IN2014CN03799A - - Google Patents
Info
- Publication number
- IN2014CN03799A IN2014CN03799A IN3799CHN2014A IN2014CN03799A IN 2014CN03799 A IN2014CN03799 A IN 2014CN03799A IN 3799CHN2014 A IN3799CHN2014 A IN 3799CHN2014A IN 2014CN03799 A IN2014CN03799 A IN 2014CN03799A
- Authority
- IN
- India
- Prior art keywords
- microspeaker
- piezoactuator
- dielectric layer
- cover glass
- elements
- Prior art date
Links
- 239000006059 cover glass Substances 0.000 abstract 2
- 239000012528 membrane Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
- H04R2201/401—2D or 3D arrays of transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
This disclosure provides systems methods and apparatus for microspeaker devices. In one aspect a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator the dielectric layer can deflect producing sound. In some implementations an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/306,397 US8811636B2 (en) | 2011-11-29 | 2011-11-29 | Microspeaker with piezoelectric, metal and dielectric membrane |
PCT/US2012/066875 WO2013082169A1 (en) | 2011-11-29 | 2012-11-28 | Microspeaker with piezoelectric, conductive and dielectric membrane |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014CN03799A true IN2014CN03799A (en) | 2015-10-16 |
Family
ID=47428996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN3799CHN2014 IN2014CN03799A (en) | 2011-11-29 | 2012-11-28 |
Country Status (9)
Country | Link |
---|---|
US (3) | US8811636B2 (en) |
EP (1) | EP2786595B1 (en) |
JP (1) | JP6099663B2 (en) |
KR (1) | KR101885180B1 (en) |
CN (1) | CN103959818B (en) |
ES (1) | ES2652036T3 (en) |
HU (1) | HUE037612T2 (en) |
IN (1) | IN2014CN03799A (en) |
WO (1) | WO2013082169A1 (en) |
Families Citing this family (77)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8401212B2 (en) | 2007-10-12 | 2013-03-19 | Earlens Corporation | Multifunction system and method for integrated hearing and communication with noise cancellation and feedback management |
CN102124757B (en) | 2008-06-17 | 2014-08-27 | 依耳乐恩斯公司 | Transmission sound signal and system, device and method for simulating object by utilizing transmission sound signal |
WO2010033932A1 (en) | 2008-09-22 | 2010-03-25 | Earlens Corporation | Transducer devices and methods for hearing |
DK2656639T3 (en) | 2010-12-20 | 2020-06-29 | Earlens Corp | Anatomically adapted ear canal hearing aid |
US8811636B2 (en) | 2011-11-29 | 2014-08-19 | Qualcomm Mems Technologies, Inc. | Microspeaker with piezoelectric, metal and dielectric membrane |
US9384639B2 (en) * | 2012-07-05 | 2016-07-05 | Michael Joseph White | Rigid fixture for coupling one or more transducers to the upper back of the human body |
US9619064B2 (en) * | 2012-10-26 | 2017-04-11 | Corning Incorporated | Structure with integrated acoustics function |
US9207750B2 (en) | 2012-12-14 | 2015-12-08 | Intel Corporation | Apparatus and method for reducing leakage power of a circuit |
US9173024B2 (en) * | 2013-01-31 | 2015-10-27 | Invensense, Inc. | Noise mitigating microphone system |
CN104349251B (en) * | 2013-07-29 | 2018-07-10 | 奇鋐科技股份有限公司 | Loadspeaker structure |
US9510103B2 (en) | 2013-09-09 | 2016-11-29 | Audio Pixels Ltd. | Microelectromechanical apparatus for generating a physical effect |
US9796578B2 (en) | 2014-03-10 | 2017-10-24 | Apple Inc. | Microelectromechanical systems devices with improved reliability |
US9941472B2 (en) | 2014-03-10 | 2018-04-10 | International Business Machines Corporation | Piezoelectronic device with novel force amplification |
TWI527471B (en) * | 2014-03-14 | 2016-03-21 | 財團法人工業技術研究院 | Piezoelectric electroacoustic transducer |
US10034103B2 (en) | 2014-03-18 | 2018-07-24 | Earlens Corporation | High fidelity and reduced feedback contact hearing apparatus and methods |
US9251884B2 (en) | 2014-03-24 | 2016-02-02 | International Business Machines Corporation | Non-volatile, piezoelectronic memory based on piezoresistive strain produced by piezoelectric remanence |
US20150346478A1 (en) * | 2014-05-30 | 2015-12-03 | Qualcomm Mems Technologies, Inc. | Protection of Thin Film Transistors in a Display Element Array from Visible and Ultraviolet Light |
WO2016011044A1 (en) | 2014-07-14 | 2016-01-21 | Earlens Corporation | Sliding bias and peak limiting for optical hearing devices |
US10433088B2 (en) * | 2014-08-26 | 2019-10-01 | Goertek Inc. | PCB speaker and method for micromachining speaker diaphragm on PCB substrate |
US9293687B1 (en) * | 2014-10-31 | 2016-03-22 | International Business Machines Corporation | Passivation and alignment of piezoelectronic transistor piezoresistor |
US9924276B2 (en) | 2014-11-26 | 2018-03-20 | Earlens Corporation | Adjustable venting for hearing instruments |
US10567883B2 (en) | 2015-07-22 | 2020-02-18 | Audio Pixels Ltd. | Piezo-electric actuators |
JP2018520612A (en) | 2015-07-22 | 2018-07-26 | オーディオ ピクセルズ エルティーディー.Audio Pixels Ltd. | DSR speaker element and manufacturing method thereof |
US9553960B1 (en) * | 2015-09-04 | 2017-01-24 | Intel Corporation | Loudspeaker with laminate panel for mobile computing platforms |
DE102015116707A1 (en) * | 2015-10-01 | 2017-04-06 | USound GmbH | Flexible MEMS printed circuit board unit and sound transducer arrangement |
WO2017059218A1 (en) | 2015-10-02 | 2017-04-06 | Earlens Corporation | Wearable customized ear canal apparatus |
WO2017066934A1 (en) | 2015-10-21 | 2017-04-27 | Goertek.Inc | Micro-speaker, the manufacturing method thereof, speaker device and electronic apparatus |
US20170195806A1 (en) | 2015-12-30 | 2017-07-06 | Earlens Corporation | Battery coating for rechargable hearing systems |
US11350226B2 (en) | 2015-12-30 | 2022-05-31 | Earlens Corporation | Charging protocol for rechargeable hearing systems |
US10492010B2 (en) | 2015-12-30 | 2019-11-26 | Earlens Corporations | Damping in contact hearing systems |
US9887847B2 (en) * | 2016-02-03 | 2018-02-06 | International Business Machines Corporation | Secure crypto module including conductor on glass security layer |
TWI638419B (en) * | 2016-04-18 | 2018-10-11 | 村田製作所股份有限公司 | A scanning mirror device and a method for manufacturing it |
JP6412900B2 (en) * | 2016-06-23 | 2018-10-24 | 株式会社東芝 | High frequency semiconductor package |
CN107920313A (en) * | 2016-08-27 | 2018-04-17 | 深圳市诺维创科技有限公司 | A kind of miniature piezoelectric ultrasonic transducer and preparation method thereof |
US10531170B2 (en) * | 2016-09-01 | 2020-01-07 | Panasonic Intellectual Property Management Co., Ltd. | Loudspeaker device and movable-body apparatus equipped with same |
JP6265578B1 (en) * | 2016-09-07 | 2018-01-24 | 株式会社アルバック | Device, device manufacturing method, and array-type ultrasonic probe manufacturing method |
US20180077504A1 (en) | 2016-09-09 | 2018-03-15 | Earlens Corporation | Contact hearing systems, apparatus and methods |
KR102583487B1 (en) * | 2016-10-17 | 2023-09-27 | 엘지전자 주식회사 | Audio outputting device |
WO2018093733A1 (en) | 2016-11-15 | 2018-05-24 | Earlens Corporation | Improved impression procedure |
US11039814B2 (en) * | 2016-12-04 | 2021-06-22 | Exo Imaging, Inc. | Imaging devices having piezoelectric transducers |
CN106647003B (en) * | 2017-01-18 | 2020-04-21 | 京东方科技集团股份有限公司 | Display device and display method |
US10498001B2 (en) | 2017-08-21 | 2019-12-03 | Texas Instruments Incorporated | Launch structures for a hermetically sealed cavity |
US10775422B2 (en) * | 2017-09-05 | 2020-09-15 | Texas Instruments Incorporated | Molecular spectroscopy cell with resonant cavity |
US10589986B2 (en) | 2017-09-06 | 2020-03-17 | Texas Instruments Incorporated | Packaging a sealed cavity in an electronic device |
US10444102B2 (en) | 2017-09-07 | 2019-10-15 | Texas Instruments Incorporated | Pressure measurement based on electromagnetic signal output of a cavity |
US10549986B2 (en) | 2017-09-07 | 2020-02-04 | Texas Instruments Incorporated | Hermetically sealed molecular spectroscopy cell |
US10551265B2 (en) | 2017-09-07 | 2020-02-04 | Texas Instruments Incorporated | Pressure sensing using quantum molecular rotational state transitions |
US10424523B2 (en) | 2017-09-07 | 2019-09-24 | Texas Instruments Incorporated | Hermetically sealed molecular spectroscopy cell with buried ground plane |
US10131115B1 (en) | 2017-09-07 | 2018-11-20 | Texas Instruments Incorporated | Hermetically sealed molecular spectroscopy cell with dual wafer bonding |
US10544039B2 (en) | 2017-09-08 | 2020-01-28 | Texas Instruments Incorporated | Methods for depositing a measured amount of a species in a sealed cavity |
CN107634155B (en) * | 2017-09-22 | 2019-02-22 | 京东方科技集团股份有限公司 | Packaging method, encapsulating structure and the display device of oled display substrate |
CN107716258B (en) * | 2017-11-23 | 2019-08-06 | 哈尔滨工业大学 | Amplitude regulates and controls uniform field ring battle array ultrasonic transducer |
WO2019173470A1 (en) | 2018-03-07 | 2019-09-12 | Earlens Corporation | Contact hearing device and retention structure materials |
WO2019199680A1 (en) | 2018-04-09 | 2019-10-17 | Earlens Corporation | Dynamic filter |
US10656007B2 (en) | 2018-04-11 | 2020-05-19 | Exo Imaging Inc. | Asymmetrical ultrasound transducer array |
US10648852B2 (en) | 2018-04-11 | 2020-05-12 | Exo Imaging Inc. | Imaging devices having piezoelectric transceivers |
US10771891B2 (en) | 2018-08-19 | 2020-09-08 | xMEMS Labs, Inc. | Method for manufacturing air pulse generating element |
WO2020051225A1 (en) * | 2018-09-04 | 2020-03-12 | Kathirgamasundaram Sooriakumar | Acoustic transducer and related fabrication and packaging techniques |
TWI684367B (en) * | 2018-09-14 | 2020-02-01 | 美律實業股份有限公司 | Speaker and microelectromechanical actuator thereof |
WO2020068473A1 (en) | 2018-09-25 | 2020-04-02 | Exo Imaging, Inc. | Imaging devices with selectively alterable characteristics |
EP3637487A1 (en) | 2018-10-09 | 2020-04-15 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Shear piezoelectric transducer |
DE102019101325A1 (en) * | 2019-01-17 | 2020-07-23 | USound GmbH | Manufacturing process for multiple MEMS transducers |
CN111698594A (en) * | 2019-03-15 | 2020-09-22 | 华一声学股份有限公司 | Combined earphone |
CN111698595A (en) * | 2019-03-15 | 2020-09-22 | 华一声学股份有限公司 | Multi-audio earphone |
TW202337051A (en) | 2019-09-12 | 2023-09-16 | 美商艾克索影像股份有限公司 | Increased mut coupling efficiency and bandwidth via edge groove, virtual pivots, and free boundaries |
EP4031616A1 (en) | 2019-09-16 | 2022-07-27 | Apollo Tyres Global R&D B.V. | Method for chemically adhering a diene rubber to a piezoelectric polymer |
US11043197B1 (en) * | 2020-01-31 | 2021-06-22 | xMEMS Labs, Inc. | Air pulse generating element and sound producing device with virtual valve |
CN111107476B (en) * | 2020-02-22 | 2021-04-20 | 瑞声科技(新加坡)有限公司 | Micro loudspeaker |
KR20220143156A (en) | 2020-03-05 | 2022-10-24 | 엑소 이미징, 인크. | Ultrasonic imaging device with programmable anatomy and flow imaging |
WO2021251159A1 (en) * | 2020-06-11 | 2021-12-16 | 株式会社村田製作所 | Piezoelectric device |
CN111711900B (en) * | 2020-07-09 | 2021-12-10 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
EP3937512A1 (en) * | 2020-07-10 | 2022-01-12 | Infineon Technologies AG | Method and structure for sensors on glass |
US11951512B2 (en) | 2021-03-31 | 2024-04-09 | Exo Imaging, Inc. | Imaging devices having piezoelectric transceivers with harmonic characteristics |
US11819881B2 (en) | 2021-03-31 | 2023-11-21 | Exo Imaging, Inc. | Imaging devices having piezoelectric transceivers with harmonic characteristics |
WO2022217402A1 (en) * | 2021-04-12 | 2022-10-20 | 诺思(天津)微***有限责任公司 | Mems loudspeaker and manufacturing method therefor, and electronic device |
US11843915B2 (en) * | 2021-08-20 | 2023-12-12 | Massachusetts Institute Of Technology | Active piezoelectric sheet with piezoelectric microstructures |
CN113794967A (en) * | 2021-10-28 | 2021-12-14 | 业成科技(成都)有限公司 | Speaker and electronic device |
Family Cites Families (114)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1514818A1 (en) | 1951-01-28 | 1969-05-08 | Telefunken Patent | Solid-state circuit, consisting of a semiconductor body with inserted active components and an insulating layer with applied passive components and conductor tracks |
US3343256A (en) | 1964-12-28 | 1967-09-26 | Ibm | Methods of making thru-connections in semiconductor wafers |
US3372070A (en) | 1965-07-30 | 1968-03-05 | Bell Telephone Labor Inc | Fabrication of semiconductor integrated devices with a pn junction running through the wafer |
US3648131A (en) | 1969-11-07 | 1972-03-07 | Ibm | Hourglass-shaped conductive connection through semiconductor structures |
US3849679A (en) * | 1970-02-12 | 1974-11-19 | Dynamics Corp Massa Div | Electroacoustic transducer with controlled beam pattern |
US4283649A (en) * | 1978-09-21 | 1981-08-11 | Murata Manufacturing Co., Ltd. | Piezoelectric ultrasonic transducer with resonator laminate |
US4258468A (en) | 1978-12-14 | 1981-03-31 | Western Electric Company, Inc. | Forming vias through multilayer circuit boards |
JPS5642499A (en) * | 1979-05-15 | 1981-04-20 | Nippon Ceramic Kk | Ultrasonic-wave transducer |
JPS57166800A (en) * | 1981-04-07 | 1982-10-14 | Nippon Soken Inc | Ultrasonic wave transmitter and receiver |
US4458170A (en) * | 1981-12-08 | 1984-07-03 | Matsushita Electric Industrial Co., Ltd. | Ultrasonic transmitter-receiver |
US4475014A (en) * | 1982-09-13 | 1984-10-02 | Harman-Motive Inc. | Acoustical transducer |
US4461930A (en) * | 1982-09-23 | 1984-07-24 | Pioneer Speaker Components, Inc. | Acoustic transducer with honeycomb diaphragm |
US4445978A (en) | 1983-03-09 | 1984-05-01 | Rca Corporation | Method for fabricating via connectors through semiconductor wafers |
FR2565033B1 (en) | 1984-05-22 | 1987-06-05 | Labo Electronique Physique | ULTRASONIC TRANSDUCTION DEVICE WITH PIEZOELECTRIC TRANSDUCER ARRAY |
US4754440A (en) * | 1985-12-27 | 1988-06-28 | Aisin Seiki Kabushikikaisha | Ultrasonic transducer |
US4850227A (en) | 1987-12-22 | 1989-07-25 | Delco Electronics Corporation | Pressure sensor and method of fabrication thereof |
US5166097A (en) | 1990-11-26 | 1992-11-24 | The Boeing Company | Silicon wafers containing conductive feedthroughs |
US5295395A (en) | 1991-02-07 | 1994-03-22 | Hocker G Benjamin | Diaphragm-based-sensors |
US5422190A (en) | 1993-01-22 | 1995-06-06 | Ferro Corporation | Via fill paste and method of using the same containing specific amounts of silver, gold and refractory oxides |
US5569958A (en) | 1994-05-26 | 1996-10-29 | Cts Corporation | Electrically conductive, hermetic vias and their use in high temperature chip packages |
US5511428A (en) | 1994-06-10 | 1996-04-30 | Massachusetts Institute Of Technology | Backside contact of sensor microstructures |
US5841099A (en) | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
JPH08265816A (en) * | 1995-03-24 | 1996-10-11 | Sony Corp | Character editor and pager |
US5798302A (en) | 1996-02-28 | 1998-08-25 | Micron Technology, Inc. | Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers |
EP0810676B1 (en) | 1996-05-27 | 2002-08-28 | Ngk Insulators, Ltd. | Piezoelectric film-type element |
US6114240A (en) | 1997-12-18 | 2000-09-05 | Micron Technology, Inc. | Method for fabricating semiconductor components using focused laser beam |
JP3860336B2 (en) | 1998-04-28 | 2006-12-20 | 日本特殊陶業株式会社 | Glass ceramic composite |
US6280641B1 (en) | 1998-06-02 | 2001-08-28 | Mitsubishi Gas Chemical Company, Inc. | Printed wiring board having highly reliably via hole and process for forming via hole |
US6076726A (en) | 1998-07-01 | 2000-06-20 | International Business Machines Corporation | Pad-on-via assembly technique |
JP2000124764A (en) | 1998-10-20 | 2000-04-28 | Ngk Spark Plug Co Ltd | Strip-shaped piezoelectric resonator for frequency filter |
US6346742B1 (en) | 1998-11-12 | 2002-02-12 | Maxim Integrated Products, Inc. | Chip-scale packaged pressure sensor |
US6351996B1 (en) | 1998-11-12 | 2002-03-05 | Maxim Integrated Products, Inc. | Hermetic packaging for semiconductor pressure sensors |
US7208725B2 (en) | 1998-11-25 | 2007-04-24 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with encapsulant |
US6229190B1 (en) | 1998-12-18 | 2001-05-08 | Maxim Integrated Products, Inc. | Compensated semiconductor pressure sensor |
US6255728B1 (en) | 1999-01-15 | 2001-07-03 | Maxim Integrated Products, Inc. | Rigid encapsulation package for semiconductor devices |
JP2000217195A (en) * | 1999-01-22 | 2000-08-04 | Aiphone Co Ltd | Speaker |
US6268660B1 (en) | 1999-03-05 | 2001-07-31 | International Business Machines Corporation | Silicon packaging with through wafer interconnects |
US6221769B1 (en) | 1999-03-05 | 2001-04-24 | International Business Machines Corporation | Method for integrated circuit power and electrical connections via through-wafer interconnects |
JP2001024248A (en) | 1999-07-07 | 2001-01-26 | Samsung Electro Mech Co Ltd | Multi-layered piezoelectric/electrostrictive ceramic actuator and manufacture thereof by low-temperature baking |
WO2001008128A1 (en) | 1999-07-22 | 2001-02-01 | Seiko Epson Corporation | Electro-optical device, method of manufacture thereof, and electronic device |
WO2001022776A1 (en) | 1999-09-21 | 2001-03-29 | University Of Hawaii | Method of forming parylene-diaphragm piezoelectric acoustic transducers |
US6400009B1 (en) | 1999-10-15 | 2002-06-04 | Lucent Technologies Inc. | Hermatic firewall for MEMS packaging in flip-chip bonded geometry |
KR100413789B1 (en) | 1999-11-01 | 2003-12-31 | 삼성전자주식회사 | High vacuum packaging microgyroscope and manufacturing method thereof |
US6147397A (en) | 1999-12-28 | 2000-11-14 | Maxim Integrated Products | Stress isolated integrated circuit and method for making |
US7151837B2 (en) * | 2000-01-27 | 2006-12-19 | New Transducers Limited | Loudspeaker |
US6423905B1 (en) | 2000-05-01 | 2002-07-23 | International Business Machines Corporation | Printed wiring board with improved plated through hole fatigue life |
TW535465B (en) | 2000-05-15 | 2003-06-01 | Hitachi Aic Inc | Electronic component device and method of manufacturing the same |
BE1013592A3 (en) | 2000-07-11 | 2002-04-02 | Sonitron Nv | Transducer. |
JP4363801B2 (en) * | 2000-08-29 | 2009-11-11 | 富士彦 小林 | Piezoelectric speaker |
US6589594B1 (en) | 2000-08-31 | 2003-07-08 | Micron Technology, Inc. | Method for filling a wafer through-via with a conductive material |
US8103024B2 (en) * | 2000-09-20 | 2012-01-24 | Harman Becker Automotive Systems Gmbh | Door with structural components configured to radiate acoustic energy |
US6977224B2 (en) | 2000-12-28 | 2005-12-20 | Intel Corporation | Method of electroless introduction of interconnect structures |
US6429527B1 (en) | 2001-01-17 | 2002-08-06 | International Business Corporation | Method and article for filling apertures in a high performance electronic substrate |
US20020130589A1 (en) | 2001-01-29 | 2002-09-19 | Hiroshi Hamada | Piezoelectric vibrator, piezoelectric vibration apparatus for using the same and manufacturing method therefor |
US7435613B2 (en) | 2001-02-12 | 2008-10-14 | Agere Systems Inc. | Methods of fabricating a membrane with improved mechanical integrity |
US6912078B2 (en) | 2001-03-16 | 2005-06-28 | Corning Incorporated | Electrostatically actuated micro-electro-mechanical devices and method of manufacture |
US6910268B2 (en) | 2001-03-27 | 2005-06-28 | Formfactor, Inc. | Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via |
US20020196952A1 (en) * | 2001-06-25 | 2002-12-26 | Merry Electronics Co., Ltd. | Piezoelectric transceiver |
WO2003007370A1 (en) | 2001-07-12 | 2003-01-23 | Hitachi, Ltd. | Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor |
US7003125B2 (en) | 2001-09-12 | 2006-02-21 | Seung-Hwan Yi | Micromachined piezoelectric microspeaker and fabricating method thereof |
US6559530B2 (en) | 2001-09-19 | 2003-05-06 | Raytheon Company | Method of integrating MEMS device with low-resistivity silicon substrates |
JP3998984B2 (en) | 2002-01-18 | 2007-10-31 | 富士通株式会社 | Circuit board and manufacturing method thereof |
JP2003226551A (en) | 2002-02-05 | 2003-08-12 | Nippon Sheet Glass Co Ltd | Glass substrate having fine pore and production method therefor |
FI114825B (en) | 2002-02-13 | 2004-12-31 | Vti Technologies Oy | Method for reducing the temperature dependence of a capacitive sensor and the design of a capacitive sensor |
US7029829B2 (en) | 2002-04-18 | 2006-04-18 | The Regents Of The University Of Michigan | Low temperature method for forming a microcavity on a substrate and article having same |
US7217588B2 (en) | 2005-01-05 | 2007-05-15 | Sharp Laboratories Of America, Inc. | Integrated MEMS packaging |
JP3925414B2 (en) | 2002-04-26 | 2007-06-06 | 株式会社村田製作所 | Piezoelectric electroacoustic transducer |
US6953985B2 (en) | 2002-06-12 | 2005-10-11 | Freescale Semiconductor, Inc. | Wafer level MEMS packaging |
US6829937B2 (en) | 2002-06-17 | 2004-12-14 | Vti Holding Oy | Monolithic silicon acceleration sensor |
US6964882B2 (en) | 2002-09-27 | 2005-11-15 | Analog Devices, Inc. | Fabricating complex micro-electromechanical systems using a flip bonding technique |
SG111972A1 (en) | 2002-10-17 | 2005-06-29 | Agency Science Tech & Res | Wafer-level package for micro-electro-mechanical systems |
US7098117B2 (en) | 2002-10-18 | 2006-08-29 | The Regents Of The University Of Michigan | Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices |
BE1015150A3 (en) * | 2002-10-21 | 2004-10-05 | Sonitron Nv | Improved transducer |
KR100444588B1 (en) | 2002-11-12 | 2004-08-16 | 삼성전자주식회사 | Fabrication of via hole for glass wafer |
JP4133429B2 (en) | 2003-02-24 | 2008-08-13 | 浜松ホトニクス株式会社 | Semiconductor device |
US6836020B2 (en) | 2003-01-22 | 2004-12-28 | The Board Of Trustees Of The Leland Stanford Junior University | Electrical through wafer interconnects |
US6888233B2 (en) | 2003-03-10 | 2005-05-03 | Honeywell International Inc. | Systems for buried electrical feedthroughs in a glass-silicon MEMS process |
US6777263B1 (en) | 2003-08-21 | 2004-08-17 | Agilent Technologies, Inc. | Film deposition to enhance sealing yield of microcap wafer-level package with vias |
US7275424B2 (en) | 2003-09-08 | 2007-10-02 | Analog Devices, Inc. | Wafer level capped sensor |
KR100565799B1 (en) | 2003-12-22 | 2006-03-29 | 삼성전자주식회사 | Duplexer fabricated with monolithic FBAR and Isolation part and the method thereof |
KR100622372B1 (en) | 2004-06-01 | 2006-09-19 | 삼성전자주식회사 | Gyro-sensor comprising plural component unit, and fabricating method thereof |
KR100786156B1 (en) | 2004-07-06 | 2007-12-18 | 동경 엘렉트론 주식회사 | Interposer and interposer producing method |
US7184202B2 (en) | 2004-09-27 | 2007-02-27 | Idc, Llc | Method and system for packaging a MEMS device |
US7668415B2 (en) * | 2004-09-27 | 2010-02-23 | Qualcomm Mems Technologies, Inc. | Method and device for providing electronic circuitry on a backplate |
US7791434B2 (en) | 2004-12-22 | 2010-09-07 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric |
KR100661350B1 (en) | 2004-12-27 | 2006-12-27 | 삼성전자주식회사 | Mems devices package and method for manufacturing thereof |
JP2006270770A (en) | 2005-03-25 | 2006-10-05 | Sanyo Electric Co Ltd | Thin film bulk wave element and high frequency device |
US20080212807A1 (en) * | 2005-06-08 | 2008-09-04 | General Mems Corporation | Micromachined Acoustic Transducers |
FI119299B (en) | 2005-06-17 | 2008-09-30 | Vti Technologies Oy | Method for manufacturing a capacitive accelerometer and a capacitive accelerometer |
JP4435049B2 (en) | 2005-08-08 | 2010-03-17 | 株式会社東芝 | Thin film piezoelectric resonator and manufacturing method thereof |
JP2007181087A (en) | 2005-12-28 | 2007-07-12 | Toshiba Corp | Thin film piezoelectric resonator and filter circuit |
JP5021216B2 (en) | 2006-02-22 | 2012-09-05 | イビデン株式会社 | Printed wiring board and manufacturing method thereof |
JP2007335977A (en) | 2006-06-12 | 2007-12-27 | Toshiba Corp | Electron device |
US20080006850A1 (en) | 2006-07-10 | 2008-01-10 | Innovative Micro Technology | System and method for forming through wafer vias using reverse pulse plating |
US7736946B2 (en) | 2007-02-07 | 2010-06-15 | Honeywell International Inc. | System and method for sealing a MEMS device |
JP2008199266A (en) * | 2007-02-13 | 2008-08-28 | Murata Mfg Co Ltd | Electroacoustic transducer |
US7569421B2 (en) | 2007-05-04 | 2009-08-04 | Stats Chippac, Ltd. | Through-hole via on saw streets |
KR100931575B1 (en) | 2007-12-07 | 2009-12-14 | 한국전자통신연구원 | Piezoelectric element micro speaker using MEMS and its manufacturing method |
KR100931578B1 (en) | 2007-12-18 | 2009-12-14 | 한국전자통신연구원 | Piezoelectric element microphone, speaker, microphone-speaker integrated device and manufacturing method thereof |
JP2009260723A (en) * | 2008-04-17 | 2009-11-05 | Asahi Kasei Electronics Co Ltd | Transducer |
US7591185B1 (en) | 2008-04-23 | 2009-09-22 | Medtronic, Inc. | Pressure sensor configurations for implantable medical electrical leads |
US7697281B2 (en) * | 2008-09-05 | 2010-04-13 | Apple Inc. | Handheld computing device |
US20100068453A1 (en) | 2008-09-18 | 2010-03-18 | Hirofumi Imai | Method for producing processed glass substrate |
KR101562339B1 (en) * | 2008-09-25 | 2015-10-22 | 삼성전자 주식회사 | Piezoelectric microspeaker and its fabrication method |
KR101545271B1 (en) * | 2008-12-19 | 2015-08-19 | 삼성전자주식회사 | Piezoelectric acoustic transducer and method for fabricating the same |
US8280080B2 (en) * | 2009-04-28 | 2012-10-02 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Microcap acoustic transducer device |
WO2010137242A1 (en) * | 2009-05-25 | 2010-12-02 | パナソニック株式会社 | Piezoelectric acoustic transducer |
US8322225B2 (en) | 2009-07-10 | 2012-12-04 | Honeywell International Inc. | Sensor package assembly having an unconstrained sense die |
KR101561660B1 (en) * | 2009-09-16 | 2015-10-21 | 삼성전자주식회사 | Piezoelectric micro speaker having annular ring-shape vibrating membrane and method of manufacturing the same |
KR101573517B1 (en) * | 2009-10-12 | 2015-12-02 | 삼성전자주식회사 | Piezoelectric micro speaker |
US8659611B2 (en) | 2010-03-17 | 2014-02-25 | Qualcomm Mems Technologies, Inc. | System and method for frame buffer storage and retrieval in alternating orientations |
US8492957B2 (en) * | 2010-03-23 | 2013-07-23 | Kohji Toda | Apparatus for generating electric energy |
KR20140005289A (en) * | 2011-02-15 | 2014-01-14 | 후지필름 디마틱스, 인크. | Piezoelectric transducers using micro-dome arrays |
US8811636B2 (en) | 2011-11-29 | 2014-08-19 | Qualcomm Mems Technologies, Inc. | Microspeaker with piezoelectric, metal and dielectric membrane |
-
2011
- 2011-11-29 US US13/306,397 patent/US8811636B2/en active Active
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2012
- 2012-11-28 JP JP2014544851A patent/JP6099663B2/en active Active
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KR101885180B1 (en) | 2018-08-03 |
US20170125660A1 (en) | 2017-05-04 |
CN103959818B (en) | 2018-12-14 |
US10735865B2 (en) | 2020-08-04 |
KR20140098836A (en) | 2014-08-08 |
US10003888B2 (en) | 2018-06-19 |
CN103959818A (en) | 2014-07-30 |
US20130136280A1 (en) | 2013-05-30 |
US20140328504A1 (en) | 2014-11-06 |
HUE037612T2 (en) | 2018-09-28 |
JP2015507388A (en) | 2015-03-05 |
EP2786595B1 (en) | 2017-09-27 |
EP2786595A1 (en) | 2014-10-08 |
WO2013082169A1 (en) | 2013-06-06 |
US8811636B2 (en) | 2014-08-19 |
JP6099663B2 (en) | 2017-03-22 |
ES2652036T3 (en) | 2018-01-31 |
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