JP6100598B2 - 半導体発光素子及び半導体発光装置 - Google Patents
半導体発光素子及び半導体発光装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 177
- 239000000758 substrate Substances 0.000 claims description 43
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
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- 230000031700 light absorption Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005566 electron beam evaporation Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
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- 238000001312 dry etching Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
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- 229910001316 Ag alloy Inorganic materials 0.000 description 1
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- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910018100 Ni-Sn Inorganic materials 0.000 description 1
- 229910018532 Ni—Sn Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
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- 229910052741 iridium Inorganic materials 0.000 description 1
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- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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- 229910052718 tin Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
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- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
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- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H01L2924/10158—Shape being other than a cuboid at the passive surface
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Description
第1導電型の第1半導体層と、
前記第1半導体層上に形成された発光層と、
前記発光層上に形成され、前記第1導電型と逆の第2導電型を有する第2半導体層と、
前記第2半導体層側から形成され、前記発光層を貫通して前記第1半導体層を露出する凹部と、
前記凹部の底部で前記第1半導体層と電気的に接続し、前記第2半導体層の上面上方に延在して形成された第1電極と、
前記第2半導体層の上面で前記第2半導体層と電気的に接続し、平面視上前記凹部を囲む穴であって該穴を介して前記第1電極が前記凹部内から前記第2半導体層の上面上方に延在する穴を有する第2電極と、
前記第2半導体層の上面上方で、前記第2電極と前記第1電極との間に配置された絶縁層と、
を有し、
前記第2電極は、前記発光層側から入射した光を反射させる光反射電極であり、
前記第1電極は、平面視上前記穴を覆うように形成され、前記発光層側から入射した光を反射させる光反射電極層を含み、
前記第1電極の光反射電極層は、平面視上、前記光反射電極層の縁部が、前記第2電極の穴を画定する縁部と重なるように形成されており、
前記第2電極は、第1層と、前記第1層上に形成された第2層とを含み、前記穴は前記 第1層の第1の縁が画定し、前記第2層は、前記穴を囲み前記第1の縁よりも前記穴の外 側に配置された第2の縁を有し、
前記第1電極の光反射電極層の第3の縁は、平面視上前記第1の縁と前記第2の縁との 間に配置されている、
半導体発光素子
が提供される。
2 n型半導体層
3 発光層
4 p型半導体層
5 p側半導体上電極層
6 フリンジ層
7 p側高反射層
8 p側拡散防止層
9 p側高反射キャップ層
10 絶縁キャップ層
11 n側ビア電極
12 絶縁フロート層
13 n側高反射層
14 導電層
14n n側キャップ層(素子n側接続電極層)
14p、15p 素子p側接続電極層
HL 穴
CV 凹部
CH コンタクトホール
IS pn電極間絶縁層
En n側電極
Ep p側電極
21 支持基板
22 絶縁層
23、23p、23np、23n 支持基板側電極
24 グレア光吸収層
25 全面保護膜
26 裏面金属層
31A、31B 半導体素子
41 パッケージ基板上
42 接合材
43p、43n ワイヤーボンディング
44p、44n 給電用パッド
45 蛍光体層
Claims (6)
- 第1導電型の第1半導体層と、
前記第1半導体層上に形成された発光層と、
前記発光層上に形成され、前記第1導電型と逆の第2導電型を有する第2半導体層と、
前記第2半導体層側から形成され、前記発光層を貫通して前記第1半導体層を露出する凹部と、
前記凹部の底部で前記第1半導体層と電気的に接続し、前記第2半導体層の上面上方に延在して形成された第1電極と、
前記第2半導体層の上面で前記第2半導体層と電気的に接続し、平面視上前記凹部を囲む穴であって該穴を介して前記第1電極が前記凹部内から前記第2半導体層の上面上方に延在する穴を有する第2電極と、
前記第2半導体層の上面上方で、前記第2電極と前記第1電極との間に配置された絶縁層と、
を有し、
前記第2電極は、前記発光層側から入射した光を反射させる光反射電極であり、
前記第1電極は、平面視上前記穴を覆うように形成され、前記発光層側から入射した光を反射させる光反射電極層を含み、
前記第1電極の光反射電極層は、平面視上、前記光反射電極層の縁部が、前記第2電極の穴を画定する縁部と重なるように形成されており、
前記第2電極は、第1層と、前記第1層上に形成された第2層とを含み、前記穴は前記 第1層の第1の縁が画定し、前記第2層は、前記穴を囲み前記第1の縁よりも前記穴の外 側に配置された第2の縁を有し、
前記第1電極の光反射電極層の第3の縁は、平面視上前記第1の縁と前記第2の縁との 間に配置されている、半導体発光素子。 - 前記第1電極は、さらに、前記光反射電極層上に形成され、前記光反射電極層に比べて前記発光層側からの入射光に対する反射率が低い光吸収電極層を含み、
前記光吸収電極層は、平面視上、前記光反射電極層の縁部よりも前記穴に対し外側に広がって形成されている請求項1に記載の半導体発光素子。 - 前記第1電極の光吸収電極層は、平面視上、前記第2電極の第2層の前記第2の縁よりも前記穴に対し外側に広がって形成され、前記第2層と重なっている、請求項2に記載の半導体発光素子。
- 前記第1電極の光反射電極層は、前記凹部の底部で前記第1半導体層と接触している請求項1〜3のいずれか1項に記載の半導体発光素子。
- 第1半導体発光素子と、
第2半導体発光素子と、
支持基板電極の形成された支持基板と
を有し、
前記第1半導体発光素子は、
第1導電型の第1半導体層と、
前記第1半導体層上に形成された第1発光層と、
前記第1発光層上に形成され、前記第1導電型と逆の第2導電型を有する第2半導体層と、
前記第2半導体層側から形成され、前記第1発光層を貫通して前記第1半導体層を露出する第1凹部と、
前記第1凹部の底部で前記第1半導体層と電気的に接続し、前記第2半導体層の上面上方に延在して形成された第1電極と、
前記第2半導体層の上面で前記第2半導体層と電気的に接続し、平面視上前記第1凹部を囲む第1の穴であって該第1の穴を介して前記第1電極が前記第1凹部内から前記第2半導体層の上面上方に延在する第1の穴を有する第2電極と、
前記第2半導体層の上面上方で、前記第2電極と前記第1電極との間に配置された第1絶縁層と
を有し、
前記第2電極は、前記第1発光層側から入射した光を反射させる光反射電極であり、
前記第1電極は、平面視上前記第1の穴を覆うように形成され、前記第1発光層側から入射した光を反射させる第1光反射電極層を含み、
前記第1電極の第1光反射電極層は、平面視上、前記第1光反射電極層の縁部が、前記第2電極の第1の穴を画定する縁部と重なるように形成されており、
前記第2電極は、第1層と、前記第1層上に形成された第2層とを含み、前記第1の穴 は前記第1層の第1の縁が画定し、前記第2層は、前記第1の穴を囲み前記第1の縁より も前記第1の穴の外側に配置された第2の縁を有し、
前記第1電極の光反射電極層の第3の縁は、平面視上前記第1の縁と前記第2の縁との 間に配置されている半導体発光素子であり、
前記第2半導体発光素子は、
第1導電型の第3半導体層と、
前記第3半導体層上に形成された第2発光層と、
前記第2発光層上に形成され、前記第1導電型と逆の第2導電型を有する第4半導体層と、
前記第4半導体層側から形成され、前記第2発光層を貫通して前記第3半導体層を露出する第2凹部と、
前記第2凹部の底部で前記第3半導体層と電気的に接続し、前記第4半導体層の上面上方に延在して形成された第3電極と、
前記第4半導体層の上面で前記第4半導体層と電気的に接続し、平面視上前記第2凹部を囲む第2の穴であって該第2の穴を介して前記第3電極が前記第2凹部内から前記第4半導体層の上面上方に延在する第2の穴を有する第4電極と、
前記第4半導体層の上面上方で、前記第4電極と前記第3電極との間に配置された第2絶縁層と
を有し、
前記第4電極は、前記第2発光層側から入射した光を反射させる光反射電極であり、
前記第3電極は、平面視上前記第2の穴を覆うように形成され、前記第2発光層側から入射した光を反射させる第2光反射電極層を含み、
前記第3電極の第2光反射電極層は、平面視上、前記第2光反射電極層の縁部が、前記第4電極の第2の穴を画定する縁部と重なるように形成されており、
前記第4電極は、第3層と、前記第3層上に形成された第4層とを含み、前記第2の穴 は前記第3層の第4の縁が画定し、前記第4層は、前記第2の穴を囲み前記第4の縁より も前記第2の穴の外側に配置された第5の縁を有し、
前記第3電極の第2光反射電極層の第6の縁は、平面視上前記第4の縁と前記第5の縁 との間に配置されている半導体発光素子であり、
前記支持基板電極が、前記第1半導体発光素子の前記第1電極と、前記第2半導体発光素子の第4電極とを電気的に接続している、
半導体発光装置。 - さらに、前記第1半導体発光素子及び前記第2半導体発光素子を覆って形成され蛍光体を含む蛍光体層を有する請求項5に記載の半導体発光装置。
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