光透過部材としての第3樹脂部材を前記孔部または前記凹部に配置する工程を含み、
前記第1樹脂部材と前記第2樹脂部材とを溶着する工程は、前記第1樹脂部材と前記第2樹脂部材とを溶着することに加えて、前記第1樹脂部材と前記第3樹脂部材とを溶着するとともに、前記第2樹脂部材と前記第3樹脂部材とを溶着する工程を含む、請求項8または9に記載の樹脂部材の接合方法。 - 前記光透過部材を配置する工程は、熱可塑性を有さずに熱伝導性を有する前記光透過部材を前記孔部または前記凹部に配置する工程を含み、
前記第1樹脂部材と前記第2樹脂部材とを溶着する工程の後に、前記光透過部材を前記孔部または前記凹部から取り外す工程をさらに備える、請求項8または9に記載の樹脂部材の接合方法。
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