JP6302732B2 - 切削方法 - Google Patents
切削方法 Download PDFInfo
- Publication number
- JP6302732B2 JP6302732B2 JP2014088236A JP2014088236A JP6302732B2 JP 6302732 B2 JP6302732 B2 JP 6302732B2 JP 2014088236 A JP2014088236 A JP 2014088236A JP 2014088236 A JP2014088236 A JP 2014088236A JP 6302732 B2 JP6302732 B2 JP 6302732B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- workpiece
- spindle
- current value
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims description 175
- 238000000034 method Methods 0.000 title claims description 15
- 238000012545 processing Methods 0.000 claims description 27
- 238000001514 detection method Methods 0.000 claims description 11
- 238000003754 machining Methods 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000006866 deterioration Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 5
- 239000006061 abrasive grain Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Description
3 チャックテーブル
4 切削手段
9 制御手段
41 切削ブレード
42 スピンドル
44 モータ
47 電力供給源
48 負荷電流値検出手段
W 被加工物
Claims (1)
- 回転可能に支持されたスピンドルと、該スピンドルを回転駆動するモータと、該スピンドルの先端部に装着された切削ブレードとを有する切削手段で、被加工物に切削加工を施す切削方法であって、
被加工物をチャックテーブルで保持する保持ステップと、
該保持ステップを実施した後、該チャックテーブルに保持された被加工物に対して該切削ブレードを回転させつつ所定切り込み位置に位置付け、該チャックテーブルと該切削ブレードとを相対的に所定速度で切削送りさせて被加工物に切削加工を施す加工ステップと、
該加工ステップを実施中に、該スピンドルの該モータの負荷電流値を検出する検出ステップと、を備え、
該加工ステップでは、該モータの負荷電流値が所定の閾値を超えた時点で、切削加工中に該所定速度よりも低速な速度に落とし、該低速な速度から該所定速度まで段階的に上昇させて被加工物を切削するプリカットを遂行するプリカットステップを途中で介在させること、を特徴とする切削方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014088236A JP6302732B2 (ja) | 2014-04-22 | 2014-04-22 | 切削方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014088236A JP6302732B2 (ja) | 2014-04-22 | 2014-04-22 | 切削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015205372A JP2015205372A (ja) | 2015-11-19 |
JP6302732B2 true JP6302732B2 (ja) | 2018-03-28 |
Family
ID=54602666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014088236A Active JP6302732B2 (ja) | 2014-04-22 | 2014-04-22 | 切削方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6302732B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6699930B2 (ja) * | 2016-04-07 | 2020-05-27 | 株式会社ディスコ | 切削装置 |
JP6666789B2 (ja) * | 2016-05-18 | 2020-03-18 | 株式会社ディスコ | 切削方法 |
JP6815770B2 (ja) * | 2016-07-13 | 2021-01-20 | 株式会社ディスコ | 切削装置 |
CN106514014B (zh) * | 2017-01-17 | 2018-06-15 | 京东方科技集团股份有限公司 | 一种基板的激光修复方法及其激光修复*** |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61117651U (ja) * | 1984-12-28 | 1986-07-24 | ||
JP2628256B2 (ja) * | 1992-05-15 | 1997-07-09 | 株式会社ディスコ | カーフチェックに基づく自動ダイシングシステム |
JP2894906B2 (ja) * | 1992-11-30 | 1999-05-24 | 株式会社東京精密 | ダイシング装置及びダイシング装置における切削制御方法 |
JPH07241841A (ja) * | 1994-01-13 | 1995-09-19 | Seiko Seiki Co Ltd | ダイシング装置及びダイシング方法 |
US6033288A (en) * | 1998-10-29 | 2000-03-07 | Kulicke & Soffa Investments, Inc. | Monitoring system for dicing saws |
-
2014
- 2014-04-22 JP JP2014088236A patent/JP6302732B2/ja active Active
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Publication number | Publication date |
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JP2015205372A (ja) | 2015-11-19 |
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