JP6178347B2 - 熱可塑性組成物 - Google Patents
熱可塑性組成物 Download PDFInfo
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Description
a)熱可塑性樹脂と、
b)レーザダイレクトストラクチャリング添加剤であって、総組成物の重量に関して少なくとも1wt%の量であり、少なくともスズ、ならびにアンチモン、ビスマス、アルミニウムおよびモリブデンからなる群から選択される第2金属を含む混合金属酸化物を含み、少なくとも40wt%のスズを含み、そして第2金属の、スズに対する重量比が低くとも0.02:1である、LDS添加剤と
を含むという点で達成される。
−R1−O−CO−O− (I)
式中、R1基は、芳香族、脂肪族、または脂環式ラジカルである。有益には、R1は芳香族有機ラジカルであり、そして別の実施形態において、式(II)のラジカルであり:
−A1−Y1−A2− (II)
式中、A1およびA2はそれぞれ、単環式二価アリールラジカルであり、Y1は、A1をA2から隔てるゼロ、1つまたは2つの原子を有するブリッジングラジカルである。例示的な実施形態において、1つの原子がA1をA2から隔てる。この種のラジカルの実例として、−O−、−S−、−S(O)−、−S(O2)−、−C(O)−、メチレン、シクロヘキシル−メチレン、2−[2,2,1]−ビシクロヘプチリデン、エチリデン、イソプロピリデン、ネオペンチリデン、シクロヘキシリデン、シクロペンタデシリデン、シクロドデシリデン、アダマンチリデン等がある。別の実施形態において、ゼロ原子がA1をA2から隔て、実例としてビスフェノールがある。ブリッジングラジカルY1として、炭化水素基または飽和炭化水素基(メチレン、シクロヘキシリデンまたはイソプロピリデン等)があり得る。
表4は、PC−ABS組成物中の7つの異なるタイプのLDS添加剤の効果を示す。
表5は、PC−ABS組成物中の異なるタイプのLDS添加剤の、めっき性能に及ぼす効果を示す。
表6は、PC組成物中の異なるタイプのLDS添加剤の、めっき性能に及ぼす効果を示す。
表7は、PC−ABS組成物中のLDS添加剤およびTiO2の量の、めっき性能に及ぼす効果を示している。
Claims (20)
- レーザダイレクトストラクチャリングプロセスに用いられる熱可塑性組成物であって:
a)熱可塑性樹脂と、
b)レーザダイレクトストラクチャリング(LDS)添加剤であって、前記組成物の総重量に関して少なくとも1wt%の量であり、
少なくともスズ、ならびにアンチモン、ビスマス、アルミニウムおよびモリブデンからなる群から選択される第2金属を含む混合金属酸化物を含み、
少なくとも40wt%のスズを含み、そして
前記第2金属の、スズに対する重量比が低くとも0.02:1である、レーザダイレクトストラクチャリング添加剤と
を含む熱可塑性組成物。 - 前記レーザダイレクトストラクチャリング添加剤は、粒子サイズD90が、ISO13320−1:1999に従った光散乱技術によって決定されて、大きくとも10μmである、請求項1に記載の熱可塑性組成物。
- 前記レーザダイレクトストラクチャリング添加剤は、粒子サイズD90が、ISO13320−1:1999に従った光散乱技術によって決定されて、大きくとも2.5μmである、請求項1に記載の熱可塑性組成物。
- 前記第2金属の、スズに対する前記重量比は、高くとも0.2:1である、請求項1から3のいずれか一項に記載の熱可塑性組成物。
- 前記第2金属の、スズに対する重量比が高くとも0.05:1である、請求項1から4のいずれか一項に記載の熱可塑性樹脂組成物。
- 前記熱可塑性樹脂は、誘電正接が、ASTM D−2520、Method Bに従って測定されて、2GHzにて高くとも0.009である、請求項1から5の何れか一項に記載の熱可塑性組成物。
- 前記混合金属酸化物は、前記混合金属酸化物中に存在する金属の総重量に関して、前記総重量の少なくとも60wt%のスズおよび前記第2金属を含む、請求項1から6の何れか一項に記載の熱可塑性組成物。
- 前記混合金属酸化物は、酸化アンチモンスズである、請求項1から7の何れか一項に記載の熱可塑性組成物。
- 前記レーザダイレクトストラクチャリング添加剤は、前記レーザダイレクトストラクチャリング添加剤の総重量に関して、少なくとも50wt%の前記混合金属酸化物を含む、請求項1から8の何れか一項に記載の熱可塑性組成物。
- 前記熱可塑性樹脂は、ポリカーボネート系樹脂である、請求項1から9の何れか一項に記載の熱可塑性組成物。
- 前記熱可塑性組成物は、前記熱可塑性樹脂を、前記組成物の前記総重量に関して、45wt%から99wt%の間の量で含む、請求項1から10の何れか一項に記載の熱可塑性組成物。
- 前記熱可塑性組成物は、前記熱可塑性樹脂を、前記組成物の前記総重量に関して、70wt%から97wt%の間の量で含む、請求項1から11の何れか一項に記載の熱可塑性組成物。
- 前記熱可塑性組成物は、前記レーザダイレクトストラクチャリング添加剤を、前記組成物の前記総重量に関して、2wt%から25wt%の間の量で含む、請求項1から12の何れか一項に記載の熱可塑性組成物。
- 前記熱可塑性組成物は、前記レーザダイレクトストラクチャリング添加剤を、前記組成物の前記総重量に関して、5wt%から10wt%の間の量で含む、請求項1から13の何れか一項に記載の熱可塑性組成物。
- 前記熱可塑性組成物中のアンチモンの量は、700ppm未満であり、そして前記熱可塑性組成物は、少なくとも10wt%のTiO2を含む、請求項1から14の何れか一項に記載の熱可塑性組成物。
- 前記請求項1から請求項15の何れか一項に記載の熱可塑性組成物を含有する成形部品。
- 回路キャリアを生産するプロセスであって、請求項16に記載の成形部品を与える工程と;導電トラックが形成されることとなる前記部品の領域にレーザ放射線を照射する工程と;続いて、照射を受けた前記領域を金属化する工程とを含む、プロセス。
- 前記請求項17に記載のプロセスによって得られる回路キャリア。
- 前記請求項18に記載の回路キャリアを含むアンテナ。
- レーザダイレクトストラクチャリングプロセスにおけるレーザダイレクトストラクチャリング添加剤としての混合金属酸化物の使用であって、前記混合金属酸化物は、少なくともスズ、ならびにアンチモン、ビスマス、アルミニウムおよびモリブデンからなる群から選択される第2金属を含み、前記レーザダイレクトストラクチャリング添加剤は、少なくとも40wt%のスズを含み、そして前記第2金属の、スズに対する重量比は低くとも0.02:1である、使用。
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EP12159858.5 | 2012-03-16 | ||
EP12159858.5A EP2639262A1 (en) | 2012-03-16 | 2012-03-16 | Thermoplastic composition |
PCT/EP2013/055401 WO2013076314A1 (en) | 2012-03-16 | 2013-03-15 | Thermoplastic composition |
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JP2014561466A Active JP6178347B2 (ja) | 2012-03-16 | 2013-03-15 | 熱可塑性組成物 |
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---|---|
US (2) | US9688835B2 (ja) |
EP (2) | EP2639262A1 (ja) |
JP (1) | JP6178347B2 (ja) |
KR (1) | KR102035368B1 (ja) |
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JP6310240B2 (ja) * | 2013-11-21 | 2018-04-11 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用熱可塑性樹脂組成物、樹脂成形品、および樹脂成形品の製造方法 |
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-
2012
- 2012-03-16 EP EP12159858.5A patent/EP2639262A1/en not_active Withdrawn
-
2013
- 2013-03-15 KR KR1020147028848A patent/KR102035368B1/ko active IP Right Grant
- 2013-03-15 CN CN201380014636.5A patent/CN104169348B/zh active Active
- 2013-03-15 US US14/385,281 patent/US9688835B2/en active Active
- 2013-03-15 WO PCT/EP2013/055401 patent/WO2013076314A1/en active Application Filing
- 2013-03-15 JP JP2014561466A patent/JP6178347B2/ja active Active
- 2013-03-15 EP EP13709238.3A patent/EP2825588B1/en active Active
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Also Published As
Publication number | Publication date |
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EP2825588B1 (en) | 2016-04-27 |
US9688835B2 (en) | 2017-06-27 |
KR20140135248A (ko) | 2014-11-25 |
CN104169348A (zh) | 2014-11-26 |
CN104169348B (zh) | 2016-06-29 |
EP2639262A1 (en) | 2013-09-18 |
US20170208685A1 (en) | 2017-07-20 |
JP2015520775A (ja) | 2015-07-23 |
WO2013076314A1 (en) | 2013-05-30 |
KR102035368B1 (ko) | 2019-10-22 |
EP2825588A1 (en) | 2015-01-21 |
US20150035720A1 (en) | 2015-02-05 |
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