JP6151245B2 - 伸縮性放熱シート及びこれが貼付された物品 - Google Patents
伸縮性放熱シート及びこれが貼付された物品 Download PDFInfo
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- JP6151245B2 JP6151245B2 JP2014515676A JP2014515676A JP6151245B2 JP 6151245 B2 JP6151245 B2 JP 6151245B2 JP 2014515676 A JP2014515676 A JP 2014515676A JP 2014515676 A JP2014515676 A JP 2014515676A JP 6151245 B2 JP6151245 B2 JP 6151245B2
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Adhesive Tapes (AREA)
Description
なお、前記アミン変性エポキシ樹脂およびアミン・ウレタン変性エポキシ樹脂としては、例えば特開2010−235918号公報に記載のものを使用できる。
市販のポリエステル樹脂(商品名:アラキード7005N、荒川化学工業(株)製、引張伸び率550%)65重量部、ブチル化メラミン樹脂(商品名:ユーバン228、三井化学(株)製)8重量部、酸化チタン粉末(商品名:TI TONE R−32、堺化学工業(株)製、平均一次粒子径0.2μm以下)16重量部、炭化ケイ素粉末(商品名:シナノランダムGP−3000、信濃電気製錬(株)製、平均一次粒子径4.0μm以下)2重量部、窒化ホウ素粉末(商品名:Boronid S3、ESK CERAMICS社製、平均一次粒子径10.0μm以下)2重量部、触媒としてジノニルナフタレンジスルフォン酸アミン塩0.5重量部を混合して、樹脂組成物Iを調製した。この樹脂組成物Iを用いて、乾燥後の膜厚が30μm〜40μm程度となるように、離型処理を施したポリエチレンテレフタレートフィルム(厚さ75μm)に、アプリケーターで塗布した。約5分間室内で放置した後、乾燥器中にて120℃で30分間、乾燥を行った後、上記フィルムを剥離して、放熱層としてのシート状硬化物を得た。
使用する各成分の種類および使用量を、後記表1又は表2に記載のとおりに変更した他は製造例1と同様にして、放熱層としてのシート状硬化物を得た。
製造例1〜14の各シートより、JIS K 7312で定める成型物の物理試験方法に準拠して、10mm×123mm×0.03〜0.10mmの短冊形試験片を作製し、標線間距離10mmとして、精密万能試験機(製品名:オートグラフ AGS−X、(株)島津製作所製)を用いて100%に伸ばした。そして、形状が保持されている場合は◎と、一部変形がある場合は○と、大きく変形または破断した場合は×とした。
製造例1〜14の各シートより、JIS K 7312で定める成型物の物理試験方法に準拠して、10mm×123mm×0.03〜0.10mmの短冊形試験片を作製し、標線間距離10mmとして、精密万能試験機(製品名:オートグラフ AGS−X、(株)島津製作所製)を用いて、引張速度5mm/minで、切断時の伸び(%)の測定を行った。
製造例1〜14の各シートを、アルミニウム板(A10.5P、サイズ:2.0mm×50mm×120mm)の片面の中心に、熱伝導性両面テープ(製品名:NO.5046 熱伝導性テープ、マクセルスリオンテック(株)製)で貼付した。硬化物を貼付したアルミニウム板の裏側の中心に、熱源として抵抗器(シャント抵抗器、PCN社製、型番PBH1ΩD、定格電力10W、サイズ:長さ20mm×幅15mm×厚さ5mm)を、上記両面テープで固定した。熱源には一定の電流(2.82A)を印加して、1.0〜1.5時間経過後、平衡状態となったシート面の温度を約70℃とした。熱放射率測定には、サーモグラフィー(製品名:サーモギアG100、NEC Avio赤外線テクノロジー(株)製)を用いた。放射率が0.95の黒体テープ0.5mm×0.5mmをシート面中心に貼付、サーモグラフィーの熱放射率設定を黒体テープの放射率(0.95)にし、黒体テープ貼付部の温度を測定。その後、解析ソフトで(製品名:InfReC Analyzer NS9500 Standard
Ver.1.1A、NEC Avio赤外線テクノロジー(株)製)黒体テープの貼付面側の放熱層面の温度が黒体テープ面と同じ温度となるように熱放射率設定の調整を行ない、そのときの熱放射率を放熱層の測定値とした。
アクリル系ポリマー粘着剤(商品名:ファインタック CT−6010、DIC(株)製、不揮発分25重量%、溶剤:酢酸エチル)を、粘着剤組成物IIとして用いた。この組成物を、乾燥後の膜厚が20〜30μmとなるように、離型処理を施したポリエチレンテレフタレートフィルム(厚さ75μm)に、アプリケーターで塗布した。約5分間室内で放置した後、乾燥器中にて100℃で3分間乾燥を行い、更に40℃で72時間エージングを行った後、ポリエチレンテレフタレートフィルムを剥離して、粘着層としてのシート状硬化物を得た。
使用する粘着剤組成物IIとして、後記表2に記載の粘着剤又は成分組成のものを用いた他は製造例15と同様にして、粘着層としてのシート状硬化物を得た。
粘着層としてのシート状硬化物を、JIS K 7312で定める成型物の物理試験方法に準拠して、10mm×123mm×0.01〜0.15mmの短冊形に加工、標線間距離10mmとして、200%に伸ばした後の形状を保持できるか確認した。形状を保持できる場合は◎、一部変形がある場合は○、大きく変形または破断した場合は×とした。
粘着層としてのシート状硬化物を、JIS K 7312で定める成型物の物理試験方法に準拠して、10mm×123mm×0.01〜0.15mmの短冊形に加工、標線間距離10mmとして、精密万能試験機(製品名:オートグラフ AGS−X、(株)島津製作所製)を用いて、引張速度5mm/minで、切断時の伸び(%)の測定を行った。
製造例1〜14で得られた放熱層である硬化物シートと製造例15〜20で得られた粘着層としてのシート状硬化物とを圧着して、2層構造の放熱シートを作製した。得られた放熱シートの物性として、伸び率、伸縮性、密着性、70℃熱放射率、及び放熱性を、下記方法によって、測定した。
実施例1〜26の放熱シートについて、JIS K 7312で定める成型物の物理試験方法に準拠して、10mm×123mm×0.05〜0.2mmの短冊形に加工、標線間距離10mmとして、100%に伸ばした後の形状を保持できるか確認した。形状を保持できる場合は◎、一部変形がある場合は○、大きく変形または破断した場合は×とした。
アルミニウム板(A10.5P、サイズ:10.0mm×50mm×120mm)の表面に幅10mm、深さ5mmの溝加工を長さ方向に垂直で10mm間隔で行い、加工面に実施例1〜26の放熱シートを貼付して密着性を確認した。貼付後、加工面と放熱シート間に隙間があまり生じていない状態を◎、やや隙間が生じる場合は○、大きな隙間が生じて放熱シートが加工面に追従できていないと判断された場合は×とした。
放熱シートを、JIS K 7312で定める成型物の物理試験方法に準拠して、10mm×123mm×0.05〜0.2mmの短冊形に加工、標線間距離10mmとして、精密万能試験機(製品名:オートグラフ AGS−X、(株)島津製作所製)を用いて、引張速度5mm/minで、切断時の伸び(%)の測定を行った。
放熱シートを、アルミニウム板(A10.5P、サイズ:2.0mm×50mm×120mm)の片面の中心に、熱伝導性両面テープ(商品名:NO.5046 熱伝導性テープ、マクセルスリオンテック(株)製)で貼付した。上記シートを貼付したアルミニウム板の裏側の中心に、熱源として抵抗器(シャント抵抗器、PCN社製、型番PBH1ΩD、定格電力10W、サイズ:長さ20mm×幅15mm×厚さ5mm)を、上記両面テープで固定した。熱源には一定の電流(2.82A)を印加して1.0〜1.5時間経過後、平衡状態となったシート面の温度を約70℃とした。を約70℃とした。熱放射率測定には、サーモグラフィー(製品名:サーモギアG100、NEC Avio赤外線テクノロジー(株)製)を用いた。放射率が0.95の黒体テープ0.5mm×0.5mmをシート面中心に貼付、サーモグラフィーの熱放射率設定を黒体テープの放射率(0.95)にし、黒体テープ貼付部の温度を測定。その後、解析ソフトで(製品名:InfReC Analyzer NS9500 Standard Ver.1.1A、NEC Avio赤外線テクノロジー(株)製)黒体テープの貼付面側の放熱シート面の温度が黒体テープ面と同じ温度となるように熱放射率設定の調整を行ない、そのときの熱放射率を放熱シートの測定値とした。
アルミニウム板(A10.5P、サイズ:10.0mm×50mm×120mm)の表面に幅10mm、深さ5mmの溝加工を長さ方向に垂直で10mm間隔で行い、加工面に実施例1〜22の放熱シートを貼付した。裏面の中心に、熱源として抵抗器(シャント抵抗器、PCN社製、型番PBH1ΩD、定格電力10W、サイズ:長さ20mm×幅15mm×厚さ5mm)を、熱伝導性両面テープ(商品名:NO.5046 熱伝導性テープ、マクセルスリオンテック(株)製)で固定した。熱源には一定の電流(3.2A)を印加して1.0〜1.5時間経過後、平衡状態となった熱源の温度を約100℃とした。熱源の温度測定にはK熱電対を使用した。放熱シート未貼付の場合と比較して、10℃以上の温度低下となった場合は◎、7〜10℃未満を○、7℃未満を×とした。
使用する各成分の種類および使用量を、後記表10に記載のとおりに変更した他は製造例1と同様にして、放熱層である硬化物シートを得た。
使用する各成分の種類および使用量を、後記表11に記載のとおりに変更した他は製造例15と同様にして、粘着層としてのシート状硬化物を得た。
比較製造例1〜2で得られた放熱層である硬化物シートと比較製造例3〜4で得られた粘着層としてのシート状硬化物とを圧着して、2層構造の比較用の放熱シートを作製した。得られた放熱シートの物性として、伸び率、接着性、70℃熱放射率、放熱性を、前記と同様の方法によって、測定した。
2 熱放射膜
3 吸熱層
4 接着層
5 本発明に係る伸縮性放熱シート
6 放熱層
7 粘着層
Claims (15)
- 引張伸び率が200%以上の樹脂(A)、架橋剤(B)及び赤外線吸収性無機粒子(C)を含有する樹脂組成物Iより得られる引張伸び率が100%以上の放熱層と、粘着性樹脂(D)を含有する樹脂組成物IIより得られる引張伸び率が200%以上の粘着層とから構成される、引張伸び率が100%以上の2層構造の伸縮性放熱シート。
- 引張伸び率が200%以上の樹脂(A)が、ポリエステル樹脂、アクリル樹脂、エポキシ樹脂、ポリウレタン樹脂及びシリコーン樹脂からなる群より選ばれる少なくとも1種である、請求項1に記載の伸縮性放熱シート。
- 引張伸び率が200%以上の樹脂(A)が、ポリエステル樹脂であり、かつ、その数平均分子量が10,000〜80,000であって、その水酸基価が1〜20mgKOH/g以下である、請求項1に記載の伸縮性放熱シート。
- 架橋剤(B)が、アミノ樹脂系架橋剤である、請求項1に記載の伸縮性放熱シート。
- 赤外線吸収性無機粒子(C)が、非多孔質シリカ、多孔質シリカ、窒化ホウ素、石英、カオリン、フッ化カルシウム、水酸化アルミニウム、ベントナイト、タルク、サリサイト、マイカ及びコージェライトからなる群より選ばれる少なくとも1種である、請求項1に記載の伸縮性放熱シート。
- 赤外線吸収性無機粒子(C)が、6.3〜10.5μmの波長域の赤外線を吸収するものである、請求項1に記載の伸縮性放熱シート。
- 赤外線吸収性無機粒子(C)の平均一次粒子径が、0.1〜15.0μmである、請求項1に記載の伸縮性放熱シート。
- 赤外線吸収性無機粒子(C)の含有率が、放熱層の10〜60重量%である、請求項1に記載の伸縮性放熱シート。
- 樹脂組成物Iにおいて、引張伸び率が200%以上の樹脂(A)100重量部(固形分換算)に対して、架橋剤(B)の含有量が1〜40重量部(固形分換算)および赤外線吸収性無機粒子(C)の含有量が20〜200重量部である、請求項1に記載の伸縮性放熱シート。
- 放熱層の熱放射率が、70℃において0.95以上である、請求項1に記載の伸縮性放熱シート。
- 粘着性樹脂(D)が、アクリル樹脂、ポリウレタン樹脂、ポリエステル樹脂及びシリコーン樹脂からなる群より選ばれる少なくとも1種の樹脂である、請求項1に記載の伸縮性放熱シート。
- 粘着層が、熱伝導率が10〜300W/m・Kである無機粒子(E)を10〜80重量%の範囲で含有する、請求項1に記載の伸縮性放熱シート。
- 放熱層の厚さが、10〜100μmである、請求項1に記載の伸縮性放熱シート。
- 粘着層の厚さが、10〜150μmである、請求項1に記載の伸縮性放熱シート。
- 請求項1に記載の伸縮性放熱シートが貼付された物品。
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JP2007173613A (ja) * | 2005-12-22 | 2007-07-05 | Dainippon Printing Co Ltd | 放熱シート及びその製造方法 |
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US20110223427A1 (en) * | 2008-11-12 | 2011-09-15 | Nitto Denko Corporation | Method of producing electrically insulating thermally conductive sheet, electrically insulating thermally conductive sheet, and heat dissipating member |
JP2010232535A (ja) * | 2009-03-27 | 2010-10-14 | Polymatech Co Ltd | 耐熱性放熱シート |
TW201139641A (en) * | 2010-01-29 | 2011-11-16 | Nitto Denko Corp | Heat dissipation structure |
JP5423455B2 (ja) * | 2010-02-09 | 2014-02-19 | 日立化成株式会社 | 熱伝導シート、その製造方法及び熱伝導シートを用いた放熱装置 |
JP2011228647A (ja) * | 2010-03-30 | 2011-11-10 | Dainippon Printing Co Ltd | 放熱シート及び放熱シートの製造方法 |
JP5495429B2 (ja) * | 2010-04-13 | 2014-05-21 | 信越化学工業株式会社 | 放熱性複合シート |
JP2012054313A (ja) * | 2010-08-31 | 2012-03-15 | Dainippon Printing Co Ltd | 放熱シートおよびその製造方法 |
JP2012064691A (ja) * | 2010-09-15 | 2012-03-29 | Furukawa Electric Co Ltd:The | 熱拡散シート |
-
2013
- 2013-05-16 CN CN201380025491.9A patent/CN104302474B/zh active Active
- 2013-05-16 KR KR1020147032588A patent/KR20150008140A/ko not_active Application Discontinuation
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JPWO2013172429A1 (ja) | 2016-01-12 |
CN104302474A (zh) | 2015-01-21 |
KR20150008140A (ko) | 2015-01-21 |
CN104302474B (zh) | 2016-09-21 |
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