JP6270070B2 - フレキシブル回路の接続装置 - Google Patents
フレキシブル回路の接続装置 Download PDFInfo
- Publication number
- JP6270070B2 JP6270070B2 JP2015518831A JP2015518831A JP6270070B2 JP 6270070 B2 JP6270070 B2 JP 6270070B2 JP 2015518831 A JP2015518831 A JP 2015518831A JP 2015518831 A JP2015518831 A JP 2015518831A JP 6270070 B2 JP6270070 B2 JP 6270070B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible circuit
- conductive line
- connection device
- base layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第一表面及び前記第一表面に対向する第二表面を有する基層と、
格子状構造を有し、前記第一表面及び/または前記第二表面上に設置されている導電性線路とを含む。
110 基層
111 第一表面
112 第二表面
113 導電性貫通孔
114 凹溝
1141 微小溝
115 突起
116 基板層
117 重合体層
120 導電性線路
130 接続ポート
131 第一の接続ポート
132 第二の接続ポート
133 第三の接続ポート
134 第四の接続ポート
Claims (8)
- フレキシブル回路の接続装置であって、
第一表面及び前記第一表面に対向する第二表面を有する基層と、
格子状構造を有し、前記第一表面及び/または前記第二表面上に設置されている導電性線路と、を含み、
前記基層は内方に向けて凹んだ凹溝を有し、
前記導電性線路は、前記凹溝の内部に充填された導電性材料で形成されており、
前記凹溝の底部は、2つの微小溝によって「W」字形又は波形を成すことを特徴とする、フレキシブル回路の接続装置。 - 前記凹溝の深さが1μm−6μmであり、幅が0.2μm−5μmの範囲であり、且つ前記凹溝の深さとその対応する幅との比が0.8より大きいことを特徴とする、請求項1に記載のフレキシブル回路の接続装置。
- 前記2つの微小溝の深さが0.5μm−1μmであることを特徴とする、請求項2に記載のフレキシブル回路の接続装置。
- 前記導電性線路が前記第一表面または前記第二表面上の一方に設置され、前記導電性線路とは別の導電性線路が前記第一表面または前記第二表面上の他方に貼着され、前記別の導電性線路は、前記基層の表面から突出する高さが6μm−15μmの範囲であり、幅が5μm−50μmの範囲であることを特徴とする、請求項1に記載のフレキシブル回路の接続装置。
- 前記第一表面及び前記第二表面が導電性貫通孔により接続されていることを特徴とする、請求項1に記載のフレキシブル回路の接続装置。
- 前記格子状構造が多角形格子であることを特徴とする、請求項1に記載のフレキシブル回路の接続装置。
- 前記基層がPET(ポリエチレンテレフタレート)、PC(ポリカーボネート)及びPMMA(ポリメチルメタクリレート)から選ばれるいずれか一種の透明材質で作製する透明基板層を含み、前記導電性線路が前記基板層上に設置されていることを特徴とする、請求項1に記載のフレキシブル回路の接続装置。
- 前記基層が前記基板層上に設置されている重合体層をさらに含み、前記導電性線路が前記重合体層上に設置され、前記重合体層の材質が紫外線硬化型接着剤であることを特徴とする、請求項7に記載のフレキシブル回路の接続装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310209697.9 | 2013-05-30 | ||
CN2013102096979A CN103338589A (zh) | 2013-05-30 | 2013-05-30 | 挠性电路连接器件 |
PCT/CN2013/079166 WO2014190590A1 (zh) | 2013-05-30 | 2013-07-10 | 挠性电路连接器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015520953A JP2015520953A (ja) | 2015-07-23 |
JP6270070B2 true JP6270070B2 (ja) | 2018-01-31 |
Family
ID=49246665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015518831A Active JP6270070B2 (ja) | 2013-05-30 | 2013-07-10 | フレキシブル回路の接続装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6270070B2 (ja) |
KR (1) | KR20150003082A (ja) |
CN (1) | CN103338589A (ja) |
TW (1) | TWI593326B (ja) |
WO (1) | WO2014190590A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105704934A (zh) * | 2016-01-28 | 2016-06-22 | 维京精密钢模(惠州)有限公司 | 一种利用3d打印技术制作pcb板的方法 |
CN109688708B (zh) * | 2018-05-23 | 2020-02-07 | 邑升顺电子(深圳)有限公司 | 一种柔性印刷电路板的制作方法 |
CN110267450A (zh) * | 2019-07-01 | 2019-09-20 | 江门市华浦照明有限公司 | 一种柔性线路板制作工艺及柔性线路板 |
CN113365418A (zh) * | 2021-05-31 | 2021-09-07 | 北京京东方技术开发有限公司 | 柔性电路板及其制造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07135385A (ja) * | 1993-11-09 | 1995-05-23 | Fujikura Ltd | Fpcの導体回路形成方法 |
JPH09298626A (ja) * | 1996-05-07 | 1997-11-18 | Fuji Photo Film Co Ltd | イメージセンサ用フレキシブルプリント配線基板 |
DE10000090A1 (de) * | 2000-01-04 | 2001-08-30 | Elfo Ag Sachseln Sachseln | Verfahren zum Herstellen einer mehrlagigen Planarspule |
JP2001320150A (ja) * | 2000-02-29 | 2001-11-16 | Mitsui Chemicals Inc | スタンパを使った配線基板の製造方法及び配線基板 |
JP3741603B2 (ja) * | 2000-11-17 | 2006-02-01 | 寛治 大塚 | 配線基板 |
JP2005136318A (ja) * | 2003-10-31 | 2005-05-26 | Shin Etsu Polymer Co Ltd | フレキシブル配線基板およびその製造方法 |
JP2005236006A (ja) * | 2004-02-19 | 2005-09-02 | Morimura Chemicals Ltd | 導電性回路装置およびその作製方法 |
JP2007088288A (ja) * | 2005-09-22 | 2007-04-05 | Sumitomo Electric Ind Ltd | 回路基板、その製造方法及び多層回路基板 |
CN101472454B (zh) * | 2007-12-28 | 2011-09-28 | 环旭电子股份有限公司 | 防止电磁干扰的电路板结构及方法 |
JP2011187718A (ja) * | 2010-03-09 | 2011-09-22 | Dainippon Printing Co Ltd | フレキシブルプリント配線板及びその製造方法 |
CN102033672A (zh) * | 2010-10-13 | 2011-04-27 | 深圳欧菲光科技股份有限公司 | 单层电极的电容式触摸屏 |
CN102479014B (zh) * | 2010-11-26 | 2016-02-17 | 群康科技(深圳)有限公司 | 应用柔性电路板的触摸设备 |
CN102131342B (zh) * | 2011-03-01 | 2012-07-18 | 昆山龙腾光电有限公司 | 印刷电路板及液晶显示装置 |
JP2013042090A (ja) * | 2011-08-19 | 2013-02-28 | Fujifilm Corp | 導電パターン、その形成方法、プリント配線板及びその製造方法 |
CN102903423B (zh) * | 2012-10-25 | 2015-05-13 | 南昌欧菲光科技有限公司 | 透明导电膜中的导电结构、透明导电膜及制作方法 |
CN102930922B (zh) * | 2012-10-25 | 2015-07-08 | 南昌欧菲光科技有限公司 | 一种具有各向异性导电的透明导电膜 |
CN202857136U (zh) * | 2012-11-05 | 2013-04-03 | 广东欧珀移动通信有限公司 | 柔性线路板铺铜结构 |
CN203313521U (zh) * | 2013-05-30 | 2013-11-27 | 南昌欧菲光科技有限公司 | 挠性电路连接器件 |
-
2013
- 2013-05-30 CN CN2013102096979A patent/CN103338589A/zh active Pending
- 2013-07-10 JP JP2015518831A patent/JP6270070B2/ja active Active
- 2013-07-10 WO PCT/CN2013/079166 patent/WO2014190590A1/zh active Application Filing
- 2013-07-10 KR KR20137025571A patent/KR20150003082A/ko not_active Application Discontinuation
- 2013-08-26 TW TW102130398A patent/TWI593326B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN103338589A (zh) | 2013-10-02 |
TWI593326B (zh) | 2017-07-21 |
JP2015520953A (ja) | 2015-07-23 |
WO2014190590A1 (zh) | 2014-12-04 |
TW201446085A (zh) | 2014-12-01 |
KR20150003082A (ko) | 2015-01-08 |
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