JP6178877B2 - 非平面印刷回路基板アセンブリを製造するための方法 - Google Patents
非平面印刷回路基板アセンブリを製造するための方法 Download PDFInfo
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- JP6178877B2 JP6178877B2 JP2015563159A JP2015563159A JP6178877B2 JP 6178877 B2 JP6178877 B2 JP 6178877B2 JP 2015563159 A JP2015563159 A JP 2015563159A JP 2015563159 A JP2015563159 A JP 2015563159A JP 6178877 B2 JP6178877 B2 JP 6178877B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10113—Lamp
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
Claims (10)
- 導電性材料及び少なくとも1つの電子部品を支持するための、成形可能な平面基板を提供するステップと、
前記平面基板上に未硬化の導電性材料の回路パターンを印刷するステップと、
前記平面基板及び前記未硬化の導電性材料を非平面形状に成形するステップと、
前記未硬化の導電性材料を硬化するステップと、
を含み、
前記基板は、金属シートと、当該金属シートと前記導電性材料との間に配置される電気絶縁被覆と、を含み、
前記未硬化の導電性材料は、前記回路パターンの導電路が、第1の厚みを有する部分と、当該第1の厚みより大きい第2の厚みを有する部分とを有するように前記平面基板上に印刷され、前記平面基板及び前記未硬化の導電性材料を成形する前記ステップは、前記導電路が前記第2の厚みを有する場所で前記平面基板を折り曲げるステップを含む、
非平面印刷回路基板アセンブリを製造するための方法。 - 前記未硬化の導電性材料は、スクリーン印刷技術を用いて前記平面基板上に印刷される、請求項1に記載の方法。
- 前記未硬化の導電性材料は、インクジェット印刷技術を用いて前記平面基板上に印刷される、請求項1に記載の方法。
- 前記平面基板及び前記未硬化の導電性材料は、真空深絞りによって非平面形状に成形される、請求項1乃至3の何れか一項に記載の方法。
- 前記平面基板は、ヒートシンクの上に前記非平面印刷回路基板アセンブリが取り付けられることが意図される当該ヒートシンクの表面の形状に成形される、請求項1乃至4の何れか一項に記載の方法。
- 前記印刷するステップの前に、前記平面基板上に前記少なくとも1つの電子部品を配置するステップを含む、請求項1乃至5の何れか一項に記載の方法。
- 前記平面基板上の印刷された前記未硬化の導電性材料上に、前記少なくとも1つの電子部品を配置するステップを含む、請求項1乃至5の何れか一項に記載の方法。
- 前記硬化するステップの後に、前記導電性材料が、前記少なくとも1つの電子部品を前記基板に機械的に固定する、請求項7に記載の方法。
- 前記基板に面するヒートシンクの表面の形状を有する前記基板を前記ヒートシンク上に取り付けるステップを更に含む、請求項1に記載の方法。
- 前記電気絶縁被覆は光反射性粒子を含む、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14150070.2 | 2014-01-02 | ||
EP14150070 | 2014-01-02 | ||
PCT/EP2014/078131 WO2015101494A1 (en) | 2014-01-02 | 2014-12-17 | Method for manufacturing a non-planar printed circuit board assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016523445A JP2016523445A (ja) | 2016-08-08 |
JP6178877B2 true JP6178877B2 (ja) | 2017-08-09 |
Family
ID=49955901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015563159A Active JP6178877B2 (ja) | 2014-01-02 | 2014-12-17 | 非平面印刷回路基板アセンブリを製造するための方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9648755B2 (ja) |
EP (1) | EP3090609B1 (ja) |
JP (1) | JP6178877B2 (ja) |
CN (1) | CN105027687B (ja) |
WO (1) | WO2015101494A1 (ja) |
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CN105379432B (zh) * | 2013-07-09 | 2019-06-07 | 飞利浦照明控股有限公司 | 用于制造基于印刷电子技术的印刷电路板组件的方法以及印刷电路板组件 |
US20150257278A1 (en) * | 2014-03-06 | 2015-09-10 | Tactotek Oy | Method for manufacturing electronic products, related arrangement and product |
FR3030687B1 (fr) * | 2014-12-19 | 2017-01-27 | Valeo Vision | Dispositif d'eclairage et/ou de signalisation comportant une pluralite de diodes electroluminescentes |
US10426037B2 (en) | 2015-07-15 | 2019-09-24 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
FR3052594B1 (fr) | 2016-06-10 | 2018-11-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif a piste electriquement conductrice et procede de fabrication du dispositif |
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EP3429322A1 (en) * | 2017-07-11 | 2019-01-16 | OSRAM GmbH | A method for producing support structures for lighting devices and corresponding device |
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-
2014
- 2014-12-17 WO PCT/EP2014/078131 patent/WO2015101494A1/en active Application Filing
- 2014-12-17 CN CN201480011708.5A patent/CN105027687B/zh active Active
- 2014-12-17 EP EP14812556.0A patent/EP3090609B1/en active Active
- 2014-12-17 US US14/772,888 patent/US9648755B2/en active Active
- 2014-12-17 JP JP2015563159A patent/JP6178877B2/ja active Active
Also Published As
Publication number | Publication date |
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CN105027687A (zh) | 2015-11-04 |
EP3090609B1 (en) | 2017-06-28 |
EP3090609A1 (en) | 2016-11-09 |
CN105027687B (zh) | 2017-03-08 |
WO2015101494A1 (en) | 2015-07-09 |
US20160316570A1 (en) | 2016-10-27 |
US9648755B2 (en) | 2017-05-09 |
JP2016523445A (ja) | 2016-08-08 |
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