JP6255089B2 - 伝熱界面のための構造およびそれを製造する方法 - Google Patents
伝熱界面のための構造およびそれを製造する方法 Download PDFInfo
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- JP6255089B2 JP6255089B2 JP2016517441A JP2016517441A JP6255089B2 JP 6255089 B2 JP6255089 B2 JP 6255089B2 JP 2016517441 A JP2016517441 A JP 2016517441A JP 2016517441 A JP2016517441 A JP 2016517441A JP 6255089 B2 JP6255089 B2 JP 6255089B2
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- 238000004519 manufacturing process Methods 0.000 title description 16
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- 239000010931 gold Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
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- 229910052737 gold Inorganic materials 0.000 description 3
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- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
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- 238000010146 3D printing Methods 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
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- 238000005520 cutting process Methods 0.000 description 1
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- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D13/00—Corrugating sheet metal, rods or profiles; Bending sheet metal, rods or profiles into wave form
- B21D13/02—Corrugating sheet metal, rods or profiles; Bending sheet metal, rods or profiles into wave form by pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D33/00—Special measures in connection with working metal foils, e.g. gold foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
前記端部における***特徴部の厚さは***特徴部の中間部分における***特徴部の厚さよりも小さい。
− それぞれの表面に突出部およびへこみのうち少なくとも1つをそれぞれ備えた2つのダイの間に熱伝導性材料の変形可能なシートを配置するステップであって、突出部はへこみと合わさっている形状および寸法を有する、配置するステップと、
− 突出部が対応する反対側のへこみ内に入り込むように、かつそのそれぞれの端部に開口部を有する***特徴部を変形可能なシートに生成するように突出部とへこみの間に位置する変形可能なシートに圧縮力が加えられるようにダイを他方に向かって移動させるステップと
を含む方法であって、
前記端部における***特徴部の厚さは***特徴部の中間部分における***特徴部の厚さよりも小さい。
− 変形可能なシートに突出部による力を及ぼし、突出部と変形可能なシートの間の接触点の近くで変形可能なシートに変形を受けさせるステップであって、
前記変形は、前記接触点で変形可能なシートに材料の降伏(material yield)を引き起こすことによってもたらされて、前記端部における***特徴部の厚さを***特徴部の中間部分における***特徴部の厚さよりも小さくさせるステップをさらに含む。
Claims (8)
- 第1の表面および第2の表面を有する基板と、前記基板の前記第1の表面および前記第2の表面のうちの少なくとも1つに形成された複数の***特徴部とを備え、前記***特徴部は圧縮力のもとで変形可能であり、前記***特徴部のいくつかはそのそれぞれの端部に開口部を有し、
前記端部における***特徴部の厚さは前記***特徴部の中間部分における前記***特徴部の厚さよりも小さい、熱伝導性の伝熱界面構造。 - 1つまたは複数の***特徴部は、その前記端部にある第1の位置に対応する第1の高さと、その前記端部にある第2の位置に対応する第2の高さとをそれぞれ備え、高さは、前記基板によって定められた平面から端部にある位置を通過する平行平面までの距離である、請求項1に記載の伝熱界面構造。
- ***特徴部は壁を有し、前記壁はその外面に粗さを備える、請求項1又は2に記載の伝熱界面構造。
- 熱を発生し得る電気部品と、放熱器部品と、前記請求項1乃至3のいずれか1項に記載の伝熱界面構造とを備えた機器であって、前記伝熱界面構造は前記電気部品と前記放熱器部品の間に位置する、機器。
- − それぞれの表面に突出部およびへこみのうち少なくとも1つをそれぞれ備えた2つのダイの間に熱伝導性材料の変形可能なシートを配置するステップであって、突出部はへこみと合わさっている形状および寸法を有する、配置するステップと、
− 突出部が対応する反対側のへこみ内に入り込むように、かつそのそれぞれの端部に開口部を有する***特徴部を前記変形可能なシートに生成するように前記突出部と前記へこみの間に位置する前記変形可能なシートに圧縮力が加えられるようにダイを他方に向かって移動させるステップと、
を含む方法であって、
前記端部における***特徴部の厚さが前記***特徴部の中間部分における前記***特徴部の厚さよりも小さい、方法。 - − 前記変形可能なシートに突出部による力を及ぼし、前記突出部と前記変形可能なシートの間の接触点の近くで前記変形可能なシートに変形を生じさせるステップであって、前記変形は、前記接触点で前記変形可能なシートに材料の降伏を引き起こすことによってもたらされ、前記端部における***特徴部の前記厚さを前記***特徴部の中間部分における前記***特徴部の厚さよりも小さくさせる、変形を生じさせるステップを含む、請求項5に記載の方法。
- 前記***特徴部の前記端部に開口部を作り出すように前記変形可能なシートを裂くステップをさらに含む、請求項6に記載の方法。
- 前記ダイは前記それぞれの外面上に粗さを有し、前記変形可能なシートが変形されるときに、そのような粗さは、その上の前記粗さに関連した凹凸を前記***特徴部の表面へ伝えるように構成されている、請求項5乃至7のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13306340.4 | 2013-09-27 | ||
EP13306340.4A EP2854170B1 (en) | 2013-09-27 | 2013-09-27 | A structure for a heat transfer interface and method of manufacturing the same |
PCT/IB2014/002115 WO2015044773A2 (en) | 2013-09-27 | 2014-09-25 | A structure for a heat transfer interface and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
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JP2016533634A JP2016533634A (ja) | 2016-10-27 |
JP6255089B2 true JP6255089B2 (ja) | 2017-12-27 |
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ID=49484243
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JP2016517441A Active JP6255089B2 (ja) | 2013-09-27 | 2014-09-25 | 伝熱界面のための構造およびそれを製造する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11032942B2 (ja) |
EP (2) | EP2854170B1 (ja) |
JP (1) | JP6255089B2 (ja) |
CN (1) | CN105874591B (ja) |
WO (2) | WO2015043947A1 (ja) |
Families Citing this family (4)
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US10886193B2 (en) | 2016-03-30 | 2021-01-05 | Parker-Hannifin Corporation | Thermal interface material |
US10777483B1 (en) | 2020-02-28 | 2020-09-15 | Arieca Inc. | Method, apparatus, and assembly for thermally connecting layers |
JP6849137B1 (ja) | 2020-07-06 | 2021-03-24 | 富士電機株式会社 | 半導体装置 |
CN115808748A (zh) * | 2021-09-14 | 2023-03-17 | 戴尔产品有限公司 | 用于热电冷却光学端口的***和方法 |
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-
2013
- 2013-09-27 EP EP13306340.4A patent/EP2854170B1/en active Active
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2014
- 2014-09-10 WO PCT/EP2014/069253 patent/WO2015043947A1/en active Application Filing
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- 2014-09-25 WO PCT/IB2014/002115 patent/WO2015044773A2/en active Application Filing
- 2014-09-25 US US14/917,595 patent/US11032942B2/en active Active
- 2014-09-25 EP EP14814991.7A patent/EP3050096A2/en not_active Withdrawn
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US20160219751A1 (en) | 2016-07-28 |
US11032942B2 (en) | 2021-06-08 |
CN105874591B (zh) | 2019-03-29 |
WO2015044773A2 (en) | 2015-04-02 |
EP2854170B1 (en) | 2022-01-26 |
WO2015044773A3 (en) | 2015-08-06 |
CN105874591A (zh) | 2016-08-17 |
WO2015043947A1 (en) | 2015-04-02 |
EP2854170A1 (en) | 2015-04-01 |
JP2016533634A (ja) | 2016-10-27 |
EP3050096A2 (en) | 2016-08-03 |
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