JP6195806B2 - 塗布装置 - Google Patents
塗布装置 Download PDFInfo
- Publication number
- JP6195806B2 JP6195806B2 JP2014108415A JP2014108415A JP6195806B2 JP 6195806 B2 JP6195806 B2 JP 6195806B2 JP 2014108415 A JP2014108415 A JP 2014108415A JP 2014108415 A JP2014108415 A JP 2014108415A JP 6195806 B2 JP6195806 B2 JP 6195806B2
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- 238000000576 coating method Methods 0.000 title claims description 137
- 239000011248 coating agent Substances 0.000 title claims description 127
- 239000000463 material Substances 0.000 claims description 95
- 239000000758 substrate Substances 0.000 claims description 51
- 230000007246 mechanism Effects 0.000 claims description 26
- 230000008859 change Effects 0.000 claims description 23
- 239000007788 liquid Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 22
- 238000005259 measurement Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 15
- 238000012545 processing Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 14
- 230000005856 abnormality Effects 0.000 description 13
- 230000007423 decrease Effects 0.000 description 10
- 238000009530 blood pressure measurement Methods 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 239000011324 bead Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
R 塗布材
1 塗布装置
22 第1の移動機構
30 スリットノズル
36 液面高さ測定部
37 圧力測定部
100 制御装置
101 制御部
101a 設定部
101b 塗布制御部
101c 異常対応処理部
102 記憶部
102a 開始時圧力
102b 終了時圧力
102c 最適保持圧関数
102d 最適使用量情報
Claims (5)
- 塗布材を貯留する貯留室を備えたスリットノズルと、
前記スリットノズルを基板に対して相対的に移動させる移動機構と、
前記貯留室内の圧力を調整する圧力調整部と、
前記移動機構および前記圧力調整部を制御することにより、前記貯留室内の圧力を負圧から大気圧へ近付く方向へ変化させながら、前記スリットノズルを前記基板に対して相対的に移動させる制御部と
を備え、
前記制御部は、
塗布開始位置を含む開始区間および塗布終了位置を含む終了区間における前記貯留室内の圧力変化が、前記開始区間および前記終了区間を除く中央区間における前記貯留室内の圧力変化よりも緩やかになるように前記圧力調整部を制御すること
を特徴とする塗布装置。 - 前記制御部は、
前記塗布開始位置における前記貯留室内の圧力である開始時圧力と、前記塗布終了位置における前記貯留室内の圧力である終了時圧力とを設定する設定部
を備え、
少なくとも前記開始区間および前記終了区間における前記貯留室内の圧力変化が、前記設定部によって設定された前記開始時圧力と前記終了時圧力とを結ぶS字曲線に沿って変化するように前記圧力調整部を制御すること
を特徴とする請求項1に記載の塗布装置。 - 前記制御部は、
前記塗布開始位置から前記塗布終了位置までの全区間における前記貯留室内の圧力変化が、前記設定部によって設定された前記開始時圧力と前記終了時圧力とを結ぶS字曲線に沿って変化するように前記圧力調整部を制御すること
を特徴とする請求項2に記載の塗布装置。 - 前記制御部は、
前記基板上の位置と、前記基板の表面積に占める塗布済み面積の割合との関係を示すS字曲線関数に基づき、前記開始時圧力と前記終了時圧力とを結ぶS字曲線を決定すること
を特徴とする請求項2または3に記載の塗布装置。 - 前記開始区間は、
前記塗布開始位置から前記塗布終了位置に向かって前記基板の直径の1/5の距離だけ離隔した位置よりも前記塗布開始位置寄りの位置を終点とし、
前記終了区間は、
前記塗布終了位置から前記塗布開始位置に向かって前記基板の直径の1/5の距離だけ隔離した位置よりも前記塗布終了位置寄りの位置を始点とすること
を特徴とする請求項1〜4のいずれか一つに記載の塗布装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014108415A JP6195806B2 (ja) | 2013-11-13 | 2014-05-26 | 塗布装置 |
US14/525,502 US9401291B2 (en) | 2013-11-13 | 2014-10-28 | Coating apparatus |
TW103138615A TWI602620B (zh) | 2013-11-13 | 2014-11-06 | 塗布裝置 |
KR1020140155610A KR102235382B1 (ko) | 2013-11-13 | 2014-11-10 | 도포 장치 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013235006 | 2013-11-13 | ||
JP2013235006 | 2013-11-13 | ||
JP2014108415A JP6195806B2 (ja) | 2013-11-13 | 2014-05-26 | 塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015119160A JP2015119160A (ja) | 2015-06-25 |
JP6195806B2 true JP6195806B2 (ja) | 2017-09-13 |
Family
ID=53042561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014108415A Expired - Fee Related JP6195806B2 (ja) | 2013-11-13 | 2014-05-26 | 塗布装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9401291B2 (ja) |
JP (1) | JP6195806B2 (ja) |
KR (1) | KR102235382B1 (ja) |
TW (1) | TWI602620B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI723969B (zh) | 2015-03-20 | 2021-04-11 | 日商精工計時系統有限公司 | 鑽孔裝置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6901616B2 (ja) * | 2016-02-26 | 2021-07-14 | 東レ株式会社 | 塗布装置及び塗布方法 |
US10573540B2 (en) * | 2016-03-30 | 2020-02-25 | Shibaura Mechatronics Corporation | Substrate processing apparatus and substrate processing method |
US10092926B2 (en) | 2016-06-01 | 2018-10-09 | Arizona Board Of Regents On Behalf Of Arizona State University | System and methods for deposition spray of particulate coatings |
IT201700065691A1 (it) * | 2017-06-14 | 2018-12-14 | Gd Spa | Dispositivo e metodo per applicare un adesivo su un nastro di incarto per un articolo da fumo |
JP7321052B2 (ja) * | 2019-10-17 | 2023-08-04 | 東京エレクトロン株式会社 | 基板処理装置および装置洗浄方法 |
JP6808304B1 (ja) * | 2020-01-14 | 2021-01-06 | 中外炉工業株式会社 | 塗布装置 |
KR102353648B1 (ko) * | 2020-10-21 | 2022-01-21 | 주식회사 나래나노텍 | 기판 인쇄를 위한 슬롯 다이 코팅 장치 및 방법 |
JP2023043964A (ja) * | 2021-09-17 | 2023-03-30 | 株式会社Screenホールディングス | 基板塗布装置および基板塗布方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4067291A (en) * | 1974-04-08 | 1978-01-10 | H. B. Zachry Company | Coating system using tape encapsulated particulate coating material |
DE3014114C2 (de) * | 1980-04-12 | 1982-04-29 | Gema AG Apparatebau, 9015 St. Gallen | Einrichtung zum automatischen Beschichten von Gegenständen mit einer Spritzvorrichtung |
JPH105670A (ja) * | 1996-06-20 | 1998-01-13 | Dainippon Screen Mfg Co Ltd | 処理液供給装置 |
JP2005152716A (ja) * | 2003-11-21 | 2005-06-16 | Seiko Epson Corp | スリットコート式塗布装置及びスリットコート式塗布方法 |
KR100780718B1 (ko) * | 2004-12-28 | 2007-12-26 | 엘지.필립스 엘시디 주식회사 | 도포액 공급장치를 구비한 슬릿코터 |
TWM420152U (en) * | 2011-07-01 | 2012-01-01 | I Hwa Technology Co Ltd | Circuit board automatic spray device |
JP5507523B2 (ja) * | 2011-11-01 | 2014-05-28 | 東京エレクトロン株式会社 | 塗布処理装置、塗布処理方法、プログラム及びコンピュータ記憶媒体 |
-
2014
- 2014-05-26 JP JP2014108415A patent/JP6195806B2/ja not_active Expired - Fee Related
- 2014-10-28 US US14/525,502 patent/US9401291B2/en active Active
- 2014-11-06 TW TW103138615A patent/TWI602620B/zh active
- 2014-11-10 KR KR1020140155610A patent/KR102235382B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI723969B (zh) | 2015-03-20 | 2021-04-11 | 日商精工計時系統有限公司 | 鑽孔裝置 |
Also Published As
Publication number | Publication date |
---|---|
US20150128858A1 (en) | 2015-05-14 |
TW201536429A (zh) | 2015-10-01 |
KR20150055568A (ko) | 2015-05-21 |
US9401291B2 (en) | 2016-07-26 |
TWI602620B (zh) | 2017-10-21 |
JP2015119160A (ja) | 2015-06-25 |
KR102235382B1 (ko) | 2021-04-01 |
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