JP6240092B2 - シリコーングラフト化コア−シェル粒子並びにこれを含有するポリマーマトリックス及びled - Google Patents
シリコーングラフト化コア−シェル粒子並びにこれを含有するポリマーマトリックス及びled Download PDFInfo
- Publication number
- JP6240092B2 JP6240092B2 JP2014552377A JP2014552377A JP6240092B2 JP 6240092 B2 JP6240092 B2 JP 6240092B2 JP 2014552377 A JP2014552377 A JP 2014552377A JP 2014552377 A JP2014552377 A JP 2014552377A JP 6240092 B2 JP6240092 B2 JP 6240092B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- particles
- pdms
- sio
- polymer matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002245 particle Substances 0.000 title claims description 50
- 229920000642 polymer Polymers 0.000 title claims description 43
- 229920001296 polysiloxane Polymers 0.000 title claims description 28
- 239000011159 matrix material Substances 0.000 title claims description 23
- 239000011258 core-shell material Substances 0.000 title claims description 16
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 59
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 51
- -1 polysiloxane Polymers 0.000 claims description 29
- 239000000377 silicon dioxide Substances 0.000 claims description 19
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 16
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 229910052809 inorganic oxide Inorganic materials 0.000 claims 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 32
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 17
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- 239000004205 dimethyl polysiloxane Substances 0.000 description 14
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 239000000945 filler Substances 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 239000011257 shell material Substances 0.000 description 7
- 239000002105 nanoparticle Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 5
- 239000011162 core material Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 150000004678 hydrides Chemical class 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229920005573 silicon-containing polymer Polymers 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- 238000002411 thermogravimetry Methods 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000005119 centrifugation Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 239000013557 residual solvent Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000007771 core particle Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003205 poly(diphenylsiloxane) Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 150000003283 rhodium Chemical class 0.000 description 1
- 229920006126 semicrystalline polymer Polymers 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/14—Macromolecular materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
- Y10T428/2995—Silane, siloxane or silicone coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
Description
本願は、「SILICONE-GRAFTED CORE-SHELL PARTICLES, POLYMER MATRIX, AND LED CONTAINING SAME」という発明の名称の2012年1月16日付け米国仮出願第61/586968号の優先権を主張するものであり、そのすべての内容を参照用に取り入れる。
A:−OH、−H
B:−OH、−H、−CH=CH2
R:−CH3、−C2H5、−C6H5、−CH2CH2CF3;
指数nはポリマーの重合度であり、xは粒子当たりのグラフト化鎖の数である。A及びBはシロキサンポリマー鎖の末端における反応性末端基を表す。グラフト化は、粒子の表面ヒドロキシル基とポリマー鎖の反応性末端基、例えばヒドリド又はシラノール基との反応によって起こる。この反応は、スズの塩によって触媒することができ、溶媒はポリシロキサン用の任意の良溶媒、例えばトルエン、キシレン、エチルベンゼン、メチルイソブチルケトン(MIBK)、テトラヒドロフラン(THF)、クロロホルム又はメチルエチルケトンであることができる。両末端に反応性基を有する双末端化ポリ(ジメチルシロキサン)は、グラフト化粒子を形成させて、このグラフト化粒子がエラストマー網状構造中に架橋する能力を持つようにするために、用いることができる。
ポリ(ジメチルシロキサン)グラフト化シリカ粒子
シリカナノ粒子(MIBK−ST、メチルイソブチルケトン中の30重量%分散体、平均サイズ20nm、日産化学から入手)(分散体6ミリリットル(SiO22g)の量)を、メチルイソブチルケトン(MIBK)14ミリリットルで希釈し、この混合物中にSnCl2・2H2O30mgを溶解させた。この混合物を窒素充填フラスコ中に移し、次式:
シリカナノ粒子(MIBK-ST、メチルイソブチルケトン中の30重量%分散体、平均サイズ20nm、日産化学から入手)(分散体6ミリリットル(SiO22g)の量)を、メチルイソブチルケトン(MIBK)14ミリリットルで希釈し、この混合物中にSnCl2・2H2O30mgを溶解させた。この混合物を窒素充填フラスコ中に移し、次式:
シリカナノ粒子(MIBK−ST、メチルイソブチルケトン中の30重量%分散体、平均サイズ20nm、日産化学から入手)(分散体6ミリリットル(SiO22g)の量)を、メチルイソブチルケトン(MIBK)14ミリリットルで希釈し、この混合物中にSnCl2・2H2O30mgを溶解させた。この混合物を窒素充填フラスコ中に移し、ヒドリドを末端とするポリ(ジメチルシロキサン)(DMS-H21、6000g/モル、Gelest社から入手)の0.5g/ミリリットルMIBK溶液0.4ミリリットルを滴下した。このフラスコに窒素ガスラインを連結し、100℃の油浴中に浸漬し、窒素保護下で内容物を2時間撹拌し、次いで、ヒドリドを末端とするポリ(ジメチルシロキサン)の0.5g/ミリリットルMIBK溶液3.6ミリリットルをゆっくり添加し、フラスコに加えたポリマーの合計量を2gにした。内容物を40時間撹拌した後に、フラスコを室温まで冷まし、内容物をメタノール70ミリリットル中に注いだ。 白色沈殿を5000gにおいて40分間の遠心分離によって分離し、トルエン30ミリリットル中に再溶解させた。この溶液を浴中で5分間超音波処理し、0.45umポリプロピレンシリンジフィルターを通して濾過し、回転式蒸発器を用いて濃縮して5ミリリットルにした。得られた溶液に、架橋剤(1,3,5,7−テトラビニル−1,3,5,7−テトラメチルシクロテトラシロキサン)70mg及び白金触媒(白金カルボニルシクロビニルメチルシロキサン錯体)の1g/リットルTHF溶液40マイクロリットルを加えた。残留溶媒を室温において真空中で蒸発させ、固体を24時間放置して硬化させて、透明エラストマーを得た。
Claims (7)
- ポリシロキサンポリマー中に分散した複数のシリコーングラフト化コア−シェル粒子を含み且つ発光体をさらに含むポリマーマトリックスであって、
前記シリコーングラフト化コア−シェル粒子が、二酸化ケイ素、二酸化チタン又は酸化アルミニウムから成る無機酸化物粒子のコアと、各末端に反応性基を有する双末端化ポリ(ジメチルシロキサン)から形成されたグラフト化ポリ(ジメチルシロキサン)ポリマーのシェルとを含み、
前記反応性基が−H及び−OHから選択される、前記ポリマーマトリックス。 - 前記無機酸化物粒子が酸化アルミニウムから成る、請求項1に記載のポリマーマトリックス。
- 前記無機酸化物粒子が二酸化チタンから成る、請求項1に記載のポリマーマトリックス。
- ポリシロキサンポリマー中に分散した複数のシリコーングラフト化コア−シェル粒子を含むポリマーマトリックス中に封入されたLEDダイを含むLEDであって、
前記シリコーングラフト化コア−シェル粒子が、二酸化ケイ素、二酸化チタン又は酸化アルミニウムから成る無機酸化物粒子のコアと、各末端に反応性基を有する双末端化ポリ(ジメチルシロキサン)から形成されたグラフト化ポリ(ジメチルシロキサン)ポリマーのシェルとを含み、
前記反応性基が−H及び−OHから選択される、前記LED。 - 前記ポリマーマトリックスが発光体をさらに含む、請求項4に記載のLED。
- 前記無機酸化物粒子が酸化アルミニウムから成る、請求項4又は5に記載のLED。
- 前記無機酸化物粒子が二酸化チタンから成る、請求項4又は5に記載のLED。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261586968P | 2012-01-16 | 2012-01-16 | |
US61/586,968 | 2012-01-16 | ||
PCT/US2013/021548 WO2013109526A2 (en) | 2012-01-16 | 2013-01-15 | Silicone-grafted core-shell particles, polymer matrix, and led containing same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015503672A JP2015503672A (ja) | 2015-02-02 |
JP6240092B2 true JP6240092B2 (ja) | 2017-11-29 |
Family
ID=47630556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014552377A Active JP6240092B2 (ja) | 2012-01-16 | 2013-01-15 | シリコーングラフト化コア−シェル粒子並びにこれを含有するポリマーマトリックス及びled |
Country Status (5)
Country | Link |
---|---|
US (2) | US9515235B2 (ja) |
EP (1) | EP2804904B1 (ja) |
JP (1) | JP6240092B2 (ja) |
CN (1) | CN104039883A (ja) |
WO (1) | WO2013109526A2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150029173A (ko) * | 2013-09-09 | 2015-03-18 | 삼성전자주식회사 | 양자점 패키지를 이용한 광원 유닛 |
TWI535792B (zh) * | 2013-10-24 | 2016-06-01 | 瓦克化學公司 | Led封裝材料 |
TWI586760B (zh) * | 2014-03-18 | 2017-06-11 | 納諾柯技術有限公司 | 量子點組合物 |
EP2942825B1 (en) * | 2014-05-08 | 2020-04-15 | Guan-Jie Luo | White light emitting diode, manufacturing method |
KR101597183B1 (ko) * | 2014-12-09 | 2016-02-25 | 한국과학기술연구원 | 코어-쉘 구조의 유기 실리콘 수지 |
KR102411541B1 (ko) * | 2015-08-07 | 2022-06-22 | 삼성디스플레이 주식회사 | 고분자 필름 형성용 조성물, 이로부터 제조된 고분자 필름 및 상기 고분자 필름을 포함한 전자 소자 |
WO2017132137A1 (en) * | 2016-01-25 | 2017-08-03 | Carnegie Mellon University | Composite composition and modification of inorganic particles for use in composite compositions |
WO2018002334A1 (en) * | 2016-06-30 | 2018-01-04 | Osram Opto Semiconductors Gmbh | Wavelength converter having a polysiloxane material, method of making, and solid state lighting device containing same |
TWI721005B (zh) * | 2016-08-17 | 2021-03-11 | 晶元光電股份有限公司 | 發光裝置以及其製造方法 |
CN111491997A (zh) * | 2017-12-20 | 2020-08-04 | 3M创新有限公司 | 包含具有不同折射率的颗粒的聚合物复合材料 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0647458B2 (ja) * | 1986-01-22 | 1994-06-22 | 東レ・ダウコーニング・シリコーン株式会社 | シリカ微粉末の表面改質方法 |
JPH07323204A (ja) | 1994-05-30 | 1995-12-12 | Toray Dow Corning Silicone Co Ltd | 抑泡剤組成物 |
JP3960029B2 (ja) * | 2001-12-06 | 2007-08-15 | 東洋インキ製造株式会社 | 高耐熱性、撥水性、親油性表面処理無機酸化物、その製造方法および樹脂組成物 |
JP3915901B2 (ja) * | 2002-06-05 | 2007-05-16 | 信越化学工業株式会社 | ゴム用配合剤及び配合方法 |
TWI359164B (en) * | 2003-12-18 | 2012-03-01 | Kose Corp | Surface coated powder and a cosmetic composition c |
CN101084112A (zh) * | 2004-11-16 | 2007-12-05 | 奈米晶材照明有限公司 | 以光学上具有可靠的高折射率的纳米粒子为基础的纳米复合封装材料与光子波导材料 |
EP1717278A1 (en) | 2005-04-26 | 2006-11-02 | Nuplex Resins B.V. | Coated particles and coating compositions comprising coated particles |
DE102006044707B4 (de) * | 2005-09-21 | 2022-03-17 | Joyson Safety Systems Acquisition Llc | Passive Airbagentlüftung mit Ventilführungstasche |
WO2008066154A1 (fr) | 2006-12-01 | 2008-06-05 | Kuraray Co., Ltd. | Élément illuminant en surface et dispositif d'affichage d'image possédant l'élément |
US20100178512A1 (en) | 2006-12-06 | 2010-07-15 | Ciba Corporation | Changing surface properties by functionalized nanoparticles |
JP2009120437A (ja) | 2007-11-14 | 2009-06-04 | Niigata Univ | シロキサンをグラフト化したシリカ及び高透明シリコーン組成物並びに該組成物で封止した発光半導体装置 |
US9133314B2 (en) * | 2007-12-17 | 2015-09-15 | The Trustees Of Columbia University In The City Of New York | Anisotropic self-assembly of nanoparticles in composites |
WO2010026992A1 (ja) * | 2008-09-05 | 2010-03-11 | 株式会社日本触媒 | シリコーン樹脂組成物、酸化金属粒子及びその製造方法 |
US8827498B2 (en) * | 2008-09-30 | 2014-09-09 | Osram Sylvania Inc. | LED light source having glass heat pipe with fiberglass wick |
KR101265913B1 (ko) * | 2010-06-08 | 2013-05-20 | 세키스이가가쿠 고교가부시키가이샤 | 광 반도체 장치용 다이본드재 및 이를 이용한 광 반도체 장치 |
-
2013
- 2013-01-15 US US14/371,229 patent/US9515235B2/en active Active
- 2013-01-15 EP EP13702142.4A patent/EP2804904B1/en active Active
- 2013-01-15 JP JP2014552377A patent/JP6240092B2/ja active Active
- 2013-01-15 CN CN201380005258.4A patent/CN104039883A/zh active Pending
- 2013-01-15 WO PCT/US2013/021548 patent/WO2013109526A2/en active Application Filing
-
2016
- 2016-07-07 US US15/204,467 patent/US9553246B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2013109526A3 (en) | 2013-10-03 |
JP2015503672A (ja) | 2015-02-02 |
EP2804904B1 (en) | 2018-08-15 |
EP2804904A2 (en) | 2014-11-26 |
WO2013109526A2 (en) | 2013-07-25 |
US20160322547A1 (en) | 2016-11-03 |
CN104039883A (zh) | 2014-09-10 |
US20150014727A1 (en) | 2015-01-15 |
US9515235B2 (en) | 2016-12-06 |
US9553246B2 (en) | 2017-01-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6240092B2 (ja) | シリコーングラフト化コア−シェル粒子並びにこれを含有するポリマーマトリックス及びled | |
CN101932631B (zh) | 含硅粒子、其制造方法、有机聚合物组合物、陶瓷及其制造方法 | |
JP4591690B2 (ja) | 蛍光物質入りled発光装置 | |
TW201251141A (en) | Encapsulating sheet and optical semiconductor element device | |
TWI746495B (zh) | 熱硬化性樹脂組成物、預浸體、硬化物、光半導體用組成物及光半導體元件 | |
TWI725974B (zh) | 硬化性矽酮樹脂組成物、矽酮樹脂複合體、光半導體發光裝置、照明器具及液晶圖像裝置 | |
JP2011144360A (ja) | 光半導体素子封止用樹脂組成物及び当該組成物で封止した光半導体装置 | |
JP5877081B2 (ja) | 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を用いてなる封止剤、および光学デバイス | |
TW201100470A (en) | Organosilicon compound, thermosetting composition containing said organosilicon compound and sealing material for optical semiconductor | |
JP2013107984A (ja) | Ledリフレクターとして有用な白色熱硬化性シリコーン樹脂組成物及び該組成物を用いた光半導体装置 | |
TW201300461A (zh) | 聚矽氧樹脂組合物、密封層、反射板及光半導體裝置 | |
WO2013138401A1 (en) | Metal-containing encapsulant compositions and methods | |
CN109929252A (zh) | 紫外线固化型树脂组合物、粘接剂和固化物 | |
Huang et al. | Preparation of ZrO2/silicone hybrid materials for LED encapsulation via in situ sol‐gel reaction | |
CN104487492B (zh) | 乙烯基碳硅氧烷树脂 | |
WO2021084980A1 (ja) | 赤外線透過性硬化型組成物、その硬化物および光半導体装置 | |
JP6467125B2 (ja) | 硬化性樹脂組成物、該組成物を硬化させてなる硬化物 | |
JP7042125B2 (ja) | 硬化性樹脂組成物並びに該樹脂組成物を用いた硬化物、封止剤及び光半導体装置 | |
JP5965241B2 (ja) | シリコーン処理蛍光体、シリコーン処理蛍光体含有シリコーン系硬化性組成物およびこれらの組成物で封止されてなる発光装置 | |
JP2014162885A (ja) | 半導体素子接着用シリコーン樹脂組成物及びそれを用いたケイ素含有硬化物 | |
JP7027931B2 (ja) | 熱硬化性樹脂組成物 | |
JP7042126B2 (ja) | 硬化性組成物及び該組成物を封止剤として用いた光半導体装置。 | |
JP6766334B2 (ja) | 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料 | |
JP6239948B2 (ja) | 多面体構造ポリシロキサンを添加した硬化性組成物、硬化物および半導体発光装置、半導体発光装置の製造方法 | |
JP6726517B2 (ja) | Led封止剤用樹脂組成物およびled封止剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150723 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160714 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160726 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20161026 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161027 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170410 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170815 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170818 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171003 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20171102 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6240092 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |