JP6255771B2 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
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- JP6255771B2 JP6255771B2 JP2013155619A JP2013155619A JP6255771B2 JP 6255771 B2 JP6255771 B2 JP 6255771B2 JP 2013155619 A JP2013155619 A JP 2013155619A JP 2013155619 A JP2013155619 A JP 2013155619A JP 6255771 B2 JP6255771 B2 JP 6255771B2
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- 239000004065 semiconductor Substances 0.000 title claims description 104
- 239000000758 substrate Substances 0.000 claims description 55
- 230000003796 beauty Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 39
- 238000009795 derivation Methods 0.000 description 23
- 238000005476 soldering Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
最初に本発明の実施形態を列記して説明する。
このような構成により、蓋体と接続部とが一部品として構成される。したがって、この半導体モジュールによれば、部品点数を削減することができる。
この構成によれば、第2導出端子を第1導出端子と容易に接続することができる。
このような構成により、接続部は、半導体チップおよび第1導出端子を基板にはんだ付けするときの昇温(リフロー工程等)の影響を受けない。したがって、この半導体モジュールによれば、接続部の信頼性を確保することができる。
上述のように、導出端子用のはんだに半導体チップ用のはんだよりも低融点のものを採用することによって、半導体チップを基板にはんだ付けしてボンディングワイヤを形成した後に、導出端子を基板にはんだ付けすることも考えられる。しかしながら、シリコン系の半導体素子に比べて高温使用されるワイドバンドギャップ半導体を用いた半導体モジュールにおいては、使用可能なはんだの種類が限定されるので、そのようなはんだを選定すらできない可能性がある。この半導体モジュールによれば、ワイヤボンディングの実施前に、第1導出端子のはんだ付けを半導体チップのはんだ付けと同時に行なうことができるので、上記のような問題は発生しない。
[本願発明の実施形態の詳細]
以下、図面を参照しつつ、本発明の実施の形態について説明する。以下に複数の実施の形態について説明するが、各実施の形態で説明された構成を適宜組合わせることは出願当初から予定されている。なお、以下の説明では、同一または対応する要素には同一の符号を付して、それらについての詳細な説明は繰り返さない。
図1から図3を用いて、本発明の実施の形態1に係る半導体モジュールの構成について説明する。図1は、本発明の実施の形態1に係る半導体モジュールのXZ平面に沿った断面図である。図2は、図1に示す半導体モジュールの内部を概略的に示した平面図であり、図3は、図2中のIII−III線に沿った断面図である。図2,図3では、半導体モジュールの蓋体が外された状態が示されている。
この実施の形態2では、第2導出端子22,25および接続部23,26が蓋体と一体的に設けられる。
第2導出端子22(25)と第1導出端子21(24)との接続方法は、種々の方法を取り得る。たとえば、第1導出端子21(24)と第2導出端子22(25)とをネジ止めによって接続してもよい。
3 基板
4 絶縁板
5a,5b 電極パターン
6 銅板
7,8a〜8d はんだ
11 ベース
12 枠体
20 開口部
21,24 第1導出端子
22,25 第2導出端子
22a,25a 引出部
22b,25b 延在部
23,26 接続部
27,28 ワイヤ
29 封止樹脂
30 上面
31 筐体
51,52 バスバー
41,42,53,54 ネジ
60 ボンディングツール
101〜103 半導体モジュール
Claims (5)
- 半導体チップと、
前記半導体チップを搭載する基板と、
前記基板を収容する筐体と、
前記基板から前記筐体の外部へ引き出される導出端子とを備え、
前記導出端子は、前記筐体の内部において第1導出端子と第2導出端子とに分割され、
前記第1導出端子は、前記基板に搭載され、前記基板の主表面と交差する方向に延び、
前記第2導出端子は、前記基板から前記方向に見て前記基板に対して前記第1導出端子よりも遠い側に設けられ、さらに
前記筐体の内部に設けられ、前記第2導出端子を前記第1導出端子と接続するための接続部を備え、
前記筐体は、前記基板の主表面と対向する面に開口を有し、さらに
前記開口に設けられる蓋体を備え、
前記第2導出端子は、前記蓋体と一体的に設けられ、
前記接続部は、前記蓋体と一体的に設けられる、半導体モジュール。 - 前記第2導出端子は、前記筐体の外部へ引き出される引出部を含み、
前記半導体モジュールを前記方向に沿って平面視した場合に、前記第2導出端子は、前記引出部が前記第1導出端子とずれるように構成される、請求項1に記載の半導体モジュール。 - 前記接続部は、ソケットを含む、請求項1又は請求項2に記載の半導体モジュール。
- 前記接続部は、前記第2導出端子に設けられる、請求項1から請求項3のいずれか1項に記載の半導体モジュール。
- 前記半導体チップは、ワイドバンドギャップ半導体を含む、請求項1から請求項4のいずれか1項に記載の半導体モジュール。
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JP6255771B2 true JP6255771B2 (ja) | 2018-01-10 |
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Family Cites Families (10)
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JPH07122699A (ja) * | 1993-10-27 | 1995-05-12 | Yamatake Honeywell Co Ltd | ハイブリッドic及びその組立方法 |
JPH09172116A (ja) * | 1995-12-21 | 1997-06-30 | Mitsubishi Electric Corp | 半導体装置 |
JP3132651B2 (ja) * | 1997-05-29 | 2001-02-05 | 富士電機株式会社 | 半導体装置 |
JP2000307056A (ja) * | 1999-04-22 | 2000-11-02 | Mitsubishi Electric Corp | 車載用半導体装置 |
JP2003218317A (ja) * | 2002-01-18 | 2003-07-31 | Hitachi Ltd | 半導体電力変換装置 |
JP3911192B2 (ja) * | 2002-05-09 | 2007-05-09 | 三菱電機株式会社 | 半導体装置 |
JP4365388B2 (ja) * | 2006-06-16 | 2009-11-18 | 株式会社日立製作所 | 半導体パワーモジュールおよびその製法 |
JP5463845B2 (ja) * | 2009-10-15 | 2014-04-09 | 三菱電機株式会社 | 電力半導体装置とその製造方法 |
US8076696B2 (en) * | 2009-10-30 | 2011-12-13 | General Electric Company | Power module assembly with reduced inductance |
JP5709739B2 (ja) * | 2011-12-29 | 2015-04-30 | 三菱電機株式会社 | パワー半導体装置 |
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