JP6270336B2 - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
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- JP6270336B2 JP6270336B2 JP2013094285A JP2013094285A JP6270336B2 JP 6270336 B2 JP6270336 B2 JP 6270336B2 JP 2013094285 A JP2013094285 A JP 2013094285A JP 2013094285 A JP2013094285 A JP 2013094285A JP 6270336 B2 JP6270336 B2 JP 6270336B2
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- 238000003384 imaging method Methods 0.000 title claims description 100
- 239000000463 material Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 28
- 239000006059 cover glass Substances 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- -1 polysiloxane Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910020177 SiOF Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Computer Hardware Design (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
Description
図1〜図3に示すように、第1実施形態の撮像装置1は、撮像素子チップ30と、カバーガラス10と、撮像素子チップ30が収納されたシールドケース40と、撮像素子チップ30の側面とシールドケース40の内壁との隙間を充填している封止樹脂50と、を具備する。
次に、第3実施形態の撮像装置1Bについて説明する。撮像装置1Bは撮像装置1、1Aと類似しているので同じ構成要素には同じ符号を付し説明は省略する。
Claims (4)
- 撮像部と、前記撮像部と信号を送受信する、比誘電率が酸化シリコンより低い低誘電率材料からなる絶縁層を含む複数の層を有する回路部とが第1の主面に形成され、貫通配線を介して前記回路部と接続された接合端子が第2の主面に形成されている撮像素子チップと、
前記撮像素子チップの前記第1の主面に接着された、前記撮像素子チップと平面視寸法が同じカバーガラスと、
前記撮像素子チップが収納された、内壁の角部の断面形状が曲線からなるシールドケースと、
前記撮像素子チップの側面と前記シールドケースとの隙間を充填している、前記シールドケースの前記内壁の前記角部以外の厚さが100μm以下の封止樹脂と、を具備し、
前記シールドケースの前記内壁の前記角部と対向する前記撮像素子チップの前記側面の角部が、面取り加工されており、
前記封止樹脂の厚さは、前記シールドケースの前記内壁の前記角部以外に充填される厚さが、前記シールドケースの前記内壁の前記角部に充填される厚さよりも小さいことを特徴とする撮像装置。 - 前記撮像素子チップは、面取り加工部の断面形状が曲線または直線の略矩形であることを特徴とする請求項1に記載の撮像装置。
- 前記撮像素子チップの面取り加工部の断面形状が曲線の略矩形であり、
前記シールドケースの前記内壁の前記角部の断面形状の前記曲線の曲率半径が、340μm以下であることを特徴とする請求項1に記載の撮像装置。 - 前記カバーガラスの前方に配設された対物レンズ光学系を具備し、
前記シールドケースが、前記対物レンズ光学系のレンズ枠と一体であることを特徴とする請求項2又は請求項3に記載の撮像装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094285A JP6270336B2 (ja) | 2013-04-26 | 2013-04-26 | 撮像装置 |
PCT/JP2014/059257 WO2014174994A1 (ja) | 2013-04-26 | 2014-03-28 | 撮像装置 |
CN201480023339.1A CN105144385B (zh) | 2013-04-26 | 2014-03-28 | 摄像装置 |
EP14788797.0A EP2991111A4 (en) | 2013-04-26 | 2014-03-28 | Image pickup apparatus |
US14/918,843 US9520428B2 (en) | 2013-04-26 | 2015-10-21 | Image pickup apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094285A JP6270336B2 (ja) | 2013-04-26 | 2013-04-26 | 撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014216930A JP2014216930A (ja) | 2014-11-17 |
JP6270336B2 true JP6270336B2 (ja) | 2018-01-31 |
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JP2013094285A Active JP6270336B2 (ja) | 2013-04-26 | 2013-04-26 | 撮像装置 |
Country Status (1)
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JP (1) | JP6270336B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6406974B2 (ja) * | 2014-10-24 | 2018-10-17 | 理研香料ホールディングス株式会社 | 燃料用着臭剤 |
US10340306B1 (en) * | 2018-02-08 | 2019-07-02 | Semiconductor Components Industries, Llc | Semiconductor package with chamfered corners and related methods |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001094843A (ja) * | 1999-09-20 | 2001-04-06 | Olympus Optical Co Ltd | 撮像装置 |
JP2008130738A (ja) * | 2006-11-20 | 2008-06-05 | Fujifilm Corp | 固体撮像素子 |
JP5198150B2 (ja) * | 2008-05-29 | 2013-05-15 | 株式会社東芝 | 固体撮像装置 |
JP2011060933A (ja) * | 2009-09-09 | 2011-03-24 | Panasonic Corp | 固体撮像装置及びその製造方法 |
JP2012033894A (ja) * | 2010-06-30 | 2012-02-16 | Canon Inc | 固体撮像装置 |
JP2012033718A (ja) * | 2010-07-30 | 2012-02-16 | On Semiconductor Trading Ltd | 半導体装置及びその製造方法 |
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