JP6226712B2 - 基板支持構造 - Google Patents
基板支持構造 Download PDFInfo
- Publication number
- JP6226712B2 JP6226712B2 JP2013241137A JP2013241137A JP6226712B2 JP 6226712 B2 JP6226712 B2 JP 6226712B2 JP 2013241137 A JP2013241137 A JP 2013241137A JP 2013241137 A JP2013241137 A JP 2013241137A JP 6226712 B2 JP6226712 B2 JP 6226712B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- support
- substrate support
- end side
- support structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
1…基板支持構造
2…基板支持部材
2A…基端
2B…先端
2C…支持部
21…ベース体
21A…凹部
21B…ボルト穴
22…支持体
23…ボルト
3…保持部材
4…処理容器
4A…側壁内面
100…処理空間
Claims (5)
- 被処理基板が収容されて処理される処理空間内の所定の支持位置に前記被処理基板を略水平姿勢に支持するための基板支持構造であって、
基端側から先端側に向かって延び、前記支持位置の両側で、基端側から先端側に向かって下方に傾斜する支持部により前記被処理基板を支持する基板支持部材を備え、
前記基板支持部材は、下方への前記支持部の傾斜が可変となるように配設されている、基板支持構造。 - 前記処理空間は、処理容器の内部に形成され、前記処理容器の側壁内面における前記支持位置の両側に、前記基板支持部材の基端側を保持する保持部材が設けられた、請求項1に記載の基板支持構造。
- 前記基板支持部材が前記支持位置の片側について複数設けられる、請求項1に記載の基板支持構造。
- 前記支持位置の両側に対向して前記処理空間の奥行き方向に延びて設けられる保持部材であって、複数の前記基板支持部材に対応して設けられる保持部材を備える、請求項3に記載の基板支持構造。
- 前記基板支持部材は、
前記基端側から前記先端側に向かって延びるベース体と、
前記支持部を有し、前記ベース体の上面から前記支持部を露出させるように前記ベース体に配設される支持体と、
を備える、請求項1〜4の何れかに記載の基板支持構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013241137A JP6226712B2 (ja) | 2013-11-21 | 2013-11-21 | 基板支持構造 |
KR1020140091028A KR102182046B1 (ko) | 2013-11-21 | 2014-07-18 | 기판 지지구조체 |
CN201810869433.9A CN108807259B (zh) | 2013-11-21 | 2014-09-17 | 基板支承结构 |
CN201410474841.6A CN104658955B (zh) | 2013-11-21 | 2014-09-17 | 基板支承结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013241137A JP6226712B2 (ja) | 2013-11-21 | 2013-11-21 | 基板支持構造 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017120975A Division JP6378403B2 (ja) | 2017-06-21 | 2017-06-21 | 基板支持構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015103565A JP2015103565A (ja) | 2015-06-04 |
JP6226712B2 true JP6226712B2 (ja) | 2017-11-08 |
Family
ID=53249925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013241137A Active JP6226712B2 (ja) | 2013-11-21 | 2013-11-21 | 基板支持構造 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6226712B2 (ja) |
KR (1) | KR102182046B1 (ja) |
CN (2) | CN104658955B (ja) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001358191A (ja) * | 2000-06-09 | 2001-12-26 | Asm Japan Kk | 半導体製造装置用の基板支持板 |
JP2002100668A (ja) | 2000-09-25 | 2002-04-05 | Mitsubishi Materials Silicon Corp | 熱処理基板用支持具 |
JP2004014829A (ja) * | 2002-06-07 | 2004-01-15 | Hitachi Kokusai Electric Inc | 熱処理装置及び半導体デバイスの製造方法 |
GB2392309B (en) * | 2002-08-22 | 2004-10-27 | Leica Microsys Lithography Ltd | Substrate loading and unloading apparatus |
JP2004111786A (ja) | 2002-09-20 | 2004-04-08 | Hitachi Kokusai Electric Inc | 熱処理装置及び半導体デバイスの製造方法 |
KR100980024B1 (ko) * | 2003-06-19 | 2010-09-03 | 삼성전자주식회사 | 기판지지장치 |
JP2005340488A (ja) * | 2004-05-27 | 2005-12-08 | Matsushita Electric Ind Co Ltd | 電子デバイスの製造装置 |
CN101303993A (zh) * | 2007-05-10 | 2008-11-12 | 南亚科技股份有限公司 | 晶片承载装置 |
JP5456287B2 (ja) * | 2008-09-05 | 2014-03-26 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP5261085B2 (ja) * | 2008-09-05 | 2013-08-14 | 東京エレクトロン株式会社 | 基板載置機構、基板処理装置、基板載置機構の制御方法及び記憶媒体 |
DE112010004736B4 (de) * | 2009-12-11 | 2022-04-21 | Sumco Corporation | Aufnahmefür cvd und verfahren zur herstellung eines films unterverwendung derselben |
JP5790112B2 (ja) * | 2011-04-18 | 2015-10-07 | 大日本印刷株式会社 | 基板保持用枠体と薄板基板の梱包体 |
US9330949B2 (en) * | 2012-03-27 | 2016-05-03 | SCREEN Holdings Co., Ltd. | Heat treatment apparatus for heating substrate by irradiating substrate with flash of light |
JP5964630B2 (ja) * | 2012-03-27 | 2016-08-03 | 株式会社Screenホールディングス | 熱処理装置 |
-
2013
- 2013-11-21 JP JP2013241137A patent/JP6226712B2/ja active Active
-
2014
- 2014-07-18 KR KR1020140091028A patent/KR102182046B1/ko active IP Right Grant
- 2014-09-17 CN CN201410474841.6A patent/CN104658955B/zh active Active
- 2014-09-17 CN CN201810869433.9A patent/CN108807259B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN104658955A (zh) | 2015-05-27 |
KR102182046B1 (ko) | 2020-11-23 |
CN108807259B (zh) | 2022-12-16 |
CN108807259A (zh) | 2018-11-13 |
CN104658955B (zh) | 2019-01-04 |
KR20150059072A (ko) | 2015-05-29 |
JP2015103565A (ja) | 2015-06-04 |
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