JP6213940B2 - 有機el素子及び有機el素子の製造方法 - Google Patents
有機el素子及び有機el素子の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims description 81
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- 239000010410 layer Substances 0.000 claims description 44
- 239000007788 liquid Substances 0.000 claims description 40
- 239000012044 organic layer Substances 0.000 claims description 38
- 230000002093 peripheral effect Effects 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 17
- 238000007599 discharging Methods 0.000 claims description 3
- 238000005401 electroluminescence Methods 0.000 description 119
- 230000000052 comparative effect Effects 0.000 description 20
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- 239000011295 pitch Substances 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 230000007423 decrease Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical group C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80521—Cathodes characterised by their shape
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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- Electroluminescent Light Sources (AREA)
Description
まず、実施の形態に係る有機ELパネル1の構成について、図1A及び図1Bを用いて説明する。図1Aは、実施の形態に係る有機ELパネルの平面図であり、図1Bは、同有機ELパネルのA−A’線における断面図である。
次に、本実施の形態に係る有機ELパネル1の製造方法について、図4A〜図4Dを用いて説明する。図4A〜図4Dは、実施の形態に係る有機ELパネルの製造方法における各工程の平面図である。
次に、本実施の形態における有機ELパネル1の効果について、本発明に至った経緯も含めて説明する。
次に、上記有機ELパネル1を実際に作製した実施例1〜3における有機ELパネルの輝度ムラ抑制効果及びタクト低減効果と、比較例1、2における有機ELパネルの輝度ムラ抑制効果及びタクト低減効果とについて説明する。
以上、本発明に係る有機EL素子及びその製造方法について、有機ELパネルを例にとって説明したが、本発明は、上記実施の形態に限定されるものではない。
11 第一基板(基板)
12 第一電極
12a 第一電極端子部
12b 第二電極端子部
13、13A、13B、13X、13Y 補助電極
13a、130a 直線部
13b、130b 曲線部
14 有機層
15 第二電極
16 第二基板
17 シール樹脂
130 導電性材料
Claims (7)
- 基板と、
前記基板の上に配置された第一電極と、
発光層を有し、前記第一電極の上に配置された有機層と、
前記有機層の上に配置された第二電極と、
前記第一電極に積層された補助電極とを備え、
前記補助電極は、直線状の直線部と曲線状の曲線部とを有し、
前記曲線部の線幅は、前記直線部の線幅より広い
有機EL素子。 - 前記曲線部は、前記第一電極の外周縁近傍に形成されている
請求項1に記載の有機EL素子。 - 前記曲線部は、前記第一電極の中央部に形成されている
請求項1に記載の有機EL素子。 - 前記直線部から前記曲線部にかけての前記補助電極の線幅は、連続的に広くなっている
請求項1〜3のいずれか1項に記載の有機EL素子。 - 基板上に第一電極を形成する工程と、
前記第一電極に積層するように、直線状の直線部と曲線状の曲線部とを有する補助電極を形成する工程と、
前記第一電極の上に、発光層を有する有機層を形成する工程と、
前記有機層の上に第二電極を形成する工程とを含み、
前記補助電極を形成する工程では、前記曲線部の線幅が前記直線部の線幅よりも広くなるように液状の導電性材料を塗布することによって前記補助電極を形成する
有機EL素子の製造方法。 - 前記曲線部及び前記直線部は、前記液状の導電性材料をノズルから吐出することによって描画され、
前記曲線部を描画するときの前記液状の導電性材料の描画速度は、前記直線部を描画するときの前記液状の導電性材料の描画速度よりも遅い
請求項5に記載の有機EL素子の製造方法。 - 前記曲線部及び前記直線部は、前記液状の導電性材料をノズルから吐出することによって描画され、
前記曲線部を描画するときの前記液状の導電性材料の吐出量は、前記直線部を描画するときの前記導電性材料の吐出量よりも多い
請求項5に記載の有機EL素子の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014155276 | 2014-07-30 | ||
JP2014155276 | 2014-07-30 | ||
PCT/JP2015/003387 WO2016017072A1 (ja) | 2014-07-30 | 2015-07-06 | 有機el素子及び有機el素子の製造方法 |
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JPWO2016017072A1 JPWO2016017072A1 (ja) | 2017-04-27 |
JP6213940B2 true JP6213940B2 (ja) | 2017-10-18 |
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US (1) | US9837630B2 (ja) |
JP (1) | JP6213940B2 (ja) |
WO (1) | WO2016017072A1 (ja) |
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JP2019194937A (ja) * | 2016-09-13 | 2019-11-07 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子 |
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JP2002318556A (ja) * | 2001-04-20 | 2002-10-31 | Toshiba Corp | アクティブマトリクス型平面表示装置およびその製造方法 |
FR2845778B1 (fr) * | 2002-10-09 | 2004-12-17 | Saint Gobain | Dispositif electrocommandable du type electroluminescent |
TWI403761B (zh) | 2005-02-15 | 2013-08-01 | Fujifilm Corp | 透光性導電性膜之製法 |
JP2008034362A (ja) * | 2006-06-28 | 2008-02-14 | Sumitomo Chemical Co Ltd | 有機エレクトロルミネッセンス素子 |
JP4981371B2 (ja) | 2006-06-28 | 2012-07-18 | ハリソン東芝ライティング株式会社 | 有機el素子 |
JP2008123882A (ja) * | 2006-11-14 | 2008-05-29 | Harison Toshiba Lighting Corp | 有機el素子 |
JP5077753B2 (ja) | 2007-11-29 | 2012-11-21 | 日本精機株式会社 | 有機elパネル |
JP5314385B2 (ja) * | 2008-10-31 | 2013-10-16 | 住友化学株式会社 | 有機エレクトロルミネッセンス素子の製造方法 |
JP2010205432A (ja) | 2009-02-27 | 2010-09-16 | Fujifilm Corp | 透明導電体及び透明発熱体 |
JP5240719B2 (ja) | 2009-03-23 | 2013-07-17 | パナソニック株式会社 | 面状発光素子及びそれを備えた照明器具 |
JP2012041196A (ja) | 2010-08-12 | 2012-03-01 | Asahi Glass Co Ltd | 封着材料層付きガラス部材とそれを用いた電子デバイスおよびその製造方法 |
JP2014032757A (ja) | 2012-08-01 | 2014-02-20 | Mitsubishi Chemicals Corp | 面発光パネル、面発光パネル群および面発光パネルの製造方法 |
WO2015151531A1 (ja) * | 2014-04-04 | 2015-10-08 | 株式会社Joled | 表示パネルおよびその製造方法 |
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- 2015-07-06 JP JP2016537725A patent/JP6213940B2/ja active Active
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US20170125724A1 (en) | 2017-05-04 |
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US9837630B2 (en) | 2017-12-05 |
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