JP6106389B2 - 先設置型半導体封止用フィルム - Google Patents

先設置型半導体封止用フィルム Download PDF

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Publication number
JP6106389B2
JP6106389B2 JP2012201146A JP2012201146A JP6106389B2 JP 6106389 B2 JP6106389 B2 JP 6106389B2 JP 2012201146 A JP2012201146 A JP 2012201146A JP 2012201146 A JP2012201146 A JP 2012201146A JP 6106389 B2 JP6106389 B2 JP 6106389B2
Authority
JP
Japan
Prior art keywords
component
semiconductor
film
parts
sealing film
Prior art date
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Active
Application number
JP2012201146A
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English (en)
Japanese (ja)
Other versions
JP2014055245A (ja
Inventor
吉田　真樹
真樹 吉田
里美 川本
里美 川本
慎 寺木
慎 寺木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Priority to JP2012201146A priority Critical patent/JP6106389B2/ja
Priority to TW102132545A priority patent/TWI593768B/zh
Publication of JP2014055245A publication Critical patent/JP2014055245A/ja
Application granted granted Critical
Publication of JP6106389B2 publication Critical patent/JP6106389B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Wire Bonding (AREA)
  • Epoxy Resins (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2012201146A 2012-09-13 2012-09-13 先設置型半導体封止用フィルム Active JP6106389B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012201146A JP6106389B2 (ja) 2012-09-13 2012-09-13 先設置型半導体封止用フィルム
TW102132545A TWI593768B (zh) 2012-09-13 2013-09-10 先設置型半導體封裝用膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012201146A JP6106389B2 (ja) 2012-09-13 2012-09-13 先設置型半導体封止用フィルム

Publications (2)

Publication Number Publication Date
JP2014055245A JP2014055245A (ja) 2014-03-27
JP6106389B2 true JP6106389B2 (ja) 2017-03-29

Family

ID=50612846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012201146A Active JP6106389B2 (ja) 2012-09-13 2012-09-13 先設置型半導体封止用フィルム

Country Status (2)

Country Link
JP (1) JP6106389B2 (zh)
TW (1) TWI593768B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015186744A1 (ja) * 2014-06-04 2015-12-10 日立化成株式会社 フィルム状エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物の製造方法、及び半導体装置の製造方法
KR102319292B1 (ko) 2014-10-10 2021-11-01 나믹스 가부시끼가이샤 열경화성 수지 조성물 및 그의 제조 방법
JP6837237B2 (ja) * 2017-05-11 2021-03-03 ナミックス株式会社 ダイボンディング剤
KR102488314B1 (ko) * 2018-12-27 2023-01-13 주식회사 두산 반도체 패키지용 비전도성 접착필름 및 이를 이용하는 반도체 패키지의 제조방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2600536B2 (ja) * 1991-10-02 1997-04-16 日立化成工業株式会社 接着剤組成物の製造方法
JPH0786465A (ja) * 1993-09-16 1995-03-31 Toshiba Corp 半導体封止用エポキシ樹脂組成物
CA2561414A1 (en) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation Hardener for epoxy resin and epoxy resin composition
US20080036097A1 (en) * 2006-08-10 2008-02-14 Teppei Ito Semiconductor package, method of production thereof and encapsulation resin
JP4962554B2 (ja) * 2009-11-27 2012-06-27 オムロン株式会社 一液性エポキシ樹脂組成物及びその利用
WO2012070387A1 (ja) * 2010-11-25 2012-05-31 旭化成イーマテリアルズ株式会社 エポキシ樹脂および樹脂組成物
JP2012158719A (ja) * 2011-02-02 2012-08-23 Hitachi Chemical Co Ltd 半導体封止充てん用エポキシ樹脂組成物並びにそれを用いた半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
TW201410820A (zh) 2014-03-16
TWI593768B (zh) 2017-08-01
JP2014055245A (ja) 2014-03-27

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