JP6099663B2 - 圧電導電性誘電体膜を備えたマイクロスピーカー - Google Patents
圧電導電性誘電体膜を備えたマイクロスピーカー Download PDFInfo
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- JP6099663B2 JP6099663B2 JP2014544851A JP2014544851A JP6099663B2 JP 6099663 B2 JP6099663 B2 JP 6099663B2 JP 2014544851 A JP2014544851 A JP 2014544851A JP 2014544851 A JP2014544851 A JP 2014544851A JP 6099663 B2 JP6099663 B2 JP 6099663B2
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- microspeaker
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- IGELFKKMDLGCJO-UHFFFAOYSA-N xenon difluoride Chemical compound F[Xe]F IGELFKKMDLGCJO-UHFFFAOYSA-N 0.000 description 2
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- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
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- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
- H04R2201/401—2D or 3D arrays of transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Description
本出願は、参照によりその全体およびすべての目的が本出願に組み込まれる、2011年11月29日に出願された、「MICROSPEAKER WITH PIEZOELECTRIC, METAL AND DIELECTRIC MEMBRANE」(代理人整理番号QUALP056US/101716)という名称の米国特許出願第13/306,397号の優先権を主張する。
13、15 光
14 可動反射層、層、反射層
14a 反射副層、伝導性層、副層
14b 支持層、誘電支持層、副層
14c 伝導性層、副層
16 光学スタック、層
16a 吸収層、光吸収体、副層、導体/吸収体副層
16b 誘電体、副層
18 ポスト、支持体、支持ポスト
19 ギャップ、キャビティ
20 透明基板、基板
21 プロセッサ、システムプロセッサ
22 アレイドライバ
23 ブラックマスク構造
24 行ドライバ回路
25 犠牲層、犠牲材料
26 列ドライバ回路
27 ネットワークインターフェース
28 フレームバッファ
29 ドライバコントローラ
30 ディスプレイアレイ、パネル、ディスプレイ
32 テザー
34 変形可能層
35 スペーサ層
40 ディスプレイデバイス
41 ハウジング
43 アンテナ
45 スピーカー
46 マイクロフォン
47 トランシーバ
48 入力デバイス
50 電源
52 調整ハードウェア
60a 第1のライン時間、ライン時間
60b 第2のライン時間、ライン時間
60c 第3のライン時間、ライン時間
60d 第4のライン時間、ライン時間
60e ライン時間、第5のライン時間
62 高いセグメント電圧
64 低いセグメント電圧
70 開放電圧
72 高い保持電圧
74 高いアドレス電圧
76 低い保持電圧
78 低いアドレス電圧
100 ガラスカプセル化マイクロスピーカー
102 カバーガラス
104 集積回路デバイス
106 ガラス基板
108 マイクロスピーカーアレイ
110 接合リング
112 凹部
113 キャビティ
114 音響ポート(スルーガラス音響ポート)
115 スピーカーグリル
122 スルーガラスビア
124、128 上側導電トレース
126a 上面
126b 底面
127a 上側ボンドパッド
127b 下側ボンドパッド
127c レッジパッド
129 ボンドパッド
132 レッジ
140 フレキシブルコネクタ
300 マイクロスピーカー要素
304 スピーカーキャビティ
305 基板
310 変形可能誘電体膜
311 音響キャビティ
320、320a 第1の電極
320b 第3の電極
325 誘電体層
330 圧電アクチュエータ
330a 第1の圧電アクチュエータ
330b 第2の圧電アクチュエータ
335、335a、335b 導電トレース
336 環状領域
340、340a 第2の電極
340b 第4の電極
350 圧電材料(圧電層)
350a 第1の圧電層
350b 第2の圧電層
Claims (27)
- 基板(305)と、
変形可能膜(310)と、
前記変形可能膜(310)がスピーカーキャビティ(304)全体に及ぶように、前記基板(305)と前記変形可能膜(310)との間に配置されたスピーカーキャビティ(304)であって、前記スピーカーキャビティが、前記基板及び前記変形可能膜のみによって画定され、前記スピーカーキャビティを画定する前記基板の少なくとも一部が平らである、スピーカーキャビティ(304)と
を備える電気機械マイクロスピーカーであって、
前記変形可能膜(310)が、第1の導電層(320)と第2の導電層(340)との間にはさまれた圧電層(350)を含み、かつ、誘電体層(325)を含み、前記変形可能膜(310)が、前記圧電層(350)の両端間に駆動電圧を印加すると変形するように構成される電気機械マイクロスピーカー。 - 前記誘電体層(325)が、酸化物、窒化物またはオキシナイトライド材料のうちの少なくとも1つを含む、請求項1に記載の電気機械マイクロスピーカー。
- 前記圧電層(350)が前記誘電体層(325)と前記基板(305)との間に配置される、請求項1または2に記載の電気機械マイクロスピーカー。
- 前記圧電層(350)が前記スピーカーキャビティ(304)全体に及ぶ、請求項1または2に記載の電気機械マイクロスピーカー。
- 前記圧電層(350)が前記スピーカーキャビティ(304)の上の中央に配置される、請求項1または2に記載の電気機械マイクロスピーカー。
- 前記圧電層(350)が前記スピーカーキャビティ(304)の周辺領域を覆う、請求項1または2に記載の電気機械マイクロスピーカー。
- 前記圧電層(350)が第1の圧電層(350a)であり、前記変形可能膜(310)が、第3の導電層(320b)と第4の導電層(340b)との間にはさまれた第2の圧電層(350b)をさらに含む、請求項1に記載の電気機械マイクロスピーカー。
- 前記第1および第2の圧電層(350a、350b)が前記誘電体層(325)の反対側に配置される、請求項7に記載の電気機械マイクロスピーカー。
- 前記第1の圧電層(350a)が窒化アルミニウムを含む、請求項1から8のいずれか一項に記載の電気機械マイクロスピーカー。
- 前記基板(305)がガラス基板である、請求項1から9のいずれか一項に記載の電気機械マイクロスピーカー。
- 前記スピーカーキャビティ(304)が密閉される、請求項1から10のいずれか一項に記載の電気機械マイクロスピーカー。
- 前記スピーカーキャビティ(304)が実質的に閉じた体積である、請求項1から11のいずれか一項に記載の電気機械マイクロスピーカー。
- 装置の寸法が、約1ミクロンと5ミクロンとの間のスピーカーキャビティ厚さ、約1ミクロンと10ミクロンとの間の誘電体層厚さ、または約1ミクロンと3ミクロンとの間の第1の圧電層厚さ、のうちの1つまたは複数を含む、請求項1から12のいずれか一項に記載の電気機械マイクロスピーカー。
- 前記第1および第2の導電層(320、340)の厚さがそれぞれ約100〜3000オングストロームである、請求項1に記載の電気機械マイクロスピーカー。
- 前記変形可能膜(310)が、可聴周波数で発振する駆動電圧を前記圧電層(350)の両端間に印加すると、音を生成するように構成される、請求項1から14のいずれか一項に記載の電気機械マイクロスピーカー。
- 請求項1から15のいずれか一項に記載の少なくとも1つの電気機械マイクロスピーカーと、
ディスプレイ(30)と、
前記ディスプレイ(30)と通信するように構成されるプロセッサ(21)であって、画像データを処理するように構成されるプロセッサ(21)と、
前記プロセッサ(21)と通信するように構成されるメモリ素子と
を備える音響−視覚装置。 - 少なくとも1つの信号を前記ディスプレイ(30)に送るように構成されたドライバ回路(22)と、
前記画像データの少なくとも一部を前記ドライバ回路(30)に送るように構成されたコントローラ(29)と
をさらに備える、請求項16に記載の音響−視覚装置。 - 前記画像データを前記プロセッサ(21)に送るように構成された画像ソースモジュールであって、受信機、トランシーバ(47)および送信機のうちの少なくとも1つを含む画像ソースモジュール
をさらに備える、請求項16または17に記載の音響−視覚装置。 - 入力データを受け取るように構成され、かつ、前記入力データを前記プロセッサ(21)に通信するように構成された入力デバイス(48)
をさらに備える、請求項16から18のいずれか一項に記載の音響−視覚装置。 - 第1の結合ガラス基板と第2の結合ガラス基板(102、106)との間に形成された、請求項1から19のいずれか一項に記載の電気機械マイクロスピーカーのアレイ(108)
を備え、前記第2のガラス基板(102)が、前記アレイの上に配置された1つまたは複数の音響ポート(114)を含む装置。 - 前記第1のガラス基板と第2のガラス基板(102、106)との間のキャビティ内に配置された集積回路デバイス(104)であって、圧電駆動マイクロスピーカー要素を駆動するように構成された集積回路デバイス(104)をさらに備える、請求項20に記載の装置。
- 前記アレイ(108)が、外部の集積回路デバイスに接続するように構成される、請求項20に記載の装置。
- 前記結合ガラス基板(102、106)が、フレキシブルコネクタ(140)に取り付けるように構成される、請求項20に記載の装置。
- マイクロスピーカーを形成する方法であって、
基板(305)の上に犠牲層を形成するステップと、
前記犠牲層の上に第1の圧電アクチュエータ(330)を形成するステップと、
前記犠牲層および前記基板(305)の上に変形可能誘電体層(325)を形成するステップと、
前記変形可能誘電体層(325)がスピーカーキャビティ(304)全体に及ぶように、前記基板(305)と前記変形可能誘電体層(325)との間に前記スピーカーキャビティ(304)を形成するために前記犠牲層を除去するステップであって、前記スピーカーキャビティが、前記基板及び前記変形可能誘電体層のみによって画定され、前記スピーカーキャビティを画定する前記基板の少なくとも一部が平らである、ステップと
を含む、方法。 - 前記犠牲層の上に前記第1の圧電アクチュエータ(330)を形成するステップが、前記犠牲層の上に第1の導電層(320)を形成するステップ、前記第1の導電層(320)の上に第1の圧電層(350)を形成するステップ、および前記第1の圧電層(350)の上に第2の導電層(340)を形成するステップを含む、請求項24に記載の方法。
- 前記犠牲層の上に第2の圧電アクチュエータを形成するステップをさらに含む、請求項24に記載の方法。
- 前記変形可能膜(310)が、前記基板(305)に平行な平板部と、前記基板(305)に対してある角度を有し、前記平板部と前記基板(305)とを接続する側部とを備え、
前記平板部、前記側部及び前記基板(305)が、前記スピーカーキャビティ(304)を画定する、請求項1に記載の電気機械マイクロスピーカー。
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US10735865B2 (en) | 2020-08-04 |
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US20140328504A1 (en) | 2014-11-06 |
EP2786595B1 (en) | 2017-09-27 |
US20130136280A1 (en) | 2013-05-30 |
KR20140098836A (ko) | 2014-08-08 |
HUE037612T2 (hu) | 2018-09-28 |
CN103959818B (zh) | 2018-12-14 |
EP2786595A1 (en) | 2014-10-08 |
IN2014CN03799A (ja) | 2015-10-16 |
US20170125660A1 (en) | 2017-05-04 |
ES2652036T3 (es) | 2018-01-31 |
CN103959818A (zh) | 2014-07-30 |
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