JP5437539B2 - 回路基板の製造方法 - Google Patents
回路基板の製造方法 Download PDFInfo
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- JP5437539B2 JP5437539B2 JP2013532232A JP2013532232A JP5437539B2 JP 5437539 B2 JP5437539 B2 JP 5437539B2 JP 2013532232 A JP2013532232 A JP 2013532232A JP 2013532232 A JP2013532232 A JP 2013532232A JP 5437539 B2 JP5437539 B2 JP 5437539B2
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- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- LKCUKVWRIAZXDU-UHFFFAOYSA-L zinc;hydron;phosphate Chemical compound [Zn+2].OP([O-])([O-])=O LKCUKVWRIAZXDU-UHFFFAOYSA-L 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/16—Chemical modification with polymerisable compounds
- C08J7/18—Chemical modification with polymerisable compounds using wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K3/2279—Oxides; Hydroxides of metals of antimony
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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- Manufacturing Of Printed Wiring (AREA)
Description
a)熱可塑性樹脂と、
b)組成物全体の重量に対して少なくとも1重量%の量であり、アンチモンドープ酸化錫を含み、CIELab表色系L*値が少なくとも45であるレーザーダイレクトストラクチャリング添加剤
を含有する熱可塑性組成物を含む成形部品を準備する工程と、
導電性トラックを形成しようとする前記部品の領域にレーザー光を照射した後に、照射領域を金属化する工程
を含む回路基板の製造方法により達成される。
−R1−O−CO−O− (I)
の構造単位をもつ組成物が挙げられ、上記式中、R1基は芳香族、脂肪族又は脂環式基である。R1は芳香族有機基であると有益であり、代替実施形態では式(II):
−A1−Y1−A2− (II)
の基であり、上記式中、A1及びA2は各々単環式二価アリール基であり、Y1はA1をA2から分離する0、1又は2個の原子をもつ架橋基である。典型的な1実施形態では、1個の原子がA1をA2から分離する。この種の基の具体例は−O−、−S−、−S(O)−、−S(O2)−、−C(O)−、メチレン、シクロヘキシルメチレン、2−[2,2,1]−ビシクロヘプチリデン、エチリデン、イソプロピリデン、ネオペンチリデン、シクロヘキシリデン、シクロペンタデシリデン、シクロドデシリデン、アダマンチリデン等である。別の実施形態では、0個の原子がA1をA2から分離し、具体例はビスフェノールである。架橋基Y1は炭化水素基又は飽和炭化水素基とすることができ、例えばメチレン、シクロヘキシリデン又はイソプロピリデンである。
表3は比較例(CEx)1及び2と実施例(Ex)1及び2の組成と結果を示す。
CEx1、2とEx1、2から明らかなように、PCとABSとMBSを含有するポリカーボネート組成物ではアンチモンドープ酸化錫をコーティングしたマイカ(LDS添加剤2)をCuCr2O4(LDS添加剤1)の代わりにレーザーダイレクトストラクチャリング添加剤として使用することができる。組成物をレーザーストラクチャリングすることができ、満足なレベルまでメッキが行われる。
Ex1及び2から分かるように、LDS添加剤2の量を増やすと、特にメッキ出力が低い場合にメッキ性能が改善される。
表4は比較例(CEx)3と実施例(Ex)3及び4の組成と結果を示す。
CEx3とEx3、4から分かるように、PCを含有しており、ABS又はMBSを含有しないポリカーボネート組成物ではアンチモンドープ酸化錫をコーティングしたマイカ(LDS添加剤2)をCuCr2O4の代わりにレーザーダイレクトストラクチャリング添加剤として使用することができる。組成物をレーザーストラクチャリングすることができ、満足なレベルまでメッキが行われる。
Ex3、4を比較すると分かるように、白色顔料をLDS添加剤2に加えると、特にメッキ出力が低い場合にメッキ性能が改善される。
Ex3が示すように、LDS添加剤1は白色顔料を使用しなくても高い色値L*を生じる。
ノッチ付きアイゾット衝撃強度はABS/MBSをPCと併用することにより改善される。
表5は比較例(CEx)1、2及び4と実施例(Ex)5〜7の組成と結果を示す。
CEx1、2及びEx5〜7が示すように、PCとABSとMBSを含有するポリカーボネート組成物ではアンチモンドープ酸化錫をコーティングしたマイカ(LDS添加剤2)をCuCr2O4(LDS添加剤1)の代わりにレーザーダイレクトストラクチャリング添加剤として使用することができる。組成物をレーザーストラクチャリングすることができ、満足なレベルまでメッキが行われる。
白色顔料を添加すると、特にメッキ出力が低い場合にメッキ性能は著しく改善される。
LDS添加剤1の代わりにLDS添加剤2を使用すると、色値L*は著しく高くなる。
CEx4から明らかなように、LDS添加剤を添加しない場合には色値L*は非常に高いが、メッキは行われない。マイカと白色顔料は単独ではLDS添加剤として機能しない。
ノッチ付きアイゾット衝撃強度は全サンプルで妥当なレベルである。
表6は比較例(CEx)5〜6の組成と結果を示す。
CEx5から明らかなように、錫を含有せず、ビスマスを含有するレーザーマーキング添加剤はLDS添加剤として機能しない。
CEx6から明らかなように、LDS添加剤を添加しない場合には色値L*は非常に高いが、メッキは行われない。従って、赤外線吸収はメッキが行われるために十分ではない。
Claims (13)
- a)熱可塑性樹脂と、
b)組成物全体の重量に対して少なくとも1重量%の量であり、アンチモンドープ酸化錫を含み、CIELab表色系L*値が少なくとも45であるレーザーダイレクトストラクチャリング添加剤
を含有する熱可塑性組成物を含む成形部品を準備する工程と、
導電性トラックを形成しようとする前記部品の領域にレーザー光を照射した後に、照射領域を金属化する工程
を含む回路基板の製造方法。 - 前記熱可塑性樹脂がポリカーボネート系樹脂である請求項1に記載の方法。
- 前記熱可塑性組成物が前記熱可塑性樹脂を組成物全体の重量に対して45重量%〜99重量%の量で含有する請求項1又は2に記載の方法。
- 前記レーザーダイレクトストラクチャリング添加剤はCIELab表色系L*値が少なくとも50である請求項1から3のいずれか一項に記載の方法。
- 前記レーザーダイレクトストラクチャリング添加剤はCIELAB表色系a*値が−10〜+10であり、b*値が−10〜+10である請求項1から4のいずれか一項に記載の方法。
- 前記レーザーダイレクトストラクチャリング添加剤がアンチモンドープ酸化錫をコーティングしたマイカを含む請求項1から5のいずれか一項に記載の方法。
- 前記熱可塑性組成物が前記レーザーダイレクトストラクチャリング添加剤を組成物全体の重量に対して2重量%〜25重量%までの量で含有する請求項1から6のいずれか一項に記載の方法。
- 更にc)顔料を含有する請求項1から7のいずれか一項に記載の方法。
- 前記顔料がTiO2、BaSO4又はZnOから構成される群から選択される白色顔料を含む請求項8に記載の方法。
- 前記熱可塑性組成物が前記顔料を組成物全体の重量に対して少なくとも5重量%の量で含有する請求項8又は9に記載の方法。
- 更にd)マイカ、タルク及びウォラストナイトから構成される群から選択される無機充填剤を含有する請求項1から10のいずれか一項に記載の方法。
- 請求項1から11のいずれか一項に記載の方法により取得可能な回路基板。
- a)熱可塑性樹脂と、b)組成物全体の重量に対して少なくとも1重量%の量であり、アンチモンドープ酸化錫を含み、CIELab表色系L*値が少なくとも45であるレーザーダイレクトストラクチャリング添加剤を含有する熱可塑性組成物から回路基板を製造するレーザーダイレクトストラクチャリング法においてメッキ性能を改善させるためにTiO 2 を前記熱可塑性組成物に添加することを含む、TiO2の使用。
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PCT/EP2012/054667 WO2012126831A1 (en) | 2011-03-18 | 2012-03-16 | Process for producing a circuit carrier |
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EP2632978B1 (en) | 2010-10-25 | 2021-02-24 | SABIC Innovative Plastics B.V. | Improved electroless plating performance of laser direct structuring materials |
US20120276390A1 (en) * | 2010-10-26 | 2012-11-01 | Sabic Innovative Plastics Ip B.V. | Laser direct structuring materials with all color capability |
JP5947577B2 (ja) * | 2011-12-14 | 2016-07-06 | 三菱エンジニアリングプラスチックス株式会社 | 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法 |
EP2639262A1 (en) * | 2012-03-16 | 2013-09-18 | Mitsubishi Chemical Europe GmbH | Thermoplastic composition |
US20140142571A1 (en) * | 2012-11-21 | 2014-05-22 | Ticona Llc | Liquid Crystalline Polymer Composition for Melt-Extruded Substrates |
DE102013100016A1 (de) * | 2013-01-02 | 2014-07-03 | Lpkf Laser & Electronics Ag | Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einem nichtleitenden Trägermaterial sowie ein hierzu bestimmtes Additiv und Trägermaterial |
US8816019B2 (en) * | 2013-01-07 | 2014-08-26 | Sabic Global Technologies B.V. | Thermoplastic compositions for laser direct structuring and methods for the manufacture and use thereof |
US20140296411A1 (en) * | 2013-04-01 | 2014-10-02 | Sabic Innovative Plastics Ip B.V. | High modulus laser direct structuring composites |
KR20140124918A (ko) * | 2013-04-02 | 2014-10-28 | 김한주 | 레이저 직접 구조화 공정용 조성물 |
KR101339640B1 (ko) * | 2013-04-02 | 2013-12-09 | 김한주 | 레이저 직접 구조화 방법 |
KR101574736B1 (ko) * | 2013-04-26 | 2015-12-07 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
DE102013007750A1 (de) * | 2013-05-07 | 2014-11-13 | Merck Patent Gmbh | Additiv für LDS-Kunststoffe |
WO2014185217A1 (ja) | 2013-05-13 | 2014-11-20 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法 |
CN104178751A (zh) * | 2013-05-23 | 2014-12-03 | 比亚迪股份有限公司 | 一种聚合物制品表面选择性金属化方法和一种聚合物制品 |
EP3004227B1 (en) * | 2013-06-04 | 2019-07-24 | SABIC Global Technologies B.V. | Thermally conductive polymer compositions with laser direct structuring function |
JP5710826B2 (ja) * | 2013-07-09 | 2015-04-30 | 三菱エンジニアリングプラスチックス株式会社 | 樹脂組成物、樹脂成形品、樹脂成形品の製造方法およびレーザーダイレクトストラクチャリング添加剤 |
CN105518180B (zh) * | 2013-09-05 | 2019-02-05 | 三菱工程塑料株式会社 | 热塑性树脂组合物、树脂成型品、以及带有镀敷层的树脂成型品的制造方法 |
CN105452526B (zh) * | 2013-10-07 | 2017-09-19 | 三菱工程塑料株式会社 | 树脂组合物、树脂成型品和树脂成型品的制造方法 |
JP5917742B2 (ja) * | 2013-10-24 | 2016-05-18 | 三菱エンジニアリングプラスチックス株式会社 | 樹脂組成物、樹脂成形品、および樹脂成形品の製造方法 |
JP5847907B2 (ja) * | 2013-10-24 | 2016-01-27 | 三菱エンジニアリングプラスチックス株式会社 | 樹脂組成物、樹脂成形品、および樹脂成形品の製造方法 |
JP6564704B2 (ja) * | 2013-11-18 | 2019-08-21 | 三菱エンジニアリングプラスチックス株式会社 | 樹脂成形品の製造方法 |
JP6310240B2 (ja) * | 2013-11-21 | 2018-04-11 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用熱可塑性樹脂組成物、樹脂成形品、および樹脂成形品の製造方法 |
US20170002193A1 (en) * | 2013-11-27 | 2017-01-05 | Sabic Global Technologies B.V. | High modulus laser direct structuring polycarbonate composites with enhanced plating performance and broad laser window by reflection additives |
KR101717753B1 (ko) * | 2013-11-29 | 2017-03-17 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
EP2886605B2 (de) | 2013-12-20 | 2021-09-01 | Ems-Chemie Ag | Kunststoffformmasse und deren Verwendung |
KR101631701B1 (ko) | 2013-12-30 | 2016-06-24 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체 |
CN103757615B (zh) * | 2014-01-27 | 2014-11-19 | 比亚迪股份有限公司 | 聚合物基材表面选择性金属化方法及由该方法得到的表面具有金属化图案的聚合物基材 |
WO2015110089A1 (en) * | 2014-01-27 | 2015-07-30 | Byd Company Limited | Method for metalizing polymer substrate and polymer article prepared thereof |
EP3129434A1 (en) | 2014-04-07 | 2017-02-15 | Mitsubishi Chemical Europe GmbH | Thermoplastic composition |
DE102014008963A1 (de) | 2014-06-23 | 2016-01-07 | Merck Patent Gmbh | Additiv für LDS-Kunststoffe |
WO2016003588A1 (en) * | 2014-07-01 | 2016-01-07 | Ticona Llc | Laser activatable polymer composition |
KR101865827B1 (ko) * | 2014-09-04 | 2018-06-08 | 비와이디 컴퍼니 리미티드 | 절연 기재를 선택적으로 금속화시키기 위한 중합체 조성물, 잉크 조성물 및 방법 |
EP3189268A1 (en) * | 2014-09-05 | 2017-07-12 | DSM IP Assets B.V. | A light emitting diode based daylight running light |
CN104387738B (zh) * | 2014-11-19 | 2016-08-17 | 东莞市三条化成实业有限公司 | 一种白色激光直接成型材料用的激光粉的制备方法 |
TWI507459B (zh) * | 2015-02-12 | 2015-11-11 | Taiflex Scient Co Ltd | 可形成金屬線路的樹脂組合物 |
KR20160129974A (ko) | 2015-04-30 | 2016-11-10 | 롯데첨단소재(주) | 폴리카보네이트 수지 조성물 및 이를 이용한 성형품 |
CN107849291A (zh) * | 2015-07-30 | 2018-03-27 | 沙特基础工业全球技术公司 | 经由添加光可渗透的着色剂展现改善的金属粘合强度的材料 |
WO2017038409A1 (ja) * | 2015-09-03 | 2017-03-09 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用ポリエステル系樹脂組成物 |
WO2017186972A1 (en) | 2016-08-22 | 2017-11-02 | Mep Europe B.V. | Thermoplastic composition for laser direct structuring |
CN106751389B (zh) * | 2016-11-30 | 2019-03-26 | 上海中镭新材料科技有限公司 | 一种浅色的用于lds技术的工程塑料及其制备方法 |
CN110300778A (zh) | 2017-01-11 | 2019-10-01 | 沙特基础工业全球技术公司 | 通过芯-壳结构lds添加剂与涂覆在矿物填料表面上的金属化合物而具有导热性和激光电镀性能的组合物 |
WO2018141769A1 (de) | 2017-02-03 | 2018-08-09 | Merck Patent Gmbh | Additiv für lds-kunststoffe |
DE102017106911A1 (de) | 2017-03-30 | 2018-10-04 | Chemische Fabrik Budenheim Kg | Verwendung von kristallwasserfreien Fe(II)-Verbindungen als Strahlungsabsorber |
DE102017106913A1 (de) * | 2017-03-30 | 2018-10-04 | Chemische Fabrik Budenheim Kg | Verfahren zur Herstellung von elektrisch leitenden Strukturen auf einem Trägermaterial |
WO2019042906A1 (de) | 2017-08-29 | 2019-03-07 | Merck Patent Gmbh | Laseradditiv und additiv für lds-kunststoffe |
KR102094590B1 (ko) * | 2018-01-29 | 2020-03-27 | 롯데첨단소재(주) | 폴리카보네이트 수지 조성물 및 이를 이용한 성형품 |
KR20210104802A (ko) | 2018-12-19 | 2021-08-25 | 엠이피 유럽 비.브이. | 레이저 직접 구조화를 위한 열가소성 조성물 |
US20220159843A1 (en) * | 2019-03-28 | 2022-05-19 | Shpp Global Technologies B.V. | Multilayer Sheets, Methods of Manufacture, and Articles Formed Therefrom |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1008038A5 (fr) † | 1994-01-31 | 1996-01-03 | Lucien Diego Laude | Procede de metallisation de matieres plastiques, et produits ainsi obtenus. |
JP3655979B2 (ja) * | 1996-10-30 | 2005-06-02 | テクノポリマー株式会社 | 熱可塑性樹脂組成物 |
US6693657B2 (en) † | 2001-04-12 | 2004-02-17 | Engelhard Corporation | Additive for YAG laser marking |
DE10132092A1 (de) | 2001-07-05 | 2003-01-23 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und Verfahren zu ihrer Herstellung |
CN1326435C (zh) * | 2001-07-05 | 2007-07-11 | Lpkf激光和电子股份公司 | 导体轨道结构的制造方法 |
DE10136479A1 (de) * | 2001-07-27 | 2003-02-06 | Merck Patent Gmbh | Farbige Beschriftung und Markierung von Kunststoffen und Lacken |
DK1664172T3 (da) † | 2003-09-17 | 2007-05-07 | Clariant Finance Bvi Ltd | Lasermarkerbare polymersammensætninger |
DE102004045305A1 (de) * | 2004-09-16 | 2006-03-23 | Merck Patent Gmbh | Lasermarkierbare und laserschweißbare polymere Materialien |
US20060083939A1 (en) * | 2004-10-20 | 2006-04-20 | Dunbar Meredith L | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
US7704586B2 (en) | 2005-03-09 | 2010-04-27 | Degussa Ag | Plastic molded bodies having two-dimensional and three-dimensional image structures produced through laser subsurface engraving |
EP2178976B2 (en) | 2007-08-17 | 2021-11-17 | Mitsubishi Chemical Europe GmbH | Aromatic polycarbonate composition |
US8309640B2 (en) * | 2008-05-23 | 2012-11-13 | Sabic Innovative Plastics Ip B.V. | High dielectric constant laser direct structuring materials |
US8492464B2 (en) | 2008-05-23 | 2013-07-23 | Sabic Innovative Plastics Ip B.V. | Flame retardant laser direct structuring materials |
EP2233519B1 (de) * | 2009-03-27 | 2011-08-31 | LANXESS Deutschland GmbH | Glühdrahtbeständige Polyester |
US20120276390A1 (en) * | 2010-10-26 | 2012-11-01 | Sabic Innovative Plastics Ip B.V. | Laser direct structuring materials with all color capability |
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- 2012-03-16 US US13/822,973 patent/US20130168133A1/en not_active Abandoned
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CN103154135B (zh) | 2014-10-15 |
US20130168133A1 (en) | 2013-07-04 |
EP2596064A1 (en) | 2013-05-29 |
WO2012126831A1 (en) | 2012-09-27 |
CN103154135A (zh) | 2013-06-12 |
KR101490641B1 (ko) | 2015-02-05 |
EP2596064B1 (en) | 2014-02-12 |
KR20130056306A (ko) | 2013-05-29 |
EP2596064B2 (en) | 2017-06-28 |
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