JP6303522B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6303522B2 JP6303522B2 JP2014006582A JP2014006582A JP6303522B2 JP 6303522 B2 JP6303522 B2 JP 6303522B2 JP 2014006582 A JP2014006582 A JP 2014006582A JP 2014006582 A JP2014006582 A JP 2014006582A JP 6303522 B2 JP6303522 B2 JP 6303522B2
- Authority
- JP
- Japan
- Prior art keywords
- external terminal
- circuit board
- terminal connection
- connection portion
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/515—Terminal blocks providing connections to wires or cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
- H01R13/6315—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only allowing relative movement between coupling parts, e.g. floating connection
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inverter Devices (AREA)
- Rectifiers (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Claims (5)
- 主回路を構成する複数の半導体素子が搭載される第1回路基板と、
前記第1回路基板の上方に近接配置されると共に、複数の電子部品が搭載される第2回路基板と、
前記第1回路基板に接続固定される複数の接続端子と、
前記第1回路基板及び前記第2回路基板を覆うケースとを備え、
前記接続端子は、外部端子が接続される上端面を有すると共に、当該上端面から前記第2回路基板の上方まで延びる外部端子接続部と、前記外部端子接続部に対して偏心するように設けられると共に、前記第2回路基板に設けられた貫通孔を介して前記第1回路基板に接続固定される基板固定部とを有し、
前記ケースには、前記外部端子接続部の前記上端面を露出させると共に前記外部端子接続部の上端部を位置決めするための穴部が設けられており、
前記外部端子接続部の上部には、前記ケースをシールするためのシール部材を装着するシール装着部が設けられており、
前記複数の接続端子の少なくとも1つは、前記外部端子接続部における前記第2回路基板上の前記複数の電子部品と対向する側に、前記上端面よりも外形寸法の小さい寸法絞り部を有し、
前記寸法絞り部は、前記シール装着部から前記外部端子接続部の下端までの領域に形成されており、
前記複数の電子部品の少なくとも1つは、前記シール装着部の外縁よりも前記外部端子接続部の中心側に位置することで、前記外部端子接続部の上端面が当該電子部品の一部と重なり合うように前記外部端子接続部に対して配置されていることを特徴とする半導体装置。 - 前記接続端子は、前記第2回路基板に固定ブラケットを介して固定されており、
前記外部端子接続部の下部には、前記固定ブラケットに対する載置面を形成する段状の切欠部が形成されており、
前記切欠部が前記固定ブラケットに載っていることを特徴とする請求項1記載の半導体装置。 - 前記外部端子接続部における前記寸法絞り部の反対側の領域には、前記基板固定部側に突出した端子肉厚部が設けられていることを特徴とする請求項1又は2記載の半導体装置。
- 前記外部端子接続部の前記上端面の縁部は、複数の直線領域を有し、
前記穴部は、前記上端面の形状に対応する形状をなしていることを特徴とする請求項1〜3の何れか一項記載の半導体装置。 - 前記上端面は、略多角形状をなしており、
前記穴部は、略多角形状をなしていることを特徴とする請求項4記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014006582A JP6303522B2 (ja) | 2014-01-17 | 2014-01-17 | 半導体装置 |
EP15150596.3A EP2897274B1 (en) | 2014-01-17 | 2015-01-09 | Semiconductor device |
CN201510020496.3A CN104796008B (zh) | 2014-01-17 | 2015-01-15 | 半导体装置 |
US14/597,752 US9756729B2 (en) | 2014-01-17 | 2015-01-15 | Semiconductor device having a first circuit board mounted with a plurality of semiconductor elements and a second circuit board mounted with a plurality of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014006582A JP6303522B2 (ja) | 2014-01-17 | 2014-01-17 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015135891A JP2015135891A (ja) | 2015-07-27 |
JP6303522B2 true JP6303522B2 (ja) | 2018-04-04 |
Family
ID=52278527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014006582A Active JP6303522B2 (ja) | 2014-01-17 | 2014-01-17 | 半導体装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9756729B2 (ja) |
EP (1) | EP2897274B1 (ja) |
JP (1) | JP6303522B2 (ja) |
CN (1) | CN104796008B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG2013069224A (en) * | 2013-09-13 | 2015-04-29 | Rockwell Automation Asia Pacific Business Ctr Pte Ltd | Motor drive with inherent power isolation |
JP6310791B2 (ja) * | 2014-06-25 | 2018-04-11 | 矢崎総業株式会社 | スイッチボックス |
WO2016117014A1 (ja) * | 2015-01-19 | 2016-07-28 | 三菱電機株式会社 | コントローラ |
JP6384378B2 (ja) * | 2015-03-25 | 2018-09-05 | オムロンヘルスケア株式会社 | 超音波式ネブライザ |
US10381833B2 (en) * | 2017-06-27 | 2019-08-13 | Ge Aviation Systems Llc | Solid state power contactor |
DE102019133377B4 (de) * | 2019-12-06 | 2023-08-31 | Sma Solar Technology Ag | Wechselrichter mit kompakter bauform |
EP3944477A1 (en) * | 2020-07-22 | 2022-01-26 | Mahle International GmbH | Inverter and electric motor having such an inverter |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3130239B2 (ja) * | 1995-08-02 | 2001-01-31 | 松下電子工業株式会社 | 樹脂封止型半導体装置およびその製造方法 |
US5603639A (en) * | 1995-08-30 | 1997-02-18 | Genrife Company Limited | Shielded electrical connector |
WO2002082542A1 (fr) * | 2001-04-02 | 2002-10-17 | Mitsubishi Denki Kabushiki Kaisha | Dispositif de puissance à semi-conducteurs |
SE528460C2 (sv) * | 2004-12-27 | 2006-11-14 | Danaher Motion Stockholm Ab | Kraftterminal för elektrisk anslutning av en elektrisk kabel till ett kretskort samt enhet innefattande ett hölje och ett kretskort |
US7056132B1 (en) * | 2004-12-28 | 2006-06-06 | Danaher Motion Stockholm Ab | Power terminal and a unit comprising such power terminal |
JP4582002B2 (ja) * | 2006-01-10 | 2010-11-17 | 株式会社デンソー | 電子装置 |
US8208270B2 (en) * | 2006-04-27 | 2012-06-26 | Panasonic Corporation | Substrate joining member and three-dimensional structure using the same |
JP4946488B2 (ja) * | 2007-02-15 | 2012-06-06 | パナソニック株式会社 | 回路モジュール |
EP2725610B1 (en) * | 2011-09-28 | 2020-06-03 | Fuji Electric Co., Ltd. | Semiconductor device and method for producing semiconductor device |
JP5953790B2 (ja) * | 2011-10-12 | 2016-07-20 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
JP3173512U (ja) * | 2011-11-25 | 2012-02-09 | 株式会社豊田自動織機 | 半導体装置 |
-
2014
- 2014-01-17 JP JP2014006582A patent/JP6303522B2/ja active Active
-
2015
- 2015-01-09 EP EP15150596.3A patent/EP2897274B1/en active Active
- 2015-01-15 CN CN201510020496.3A patent/CN104796008B/zh active Active
- 2015-01-15 US US14/597,752 patent/US9756729B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015135891A (ja) | 2015-07-27 |
US9756729B2 (en) | 2017-09-05 |
EP2897274B1 (en) | 2019-02-27 |
CN104796008A (zh) | 2015-07-22 |
EP2897274A2 (en) | 2015-07-22 |
EP2897274A3 (en) | 2016-03-16 |
CN104796008B (zh) | 2018-01-09 |
US20150208524A1 (en) | 2015-07-23 |
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