JP6085758B2 - 薄膜トランジスタ及び薄膜トランジスタの製造方法 - Google Patents
薄膜トランジスタ及び薄膜トランジスタの製造方法 Download PDFInfo
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- JP6085758B2 JP6085758B2 JP2013546111A JP2013546111A JP6085758B2 JP 6085758 B2 JP6085758 B2 JP 6085758B2 JP 2013546111 A JP2013546111 A JP 2013546111A JP 2013546111 A JP2013546111 A JP 2013546111A JP 6085758 B2 JP6085758 B2 JP 6085758B2
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
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- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B44/00—Circuit arrangements for operating electroluminescent light sources
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- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/60—Circuit arrangements for operating LEDs comprising organic material, e.g. for operating organic light-emitting diodes [OLED] or polymer light-emitting diodes [PLED]
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
Description
以下、本発明の実施の形態に係る薄膜トランジスタ及びその製造方法について、図面を参照しながら説明する。なお、以下で説明する実施の形態は、いずれも本発明の好ましい一具体例を示すものである。したがって、以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置位置および接続形態、ステップ、ステップの順序などは、一例であって本発明を限定する主旨ではない。よって、以下の実施の形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、本発明の課題を達成するのに必ずしも必要ではないが、より好ましい形態を構成するものとして説明される。
次に、本発明の実施の形態の変形例に係る薄膜トランジスタ10Aについて、図12を用いて説明する。図12は、本発明の実施の形態の変形例に係る薄膜トランジスタの構成を模式的に示した図であり、(a)は(b)のA−A’線の断面図、(b)は透過平面図である。
以上、本発明に係る薄膜トランジスタ及び薄膜トランジスタの製造方法について、実施の形態及び変形例に基づいて説明したが、本発明は上記の実施の形態及び変形例に限定されるものではない。
2、31G、32G ゲート電極
3 ゲート絶縁層
4 結晶質シリコン半導体層
4F 結晶質シリコン半導体膜
5 非晶質シリコン半導体層
5F 非晶質シリコン半導体膜
6、6A 保護層
6a 変質層
7 コンタクト層
7F コンタクト層用膜
8S、31S、32S ソース電極
8D、31D、32D ドレイン電極
8F ソースドレイン金属膜
9 パッシベーション層
10、10A、100 薄膜トランジスタ
20 有機EL表示装置
21 アクティブマトリクス基板
22 画素
23 有機EL素子
24 陽極
25 有機EL層
26 陰極
27 ゲート線
28 ソース線
29 電源線
31 駆動トランジスタ
32 スイッチングトランジスタ
33 コンデンサ
40 半導体層
40F 半導体膜
61 非変質層
62 改質層
Claims (18)
- 基板を準備する工程と、
前記基板上にゲート電極を形成する工程と、
前記ゲート電極上にゲート絶縁層を形成する工程と、
前記ゲート絶縁層上に半導体膜を形成する工程と、
前記半導体膜上に有機材料を含むエッチストッパ層を形成する工程と、
前記エッチストッパ層上に少なくとも一部が位置するように、ソース電極及びドレイン電極を互いに対向配置して形成する工程と、
前記半導体膜をドライエッチングして、区画された半導体層を形成する工程と、
前記ソース電極及び前記ドレイン電極から露出した前記エッチストッパ層の表面層が前記ドライエッチングにより変質した層であって少なくとも一部が前記半導体層の表面と接する層である変質層に対して、水素雰囲気下でプラズマ処理を行う工程と、を含む、
薄膜トランジスタの製造方法。 - 前記変質層の密度は、前記エッチストッパ層のうち前記ドライエッチングにより変質しなかった部分の密度よりも高い、
請求項1に記載の薄膜トランジスタの製造方法。 - 前記変質層は、膜厚が30nm以上である、
請求項1又は2に記載の薄膜トランジスタの製造方法。 - 前記変質層に含まれる塩素の濃度は、前記エッチストッパ層に含まれる塩素の濃度の少なくとも10倍以上である、
請求項1〜3のいずれか一項に記載の薄膜トランジスタの製造方法。 - 前記変質層に含まれる炭素の濃度は、前記エッチストッパ層に含まれる炭素の濃度の少なくとも1/100以下である、
請求項1〜4のいずれか一項に記載の薄膜トランジスタの製造方法。 - 前記変質層に対して行う前記プラズマ処理を行う工程において、前記プラズマ処理は、平行平板電極型の高周波プラズマ装置を用いて行う、
請求項1〜5のいずれか一項に記載の薄膜トランジスタの製造方法。 - 前記変質層に対して前記プラズマ処理を行う工程において、プラズマを発生させるときの前記基板の設定温度は、280℃以上350℃以下である、
請求項6に記載の薄膜トランジスタの製造方法。 - 前記変質層に対して前記プラズマ処理を行う工程において、プラズマを発生させるときの前記平行平板電極の間隔は、500mm以上600mm以下である、
請求項6又は7に記載の薄膜トランジスタの製造方法。 - 前記半導体膜は、シリコン膜である、
請求項1〜8のいずれか一項に記載の薄膜トランジスタの製造方法。 - さらに、前記エッチストッパ層を形成する工程の前に、第1のプラズマ処理として前記半導体膜に対して水素雰囲気下でプラズマ処理を行う工程を含み、
第2のプラズマ処理として前記変質層に対する前記プラズマ処理を行う、
請求項9に記載の薄膜トランジスタの製造方法。 - 前記第2のプラズマ処理において発生させるプラズマの強さは、前記第1のプラズマ処理において発生させるプラズマの強さよりも小さい、
請求項10に記載の薄膜トランジスタの製造方法。 - 前記第1のプラズマ処理及び前記第2のプラズマ処理は、平行平板電極型の高周波プラズマ装置を用いて行い、
前記第2のプラズマ処理を行う際の前記平行平板電極の間隔は、前記第1のプラズマ処理を行う際の前記平行平板電極の間隔よりも長い、
請求項11に記載の薄膜トランジスタの製造方法。 - 前記第1のプラズマ処理を行う工程は、前記シリコン膜におけるシリコン元素のダングリングボンドを水素終端する工程であり、
前記第2のプラズマ処理を行う工程は、前記エッチストッパ層において前記変質層の部分と前記変質層以外の部分との固定電荷量が等しくなるように前記変質層を改質する工程である、
請求項10〜12のいずれか一項に記載の薄膜トランジスタの製造方法。 - 前記半導体膜は、酸化物半導体膜である、
請求項1〜8のいずれか一項に記載の薄膜トランジスタの製造方法。 - 基板上に位置するゲート電極と、
前記ゲート電極上に位置するゲート絶縁層と、
前記ゲート絶縁層を間に介して、前記ゲート電極と対向する半導体層と、
前記半導体層上に位置する、有機材料を含むエッチストッパ層と、
互いに対向して配置され、前記エッチストッパ層上に少なくとも一部が位置するソース電極及びドレイン電極と、を有し、
前記エッチストッパ層は、前記ソース電極及び前記ドレイン電極から露出した前記エッチストッパ層の表面領域であって少なくとも一部が前記半導体層の表面と接する領域に、前記エッチストッパ層の材料が変質した変質層が改質された改質層を有し、
前記変質層は、前記エッチングストッパ層の材料と前記半導体層を区画するときのドライエッチングの原料ガスとが結びついた層であり、
前記改質層は、前記変質層よりも固定電荷量が低減された層である、
薄膜トランジスタ。 - 前記改質層は、膜厚が30nm以上である、
請求項15に記載の薄膜トランジスタ。 - 前記改質層に含まれる塩素の濃度は、前記エッチストッパ層に含まれる塩素の濃度の少なくとも10倍以上である、
請求項15又は16に記載の薄膜トランジスタ。 - 前記改質層に含まれる炭素の濃度は、前記エッチストッパ層に含まれる炭素の濃度の少なくとも1/100以下である、
請求項15〜17のいずれか一項に記載の薄膜トランジスタ。
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