JP6103051B2 - セラミック基板用組成物およびセラミック回路部品 - Google Patents
セラミック基板用組成物およびセラミック回路部品 Download PDFInfo
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- JP6103051B2 JP6103051B2 JP2015521372A JP2015521372A JP6103051B2 JP 6103051 B2 JP6103051 B2 JP 6103051B2 JP 2015521372 A JP2015521372 A JP 2015521372A JP 2015521372 A JP2015521372 A JP 2015521372A JP 6103051 B2 JP6103051 B2 JP 6103051B2
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- 239000000919 ceramic Substances 0.000 title claims description 143
- 239000000758 substrate Substances 0.000 title claims description 78
- 239000000203 mixture Substances 0.000 title claims description 36
- 239000000843 powder Substances 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 29
- 239000005388 borosilicate glass Substances 0.000 claims description 22
- 238000010304 firing Methods 0.000 claims description 12
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 10
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 9
- 229910052882 wollastonite Inorganic materials 0.000 claims description 9
- 239000010456 wollastonite Substances 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 8
- 239000003607 modifier Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 description 59
- 238000009413 insulation Methods 0.000 description 27
- 239000010410 layer Substances 0.000 description 23
- 239000011229 interlayer Substances 0.000 description 19
- 238000000280 densification Methods 0.000 description 17
- 238000002425 crystallisation Methods 0.000 description 15
- 238000005452 bending Methods 0.000 description 13
- 230000008025 crystallization Effects 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000010030 laminating Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- 239000002241 glass-ceramic Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910004762 CaSiO Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910052661 anorthite Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0009—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing silica as main constituent
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/006—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of microcrystallites, e.g. of optically or electrically active material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/20—Glass-ceramics matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Glass Compositions (AREA)
Description
上述した結晶化度調整剤としてのウォラストナイト結晶物の添加量は、ホウケイ酸系ガラス粉末およびセラミック粉末の合計量100質量部に対して、0.005〜0.1質量部である。
以下に、この発明に係るセラミック基板用組成物に関して、実験例に基づき、より具体的に説明する。
結晶化度は、以下のように求めた。
LogIR(絶縁抵抗)は、層間絶縁信頼性の指標となるべきもので、以下のように求めた。
層間距離は、図2に示したセラミック基板11におけるパッド電極16とパッド電極17とで挟まれたセラミック層12の厚みであり、以下のように求めた。
εr(比誘電率)は、以下のように求めた。
Qは、以下のように求めた。
複数のグリーンシートを積層してなるもので、導体部を形成しない生の積層体を、最高温度を1000℃以下とする所定の温度プロファイルで焼成することによって、長さ50mm、幅4mm、厚み0.5mmのセラミック基板を作製した。このセラミック基板を試料として、JIS規格(JIS R−1601)に準じて、オートグラフを用いて抗折強度(3点曲げ)を測定した。なお、JIS規格と異なる点は、試料厚みがJIS規格とは異なることと、および試料の表面やエッジ部の研磨処理を行なわなかったことである。
2 セラミック基板
3 導体部
4 セラミック層
Claims (2)
- 4〜8質量%のB2O3、38〜44質量%のSiO2、3〜10質量%のAl2O3、および40〜48質量%のMO(ただし、MOは、CaO、MgOおよびBaOから選ばれた少なくとも1種である。)を含むホウケイ酸系ガラス粉末とセラミック粉末とを混合したものであり、前記ホウケイ酸系ガラス粉末を50〜56質量%、および前記セラミック粉末を50〜44質量%それぞれ含有し、前記セラミック粉末は、平均粒径D50が0.4〜1.5μmであり、さらに結晶化度調整剤を含み、前記結晶化度調整剤はウォラストナイト結晶物であり、その添加量は、前記ホウケイ酸系ガラス粉末および前記セラミック粉末の合計量100質量部に対して、0.005〜0.1質量部である、セラミック基板用組成物。
- 請求項1に記載のセラミック基板用組成物を成形し焼成して得られたセラミック基板と、前記セラミック基板に関連して形成された導体部とを備える、セラミック回路部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013118433 | 2013-06-05 | ||
JP2013118433 | 2013-06-05 | ||
PCT/JP2014/063274 WO2014196348A1 (ja) | 2013-06-05 | 2014-05-20 | セラミック基板用組成物およびセラミック回路部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014196348A1 JPWO2014196348A1 (ja) | 2017-02-23 |
JP6103051B2 true JP6103051B2 (ja) | 2017-03-29 |
Family
ID=52008001
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Application Number | Title | Priority Date | Filing Date |
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JP2015521372A Active JP6103051B2 (ja) | 2013-06-05 | 2014-05-20 | セラミック基板用組成物およびセラミック回路部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9607765B2 (ja) |
JP (1) | JP6103051B2 (ja) |
WO (1) | WO2014196348A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6777164B2 (ja) * | 2016-12-08 | 2020-10-28 | 株式会社村田製作所 | 多層セラミック基板及び電子装置 |
JP7119583B2 (ja) * | 2018-05-29 | 2022-08-17 | Tdk株式会社 | プリント配線板およびその製造方法 |
CN112500172B (zh) * | 2020-05-11 | 2021-10-01 | 深圳前海发维新材料科技有限公司 | 一种高软化点、低热膨胀系数、高耐磨、低热导率的玻璃复合材料在发动机气轮机中的应用 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4358541A (en) * | 1981-11-23 | 1982-11-09 | Corning Glass Works | Glass-ceramic coatings for use on metal substrates |
US4687749A (en) * | 1986-10-24 | 1987-08-18 | Corning Glass Works | Refractory glass-ceramics containing enstatite |
JP2713376B2 (ja) * | 1987-06-09 | 1998-02-16 | 旭硝子株式会社 | 絶縁層用ガラス組成物 |
JPH11335162A (ja) * | 1998-05-25 | 1999-12-07 | Murata Mfg Co Ltd | セラミック基板用組成物およびセラミック回路部品 |
JP3358589B2 (ja) * | 1999-06-08 | 2002-12-24 | 株式会社村田製作所 | セラミック基板用組成物、グリーンシートおよびセラミック回路部品 |
JP4432161B2 (ja) * | 1999-10-20 | 2010-03-17 | 株式会社村田製作所 | ガラスセラミック基板の製造方法 |
US6835682B2 (en) * | 2002-06-04 | 2004-12-28 | E. I. Du Pont De Nemours And Company | High thermal expansion glass and tape composition |
JP4736342B2 (ja) * | 2004-04-09 | 2011-07-27 | 株式会社村田製作所 | ガラスセラミック原料組成物、ガラスセラミック焼結体およびガラスセラミック多層基板 |
JP2010052970A (ja) * | 2008-08-27 | 2010-03-11 | Murata Mfg Co Ltd | セラミック組成物、セラミックグリーンシート、及びセラミック電子部品 |
WO2011021484A1 (ja) * | 2009-08-18 | 2011-02-24 | 株式会社村田製作所 | ガラスセラミック組成物、セラミックグリーンシートおよび多層セラミック基板 |
JP5263112B2 (ja) * | 2009-10-07 | 2013-08-14 | 旭硝子株式会社 | セラミックス原料組成物 |
JP5928847B2 (ja) * | 2011-12-27 | 2016-06-01 | 株式会社村田製作所 | 多層セラミック基板およびそれを用いた電子部品 |
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2014
- 2014-05-20 WO PCT/JP2014/063274 patent/WO2014196348A1/ja active Application Filing
- 2014-05-20 JP JP2015521372A patent/JP6103051B2/ja active Active
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2015
- 2015-11-30 US US14/953,976 patent/US9607765B2/en active Active
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Publication number | Publication date |
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WO2014196348A1 (ja) | 2014-12-11 |
US20160086732A1 (en) | 2016-03-24 |
US9607765B2 (en) | 2017-03-28 |
JPWO2014196348A1 (ja) | 2017-02-23 |
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