JP6303998B2 - アバランシェフォトダイオードの製造方法 - Google Patents
アバランシェフォトダイオードの製造方法 Download PDFInfo
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- JP6303998B2 JP6303998B2 JP2014242042A JP2014242042A JP6303998B2 JP 6303998 B2 JP6303998 B2 JP 6303998B2 JP 2014242042 A JP2014242042 A JP 2014242042A JP 2014242042 A JP2014242042 A JP 2014242042A JP 6303998 B2 JP6303998 B2 JP 6303998B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 32
- 229910052799 carbon Inorganic materials 0.000 claims description 32
- 238000000137 annealing Methods 0.000 claims description 30
- 230000031700 light absorption Effects 0.000 claims description 24
- 229910052739 hydrogen Inorganic materials 0.000 claims description 22
- 239000001257 hydrogen Substances 0.000 claims description 22
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 6
- 239000002019 doping agent Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 104
- 230000005684 electric field Effects 0.000 description 34
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 27
- 230000004913 activation Effects 0.000 description 20
- 239000013078 crystal Substances 0.000 description 10
- 230000000630 rising effect Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003685 thermal hair damage Effects 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/184—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
- H01L31/1844—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising ternary or quaternary compounds, e.g. Ga Al As, In Ga As P
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/107—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/107—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes
- H01L31/1075—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes in which the active layers, e.g. absorption or multiplication layers, form an heterostructure, e.g. SAM structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
- Recrystallisation Techniques (AREA)
Description
Claims (3)
- 基板上に、p型ドーパントとして炭素が添加され、組成としてAlを含むp型電界緩和層を形成する工程と、
前記p型電界緩和層上にキャップ層を形成する工程と、
前記キャップ層上に光吸収層を形成する工程とを備え、
前記キャップ層の成長温度から前記光吸収層の成長温度までの昇温工程を、V族原料を導入せずに不活性ガス雰囲気で行うことを特徴とするアバランシェフォトダイオードの製造方法。 - 前記昇温工程の後の前記p型電界緩和層中に含まれる炭素に対する水素の比が0.10〜0.13であることを特徴とする請求項1に記載のアバランシェフォトダイオードの製造方法。
- 前記昇温工程で前記光吸収層の成長温度まで昇温した後はアニールを実施せず、前記光吸収層の成長を開始することを特徴とする請求項1又は2に記載のアバランシェフォトダイオードの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014242042A JP6303998B2 (ja) | 2014-11-28 | 2014-11-28 | アバランシェフォトダイオードの製造方法 |
US14/830,447 US9520526B2 (en) | 2014-11-28 | 2015-08-19 | Manufacturing method of avalanche photodiode |
CN201510848856.9A CN105655436B (zh) | 2014-11-28 | 2015-11-27 | 雪崩光电二极管的制造方法 |
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JP2014242042A JP6303998B2 (ja) | 2014-11-28 | 2014-11-28 | アバランシェフォトダイオードの製造方法 |
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JP2016103599A JP2016103599A (ja) | 2016-06-02 |
JP6303998B2 true JP6303998B2 (ja) | 2018-04-04 |
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US (1) | US9520526B2 (ja) |
JP (1) | JP6303998B2 (ja) |
CN (1) | CN105655436B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018156516A1 (en) * | 2017-02-21 | 2018-08-30 | Newport Corporation | High responsivity high bandwidth photodiode and method of manufacture |
CN109524423A (zh) * | 2018-09-29 | 2019-03-26 | 中国科学院半导体研究所 | 可伪装可形变的智能可见光至近红外探测器及其制备方法 |
CN110518085B (zh) * | 2019-05-05 | 2021-05-11 | 中国科学院苏州纳米技术与纳米仿生研究所 | 锑化物超晶格雪崩光电二极管及其制备方法 |
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JP3156909B2 (ja) * | 1995-07-03 | 2001-04-16 | 日本電信電話株式会社 | 半導体積層構造の気相成長方法 |
JP2000068284A (ja) | 1998-08-19 | 2000-03-03 | Sharp Corp | ヘテロ接合バイポーラトランジスタの製造方法及びパワーアンプ |
WO2002021599A2 (en) * | 2000-09-08 | 2002-03-14 | Showa Denko K.K. | Compound semiconductor multilayer structure and bipolar transistor using the same |
JP2002093818A (ja) | 2000-09-20 | 2002-03-29 | Sumitomo Chem Co Ltd | pn接合を有する薄膜結晶ウェーハとその製造方法 |
US6653166B2 (en) * | 2001-05-09 | 2003-11-25 | Nsc-Nanosemiconductor Gmbh | Semiconductor device and method of making same |
JP2005516414A (ja) * | 2002-02-01 | 2005-06-02 | ピコメトリックス インコーポレイテッド | 充電制御アバランシェ・フォトダイオードおよびその製造方法 |
WO2006080153A1 (ja) * | 2005-01-28 | 2006-08-03 | Nec Corporation | 半導体受光素子及びその製造方法 |
US8269223B2 (en) * | 2010-05-27 | 2012-09-18 | The United States Of America As Represented By The Secretary Of The Army | Polarization enhanced avalanche photodetector and method thereof |
JP2013236012A (ja) * | 2012-05-10 | 2013-11-21 | Mitsubishi Electric Corp | アバランシェフォトダイオード及びその製造方法 |
JP6142877B2 (ja) * | 2012-09-25 | 2017-06-07 | 富士電機株式会社 | 半導体積層基板および半導体素子 |
JP6036197B2 (ja) * | 2012-11-13 | 2016-11-30 | 三菱電機株式会社 | アバランシェフォトダイオードの製造方法 |
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2014
- 2014-11-28 JP JP2014242042A patent/JP6303998B2/ja active Active
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2015
- 2015-08-19 US US14/830,447 patent/US9520526B2/en active Active
- 2015-11-27 CN CN201510848856.9A patent/CN105655436B/zh active Active
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Publication number | Publication date |
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US9520526B2 (en) | 2016-12-13 |
CN105655436B (zh) | 2017-07-11 |
JP2016103599A (ja) | 2016-06-02 |
US20160155888A1 (en) | 2016-06-02 |
CN105655436A (zh) | 2016-06-08 |
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